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Huntsman

Matching Product Technologies (4)

20 Products found on Huntsman

EPALLOY® 8250 banner
Huntsman company logo
HuntsmanEPALLOY® 8250
  • Chemical Family:Epoxy & Epoxy Derivatives
  • End Uses:Chemical-Resistant Coatings, Conductive Adhesive, Encapsulant, Film Adhesives, Floor Coatings, Laminating Adhesive
  • Processing Methods:Laminating, Prepreg Processing
  • Features:Chemical Resistance, High Solid Content, Low Viscosity, Non Crystallizing

EPALLOY® 8250 CI exhibits a very low room temperature viscosity. Close process control produces a resin significantly lower in viscosity than other commercially available epoxy novolacs of similar functionality. EPALLOY® 8250 CI combines low hydrolyzable chlorides with good reactivity. It is non-crystallizing and compatible with all standard curatives and most epoxy resin systems and solvents. Because of its low viscosity, EPALLOY® 8250 CI is an excellent resin for formulating 100% solids coatings and trowelable flooring. Those formulations will cure at room temperature and provide chemical resistance to concentrated acids and aggressive solvents. EPALLOY® 8250 CI is also the preferred resin for use in electronic encapsulation, laminating and film adhesives.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

HYPOX® RA 840 banner
Huntsman company logo
HuntsmanHYPOX® RA 840
  • Functions:Binder & Resin, Molding Compound, Resins, Binders & Matrix Materials, Thermocycling Modifier, Toughener, Toughener
  • Chemical Family:Epoxy & Epoxy Derivatives
  • End Uses:Chemical-Resistant Coatings, Structural Adhesive
  • Processing Methods:Potting
  • Features:Excellent Flexibility, Fatigue Resistance, Peel Resistance, Thermal Shock Resistance

HYPOX® RA840 is a high-viscosity adduct of the diglycidyl ether of bisphenol A (DGEBA) and a butadiene-acrylonitrile (CTBN) elastomer. The elastomer improves the toughness and impact, thermal shock and peel resistance of the epoxy formulation. These improvements are attained with little loss of thermal resistance and modulus. HYPOX® RA840 adduct is suggested for use as a toughener in fiber-reinforced products, adhesives, molding compounds, potting and encapsulating compounds and chemical-resistant coatings. HYPOX® RA840 adduct can be blended with other bis-A epoxy resins to achieve the degree of toughening required.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

HYPOX® RM 20 banner
Huntsman company logo
HuntsmanHYPOX® RM 20
  • Functions:Molding Compound, Thermocycling Modifier, Toughener, Toughener
  • Chemical Family:Epoxy & Epoxy Derivatives
  • End Uses:Chemical-Resistant Coatings, Impact Resistant Coating, Pre-pregs, Structural Adhesive
  • Processing Methods:Filament Winding
  • Features:Crack Resistance, Low Viscosity, Peel Resistance, Thermal Shock Resistance

HYPOX® RM20 is an adduct of CTBN with epoxidized neopentyl glycol. Compared to standard epoxy resin/CTBN adducts, this product has a lower viscosity coupled with a high rubber content and is intended for use in combination with standard epoxy resins when the end-use application requires toughening and lower viscosity. HYPOX® RM20 adduct will increase flexibility, crack resistance, fatigue resistance, peel resistance, and adhesive properties. It will also improve the cathodic disbondment property when used in coating formulations for underground buried pipes in oil and gas transport applications.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

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