Products

Huntsman

Matching Product Technologies (3)

13 Products found on Huntsman

ARALDITE® GY 282 banner
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HuntsmanARALDITE® GY 282
  • Chemical Family:Epoxy & Epoxy Derivatives
  • Functions:Binder & Resin
  • End Uses:Composite Materials, Floor Screeds, Flooring, Trowelling Compound
  • Compatible Substrates & Surfaces:Metal, Mineral Substrate
  • Applicable Processes:Construction Applications
  • Glass Transition Temperature (Tg)::133.0~147.0
  • Features:Chemical Resistance, Chemical Resistance, Excellent Storage Stability, Good Mechanical Properties, High Mechanical Properties, Low Viscosity, Low Viscosity

ARALDITE® GY 282, used alone or blended with bisphenol A or bisphenol A/F epoxy resins in combination with polyamine hardeners, is recommended for solvent-free coatings, impregnations, floorings, and trowelling compounds applied to steel and concrete substrates. Additionally, when combined with aromatic diamines, GY 282 is suitable for advanced composite applications manufactured via RTM and filament winding.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® GY 285 banner
Huntsman company logo
HuntsmanARALDITE® GY 285
  • Chemical Family:Epoxy & Epoxy Derivatives
  • Functions:Binder & Resin, Resins, Binders & Matrix Materials
  • End Uses:Composite Materials, Flooring, Trowelling Compound
  • Compatible Substrates & Surfaces:Metal, Mineral Substrate
  • Processing Methods:Casting, Filament Winding, Pultrusion, Resin Transfer Molding (RTM)
  • Applicable Processes:Construction Applications, Impregnation
  • Features:Chemical Resistance, Crystallization Resistance, High Reactivity, Low Viscosity

ARALDITE® GY 285, alone or blended with epoxy resins based on bisphenol A or bisphenol A/F in combination with polyamine hardeners, is recommended for solvent-free coatings, impregnations, floorings, and trowelling compounds applied to steel and concrete substrates. Also, when combined with aromatic diamines, GY 285 is suitable for advanced composite applications manufactured through RTM filament winding. The reactivity of formulations based on ARALDITE® GY 285 is similar to that of unmodified bisphenol A epoxy resins. The chemical resistance of systems based on ARALDITE® GY 285 is comparable to that of liquid bisphenol A epoxy resins and significantly better than that of resins modified with reactive diluents. Under adverse storage conditions, ARALDITE® GY 285 may crystallize, but this can be reversed by heating the resin to 40°C while stirring. ARALDITE® GY 285 is miscible in all proportions with other epoxy resins, and the addition of at least 25% bisphenol A epoxy resin or epoxy phenol novolac will practically eliminate the tendency to crystallize. ARALDITE® GY 285 is sanctioned by FDA 175.300 CFR for contact with food.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® MY 720 banner
Huntsman company logo
HuntsmanARALDITE® MY 720
  • Chemical Family:Epoxy & Epoxy Derivatives
  • Functions:Binder & Resin
  • End Uses:Composite Materials, Laminates, Laminating Adhesive, Structural Adhesive, Structural Components
  • Compatible Substrates & Surfaces:Composites
  • Features:Chemical Resistance, Heat Resistance, High Performance, High Temperature Performance, High Temperature Resistance, Increased Mechanical Strength, Low Shrinkage, Medium Viscosity, Radiation Resistance

ARALDITE® MY 720 is a tetrafunctional epoxy resin suitable for high-performance composite applications. Cured at 120°C (250°F) to 175°C (350°F), Araldite® MY 720 provides outstanding performance characteristics at elevated temperatures. When post-cured at 200°C (400°F), the system exhibits properties exceeding 220°C (430°F). Araldite® MY 720 systems can display Tgs.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

PHENOXY™ PKFE banner
Huntsman company logo
HuntsmanPHENOXY™ PKFE
  • Chemical Family:Phenoxy Compounds
  • Functions:Binder & Resin, Resin, Resins, Binders & Matrix Materials
  • End Uses:1K (1 component) Coating, Composite Materials, Electronics, Epoxy Coating, Thermoset Coating
  • Compatible Substrates & Surfaces:Aluminum, Carbon Fiber, Glass, Metal, Nylon, Polyethylene Terephthalate (PET), Steel
  • Features:Amorphous, Chemical Resistance, Excellent Adhesive Strength, Excellent Ductility, Good Hardness, Good Toughness, Thermal Stability

