Products

ARADUR® HY 921 belongs to the anhydrides chemical family and is compatible with epoxies (EP). It is designed for various applications, enhancing the performance and properties of epoxy-based formulations in industrial processes.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® CY 220-1 / ARALDITE® CY 221 / ARADUR® HY 905 / ACCELERATOR DY 061 are casting systems for processing at room temperature or slightly higher temperatures and curing at high temperatures. They are used for encapsulating, potting, or impregnating low voltage and electronic components.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® CY 8767 / ARADUR® HY 8767-1 is a battery potting system designed for use in sealed acid and storage batteries, ideal for terminal lead potting and housing sealing.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® F / ARALDITE® CY 208 / HARDENER HY 956 is a casting system for processing and curing at room temperature or slightly higher temperatures

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® F / ARALDITE® CY 221 / ARADUR® HY 905 / ARADUR® HY 920 / ACCELERATOR DY 062 / Fillers is casting resin systems for processing and curing at elevated temperature High filler addition possibility, if required

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® F / ARALDITE® CY 221 / HARDENER HY 842 is casting systems for processing and curing at room temperature or slightly higher temperatures

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® GY 2600 / ARADUR® HY 956 is casting systems for processing and curing at room temperature or slightly higher temperatures. Low initial viscosity. High filler addition possibility.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® MY 740 / HARDENER HY 956 / HARDENER HY 1473 is a Casting system for processing and curing at room temperature or slightly higher temperatures with Low initial viscosity and High filler addition possibility.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® MY 757 / HARDENER HY 2918 / ACCELERATOR DY 062 is a casting system for multi-purpose processing at room temperature or slightly higher temperatures. Curing at high temperatures. By the addition of accelerator DY 062, the casting resin system may be optimally adjusted to particular applications. It is used in Encapsulating or potting low voltage and electronic components.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARATHANE® 5814 IS / ARATHANE® 5814 PO is a flame and UV-resistant two-component polyurethane system designed for the casting and potting of electrical components. Typical applications for this system include potting transformers and pressure-sensitive devices. This system can be used in applications for either outdoor or indoor service and for bushing-type current transformers.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ERISYS® GE 24 Polyglycol Diglycidyl Ether is the diepoxide of an aliphatic polyglycol. Its low viscosity, relatively high equivalent weight, and aliphatic structure suggest use as a diluent and/or flexibilizer in high-viscosity, brittle epoxy formulations. As a diluent, ERISYS® GE 24 Polyglycol Diglycidyl Ether lowers viscosity for improved substrate wetting and/or higher filler loading. As a flexibilizer, it improves elongation, peel strength, resistance to thermal cycling, and impact. Depending on the concentration, the final formulation may experience some decrease in chemical and/or heat resistance.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ERISYS® GE 25 Diluent, epoxidized 1,6-Hexanediol, is a low-viscosity, aliphatic diepoxide. It is intended for use as a reactive diluent for high-viscosity epoxy resins. ERISYS® GE 25 Diluent is compatible at all concentrations with the resins and resin/diluent blends, and can be cured using any epoxy resin curing agent.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

OMICURE® DDA 10 is a micronized dicyandiamide curing agent for epoxy resins, with a mean particle size of 12 μm and 2% silica as an anticaking aid. It remains stable until activated by heat (350 °F), offering over six months of storage stability. When catalyzed, it enables one-component adhesive and sealant formulas with cure temperatures of 225-250 °F. Its fine particle size ensures good dispersion, uniform curing, and excellent adhesion. Compatible with all epoxy resins and various fillers, OMICURE® DDA 10 is safe, non-toxic, and ideal for adhesive formulations.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

OMICURE® DDA 5 CI EX is an ultra-micronized grade of Dicyandiamide, a solid latent curing agent for epoxy resins. OMICURE® DDA 5 CI EX, like other grades of Dicy, is dispersed into a resin system where it remains stable until activated by heat. Without an accelerator, such as a substituted urea, dicyandiamide has an activation temperature of about 175°C and a formulated storage stability of over six months. When catalyzed with a latent accelerator, like one of the OMICURE® U series of substituted ureas, one component adhesive and sealant formulas can be prepared with cure temperatures of 100- 120°C and excellent stability. The ultra-fine particle size of OMICURE DDA 5 CI EX will help to aid good dispersion, prevent settling, maximize reactivity, promote uniform cure to formulated systems, and avoid issues of ‘hot spots’. Epoxy systems cured with OMICURE® DDA 5 CI EX are characterized by outstanding adhesion making it a preferred choice for adhesive formulations. OMICURE® DDA 5 CI EX is compatible with all epoxy resins, including Bisphenol A and F epoxies and epoxy novolacs, can be used with diluted or undiluted resins, and is compatible with a wide variety of fillers and pigments. OMICURE® DDA 5 CI EX is safe to handle and is considered non-toxic.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

OMICURE® U 24 M is an aromatic substituted urea used as a latent ACCELERATOR for the dicyandiamide cure of epoxy resins. It reduces the time and temperature required for curing one-component products. Compared to other substituted ureas, toluene bis dimethyl urea offers the greatest acceleration while having minimal impact on cured properties. Suggested use levels are and lt;5 phr, with curing times of about 50 minutes at 100°C and under 3 minutes at temperatures and gt;150°C. It provides a room temperature shelf life of over 3 months when used with DGEBA/DICY. Storage stability improves when insoluble ingredients are used. OMICURE® U 24M can be incorporated with dicy in formulations.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.