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Huntsman

Adhesives & Sealants
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Functional Adhesives
Functional Adhesives
Bonding Technology
Bonding Technology
Functional Adhesives
Functional Adhesives
Bonding Technology
Bonding Technology

5 Products found on Huntsman  in Adhesives & Sealants

EPIBOND® 215 A/B banner
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HuntsmanEPIBOND® 215 A/B
  • RTU Product Type:2K (2 component) Adhesive, Epoxy Adhesive, Structural Adhesive
  • Application Area:Aerospace Applications, Aircraft, Space Shuttle, Spacecraft
  • Compatible Substrates & Surfaces:Composites, Metal
  • Application Method:Spatula
  • Chemical Family:Epoxy & Epoxy Derivatives
  • Features:Balanced Shear Performance, Fast Handling Strength, Good Compressive Strength, Good Gap Filling Capabilities, Good Peel Properties, Good Retention of Properties, High Peel Strength, High Shear, High Strength, Low Outgassing, Room Temperature Curing, Thixotropic, Wide Temperature Operating Range
EPIBOND® 215 A/B Adhesive is an extrudable, two-component, room temperature-curing epoxy structural adhesive designed for service temperatures up to 300°F (149°C). This adhesive is suitable for bonding a wide variety of materials such as metals, composites, and many other dissimilar substrates. The combination of high peel strength and high shear makes this adhesive well suited for aerospace and other demanding applications. EPIBOND® 215 A/B structural adhesive can replace up to five competitive adhesives and is 75% lighter than mechanical fasteners.
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EPIBOND® 315 A/B banner
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HuntsmanEPIBOND® 315 A/B
  • RTU Product Type:2K (2 component) Adhesive, Epoxy Adhesive, Structural Adhesive
  • Application Area:Aerospace Applications, Aircraft, Honeycomb Composites, Space Shuttle, Spacecraft
  • Compatible Substrates & Surfaces:Composites, Metal
  • Chemical Family:Epoxy & Epoxy Derivatives
  • Features:Ease Of Use, Excellent Aging Resistance, Fast Cure, Good Compressive Strength, Good Environmental Resistance, Heat Resistance, High Lap Shear Strength, High Service Temperature, Low Maintenance, Low Outgassing, Room Temperature Curing
EPIBOND® 315 A/B Adhesive is an extrudable, two-component, room-temperature curing epoxy adhesive designed for service temperatures up to 400°F (204°C). This product is suitable for bonding a wide variety of materials, such as metals, composites, and many other dissimilar substrates. The combination of high shear strength and compression makes this adhesive well-suited for aerospace applications and composites requiring a liquid shim. EPIBOND® 315 A/B offers rapid strength build-up with an easy-to-process mix ratio.
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EPIBOND® 315M A/B banner
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HuntsmanEPIBOND® 315M A/B
  • RTU Product Type:2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive, Structural Adhesive
  • Application Area:Electrostatic Application, Satellite, Space Mission Applications, Space Shuttle, Spacecraft
  • Compatible Substrates & Surfaces:Composites, Metal
  • Chemical Family:Epoxy & Epoxy Derivatives
  • Features:Electrically Conductive, Good Compressive Strength, High Lap Shear Strength, Low Outgassing, Room Temperature Curing
EPIBOND® 315M A/B is a two-component epoxy adhesive that contains MIRALON® carbon nanotube pulp for decreased electrical resistance for ESD applications. This product is suitable for bonding a wide variety of materials such as metals, composites, and other dissimilar substrates.
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EPIBOND® 420 A/B banner
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HuntsmanEPIBOND® 420 A/B
  • RTU Product Type:2K (2 component) Adhesive, Epoxy Adhesive, Structural Adhesive
  • Application Area:Aerospace Applications, Composite Panel, Honeycomb Composites, Honeycomb Structures, Space Shuttle, Spacecraft
  • Compatible Substrates & Surfaces:Composites, Metal
  • Features:Excellent Shear Strength, Good Toughness, High Peel Strength, High Strength, Resilient, Room Temperature Curing
EPIBOND® 420-A/B Epoxy Adhesive is a two-component, modified epoxy, room-temperature curing paste with high strength and toughness. It is suitable for a wide variety of metal, honeycomb, and fiber-reinforced composite bonding applications requiring high shear strength and good peel strength. EPIBOND® 420 A/B contains 5 mil (125 µm) spacer beads to provide the very uniform bond line required in high-stress areas. EPIBOND® 420 A/B structural epoxy adhesive replaces REDUX 410 NA epoxy adhesive and meets the requirements of BMS 5-107.
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EPOCAST® 1610-A1 banner
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HuntsmanEPOCAST® 1610-A1
  • RTU Product Type:1K (1 component) Adhesive, Syntactic Adhesive, Void Filler
  • Application Area:Honeycomb Panel, Insert Potting Application, Space Shuttle, Spacecraft
  • Features:Flame Retardant, Long Shelf Life, Low Density, Self Extinguishing
EPOCAST® 1610-A1 epoxy syntactic is a very low-density, self-extinguishing, one-part compound with a long storage life at room temperature. It can be co-cured with composites at 250°F (121°C) and is ideal for replacing foam or wood blocks in honeycomb panels, offering high strength and no mark-off after curing.
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