Products

Huntsman

6 Products found on Huntsman  in Initiators, Promotors & Catalysts

OMICURE® U 24 M banner
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HuntsmanOMICURE® U 24 M
  • Functions:Accelerator, Accelerator, Catalyst
  • Chemical Name:3,3'-(4-Methyl-1,3-phenylene)bis(1,1-dimethylurea)
  • Chemical Family:Urea & Urea Derivatives
  • CAS Number:17526-94-2
  • End Uses:1K (1 Component) Adhesive, Encapsulant, Film Adhesives, Potting Compound, Powder Coating
  • Compatible Polymers & Resins:Epoxies (EP)
  • Processing Methods:Prepreg Processing

OMICURE® U 24 M is an aromatic substituted urea used as a latent ACCELERATOR for the dicyandiamide cure of epoxy resins. It reduces the time and temperature required for curing one-component products. Compared to other substituted ureas, toluene bis dimethyl urea offers the greatest acceleration while having minimal impact on cured properties. Suggested use levels are and lt;5 phr, with curing times of about 50 minutes at 100°C and under 3 minutes at temperatures and gt;150°C. It provides a room temperature shelf life of over 3 months when used with DGEBA/DICY. Storage stability improves when insoluble ingredients are used. OMICURE® U 24M can be incorporated with dicy in formulations.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

OMICURE® U 405 M banner
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HuntsmanOMICURE® U 405 M
  • Functions:Accelerator, Accelerator
  • Chemical Name:Fenuron
  • Chemical Family:Phenylureas
  • CAS Number:101-42-8
  • End Uses:1K (1 Component) Adhesive, Encapsulant, Film Adhesives, Potting Compound, Powder Coating, Pre-pregs
  • Compatible Polymers & Resins:Epoxies (EP)

OMICURE® U-405, an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. The addition of OMICURE® U-405 to these formulations produces shelf-stable one-part products that cure in shorter times and/or at lower temperatures. OMICURE® U-405M represents the micronized grade of OMICURE® U-405. OMICURE® U-405 is most similar in structure to monuron and diuron. However, OMICURE® U-405 does not contain any chlorine and is, therefore, safer to use than monuron or diuron. When substituting OMICURE® U-405 for either of these products, the formulator should use approximately 30%-50% less 94 to achieve similar degrees of acceleration. Suggested use levels of OMICURE U-405 are <5 phr. At 100 °C, cures can be obtained in about one hour and in less than four minutes at temperatures at 150 °C. Cure times are dependent on the composition of the formulated product and your end application. Some of the factors that can affect shelf life are formulation ingredients and compounding parameters. Ingredients in which OMICURE® U-405 is insoluble at processing and storage temperatures will enhance overall storage stability. OMICURE® U-405 can be incorporated into your formulation concurrent with the DICY addition.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

OMICURE® U 52 M banner
Huntsman company logo
HuntsmanOMICURE® U 52 M
  • Functions:Accelerator, Accelerator, Accelerator
  • Chemical Name:4,4'-Methylene Bis-Phenyldimethyl Urea
  • Chemical Family:Urea & Urea Derivatives
  • CAS Number:10097-09-3, 7631-86-9
  • End Uses:1K (1 Component) Adhesive, Encapsulant, Film Adhesives, Potting Compound, Powder Coating, Pre-pregs
  • Compatible Polymers & Resins:Epoxies (EP)
  • Processing Methods:Prepreg Processing

OMICURE® U 52M, an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide (DICY) cure of epoxy resins. OMICURE® U 52M represents the micronized grade of OMICURE® U 52. Suggested use levels of OMICURE® U 52/OMICURE® U 52M in DGEBA/DICY are ≤ 5 phr. At 5 phr, curing can be accomplished in about one hour at 100°C and in less than five minutes at temperatures ≥ 150°C. Room temperature shelf lives (doubling of viscosity) are longer than six months. Cure times and shelf lives depend on the composition of the formulated product and the end application. Some of the factors that can affect shelf life include formulation ingredients and compounding parameters. Ingredients in which OMICURE® U 52/OMICURE® U 52M are insoluble at processing and storage temperatures will enhance overall storage stability.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.