EPIBOND® 115 A/B

• Service temperature up to 300°F (149°C)
• High tensile shear strength on metal and composites substrates
• High bond-line thickness tolerance
• Good chemical and environmental resistance
• Gap-filling thixotropic paste
• 2:1 mix ratio by volume.
• Eliminates the need for mechanical fasteners, enabling lightweighting
• Highly toughened for enhanced vibration resistance
• Long out time to facilitate larger parts
• Can be used as a liquid shim (gap filling)
• Spacer beads create uniform bond line
• Maintains its mechanical properties in extreme temperature fluctuations
• The high shear and high peel strength enables the bonding of composite primary structures.

Pretreatment
Substrates to be bonded should be properly surface treated and be free from contaminants.

Mixing
Mix both components thoroughly for several minutes until a homogeneous mixture is obtained or dispense from a 400 mL. For 400 mL cartridges, use a Static mixer 10.13mm diameter x 18 element spiral mixing nozzle (INFINITY MIX MCH-10-18T) or equivalent.

Under normal temperature conditions according to the standard mix ratio this material has a working time of approximately 120 - 180 minutes.

Mix Ratio

Application

The mixed adhesive should be spread with a spatula to the suitably pretreated dry joint surfaces. A layer of adhesive 0.004 to 0.012 inches (0.1 to 0.3 mm) thick will normally provide the maximum lap shear strength. This adhesive, however, has been designed to be effective in layers up to 0.12 in. (3 mm). Components to be bonded should be assembled and clamped as soon as the adhesive has been applied. Even contact pressure throughout the joint area during cure will ensure optimum performance

Processing Data

"

Measured by lap shear strength on composite substates at room temperature psi. The cure schedule was 1 hour at 150°F (65°C) plus 5 hours at 200°F (93°C).

The following Lapshear properties were determined on a substrate of phosphoric acid anodized and primed aluminum. The cure schedule was 1 hour at 150°F (65°C) plus 5 hours at 200°F (93°C).

Measured by lap shear strength on composite substates at room temperature psi. The cure schedule was 1 hour at 150°F (65°C) plus 5 hours at 200°F (93°C).

EPIBOND® 115 A/B should be stored in a dry place in its original sealed container at a temperature between 2°C and 40°C (36°F and 104°F). Tightly reseal containers after each use. Under these storage conditions, the product has a shelf-life of 12 months (from date of manufacture). The components should not be exposed to direct sunlight.