Brands

Huntsman accelerators are commonly used in combination with ARALDITE® epoxy resins, ARADUR® hardeners and JEFFAMINE® polyetheramines to accelerate the reaction rate of epoxy thermoset systems. Properly used accelerators can be an integral part of fine-tuning the reactivity of slower reacting resin formulations and can also serve to beneficially influence properties such as glass transition temperature (Tg), modulus, strength, elongation at break, and chemical resistance.

ARADUR® curing agents are supplied in liquid or solid form and can be used in conjunction with ARALDITE® epoxy resins to achieve a broad range of thermal, mechanical and electrical properties. This complete line of high-performance curing agents includes reactive polyamides, polyamido amines, aliphatic amines, cycloaliphatic amines, aromatic amines, anhydrides and novolacs.

The ARALDITE® brand encompasses high-performance epoxy, acrylic, and polyurethane adhesives and high-performance specialty epoxy and benzoxazine resin systems. ARALDITE® adhesives cover a broad range of applications and offer both production and performance benefits to industrial, consumer and construction markets. ARALDITE® specialty thermoset resins are supplied in liquids or solids, and in a range of viscosities, functionalities and epoxy equivalent weights for a wide range of industrial applications, while ARALDITE® specialty epoxy resins are typically based on bisphenol-A, bisphenol-F, phenol novolacs, cresol novolacs, amino phenol, methylene dianiline, cycloaliphatics, and isocyanuric acid.

ARA® Cool curing agents open new opportunities to formulate industrial coatings with very fast cure, even in cold conditions. The launch of the new ARA® Cool range enables Huntsman to meet demands for faster processing at low temperatures, as well as reduced VOC emissions. ARA® Cool products produce coatings with low blush, chemical resistance and excellent film aesthetics. These products can be formulated with a variety of Huntsman ARALDITE® resins.

CAPCURE® mercaptan curing agents are notable for their hardness development and rapid cure speed, along with an extensive range of properties. These mercaptan curing agents deliver an exceptional bond strength to glass, concrete, metal, and wood. In addition, they are ideal for many consumer adhesives and industrial products and are frequently utilized to accelerate a variety of epoxy curing agents as well as amines, polyamides, and amidoamines.

DALTOCAST® is an advanced portfolio of polyurethane-based, hot-cast, engineering elastomers, which includes a full range of polyols and chain extenders. Over the years we’ve blended these raw materials together in different combinations - creating a suite of tried and tested elastomer formulations that we market as our MPC, MDE, MPT, SWP, WRP, V-TER product families. Proven to perform, these standard elastomer products are easy to process and provide good chemical resistance and excellent mechanical characteristics. Often, these off-the-shelf solutions will satisfy our customers’ needs. But if not, don't worry. We can work together to make you something unique.

DALTOFOAM® fully formulated polyol systems are used in a diverse range of rigid polyurethane foam insulation applications, including discontinuous panels, water heaters, cool boxes, reefers, refrigerated transport, commercial display units, one component foam and mining. DALTOFOAM® is also used in polyurethanes foam used to insulate and protect heating and plumbing services within large diameter pipe systems, including municipal/ district heating and offshore oil and gas pipelines.

Our DALTOPIR® fire-rated PIR insulation system has been optimized to meet stringent international fire safety requirements and satisfy the needs of composite panel producers worldwide. Panels based on our DALTOPIR® Insulation technology offer long-term durability and product quality.

Our DALTOPIR® range includes circular content across the portfolio.

DALTOPUR® polyurethane PUR insulation technology is developed to improve the manufacture and performance of composite sandwich panels offering systems across a variety of fire-ratings as well as systems with circular content.

With a reaction profile optimized to allow easy foam processing, our DALTOPUR® foam technology can give panel producers the flexibility to quickly and efficiently manufacture different panel types.

DALTOPUR® foam technology can deliver the required bottom adhesion and long-term durability required, without the use of a primer. Lambda values can be further improved through the choice of specific blowing agents.

We offer high-purity, low-trace metal E-GRADE® amines, including quaternary amines, amine oxides, and solvents for formulation into semiconductor chip manufacturing including formulated cleaning, etching, and stripping. Our E-GRADE® unit, located at our manufacturing site in Conroe, Texas, provides the global supply footprint, R&D expertise, and broad portfolio to help meet the stringent quality process standards of the semiconductor industry – from blending, purification through cleanroom packaging.

EPALLOY® specialty epoxy resins deliver improved performance in high-performance maintenance and marine coatings, adhesives, encapsulants and composites. These specialty epoxy resins provide better chemical resistance, thermal performance, modulus, cure speed and UV resistance than standard liquid epoxy resins.

ERISYS® epoxy functional reactive modifiers enhance performance, reduce viscosity, and improve handling and processing of epoxy formulations. Their benefits include enhanced flexibility and toughness, while maintaining chemical resistance and UV stability. Some of the products are high in bio-renewal content.

GABEPRO™ mercaptan-based epoxy curing agents are notable for their hardness development and rapid cure speed, along with an extensive range of properties. These mercaptan curing agents deliver an exceptional bond strength to glass, concrete, metal, and wood. In addition, they are ideal for many consumer adhesives, protective coatings and industrial products. They are frequently utilized to accelerate a variety of epoxy curing agents as well as amines, polyamides, and amidoamines.

HYPRO® Reactive Liquid Polymer is a low molecular weight synthetic rubber with chemical functionality. These reactive additives incorporate rubber properties into epoxies, acrylates, vinyl esters and polyesters. They improve the toughness and low-temperature properties in coatings, adhesives, sealants and composites. HYPRO® reactive liquid polymers are butadiene homo-polymers and butadiene-acrylonitrile copolymers with terminal functionality.

I-BOND® resins from Huntsman are powerful, formaldehyde-free and fast-curing resins for the composite wood panel industry. They are used for bonding: Oriented Strand Board (OSB), Medium Density Fiberboard (MDF), Particleboard (PB), and Wood Fiber Insulation Board (WFI). I-BOND® resins contain no added formaldehyde (NAF) and are considered "exempt" under the requirements of the California Air Resources Board (CARB) standards. Using I-BOND® resins classifies products as both CARB I and CARB II compliant. I-BOND® resins are also compliant with the European EPF-S standard, as well as the Japanese F**** (F 4 star) formaldehyde emission standard.