PHENOXY™ PKFE is a high-viscosity phenoxy resin known for its toughness, ductility, and excellent thermal stability, adhesive strength, and vapor barrier properties. It can be crosslinked with isocyanates, melamine, or phenolic resins for enhanced chemical resistance, hardness, and adhesion to substrates like steel, aluminum, glass, carbon fibers, and plastics. It can be used in single-pack epoxies with latent hardeners like dicyandiamide to improve toughness and adhesion. PHENOXY™ PKFE is soluble in polar, aprotic solvents like MEK, cyclohexanone, and glycol ethers.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

PHENOXY™ PKHA banner
Huntsman company logo
HuntsmanPHENOXY™ PKHA
  • Chemical Family:Phenoxy Compounds
  • Functions:Binder & Resin, Resin, Resins, Binders & Matrix Materials
  • End Uses:1K (1 component) Coating, Composite Materials, Electronics, Epoxy Coating, Thermoset Coating
  • Compatible Substrates & Surfaces:Aluminum, Carbon Fiber, Glass, Metal, Nylon, Polyethylene Terephthalate (PET), Steel
  • Features:Amorphous, Chemical Resistance, Excellent Adhesive Strength, Excellent Ductility, Good Hardness, Good Toughness, Thermal Stability

PHENOXY™ PKHA is a low-viscosity phenoxy resin known for its toughness, ductility, and excellent thermal stability, adhesive strength, and vapor barrier properties. It can be crosslinked with isocyanates, melamine, or phenolic resins to enhance chemical resistance, hardness, and adhesion on substrates such as steel, aluminum, glass, carbon fibers, and plastics like nylon and PET. PHENOXY™ PKHA can also be used in single-pack epoxies with latent hardeners like dicyandiamide for improved toughness and adhesion. It is soluble in many polar, aprotic solvents like MEK, cyclohexanone, and glycol ethers.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

PHENOXY™ PKHB+ banner
Huntsman company logo
HuntsmanPHENOXY™ PKHB+
  • Chemical Family:Phenoxy Compounds
  • Functions:Binder & Resin, Resin, Resins, Binders & Matrix Materials
  • End Uses:1K (1 component) Coating, Composite Materials, Electronics, Epoxy Coating, Thermoset Coating
  • Compatible Substrates & Surfaces:Aluminum, Carbon Fiber, Glass, Metal, Nylon, Polyethylene Terephthalate (PET), Steel
  • Features:Amorphous, Chemical Resistance, Excellent Adhesive Strength, Excellent Ductility, Good Hardness, Good Toughness, Thermal Stability

PHENOXY™ PKHB+ is a low-viscosity phenoxy resin offering excellent thermal stability, adhesive strength, and vapor barrier properties. It can be crosslinked with isocyanates, melamine, or phenolic resins for enhanced chemical resistance and adhesion to materials like steel, aluminum, glass, and plastics. Used in single-pack epoxies with latent hardeners like dicyandiamide, it improves toughness and adhesion. Soluble in polar, aprotic solvents like MEK, cyclohexanone, and glycol ethers.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

PHENOXY™ PKHJ banner
Huntsman company logo
HuntsmanPHENOXY™ PKHJ
  • Chemical Family:Phenoxy Compounds
  • Functions:Binder & Resin, Resin, Resins, Binders & Matrix Materials
  • End Uses:1K (1 component) Coating, Composite Materials, Electronics, Epoxy Coating, Thermoset Coating
  • Compatible Substrates & Surfaces:Aluminum, Carbon Fiber, Glass, Metal, Nylon, Polyethylene Terephthalate (PET), Steel
  • Features:Amorphous, Chemical Resistance, Excellent Adhesive Strength, Excellent Ductility, Good Hardness, Good Toughness, Thermal Stability

PHENOXY™ PKHJ is a high-viscosity phenoxy resin known for its excellent thermal stability, adhesive strength, and vapor barrier properties. It can be crosslinked with isocyanates, melamine, or phenolic resins, offering strong chemical resistance, hardness, and adhesion to substrates like steel, aluminum, glass, carbon fibers, and plastics such as nylon and PET. PHENOXY™ PKHJ can be used in single-pack epoxies with latent hardeners like dicyandiamide to improve toughness and adhesion. It is soluble in polar, aprotic solvents like MEK, cyclohexanone, and glycol ethers.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

PHENOXY™ PKHP 80 banner
Huntsman company logo
HuntsmanPHENOXY™ PKHP 80
  • Chemical Family:Phenoxy Compounds
  • End Uses:1K (1 component) Coating, Composite Materials, Epoxy Coating
  • Features:Amorphous, Excellent Adhesive Strength, Excellent Ductility, Good Toughness, High Surface Area, Improves Cohesive Strength, Thermal Stability

PHENOXY™ PKHP 80 is a micronized powder-grade phenoxy resin with a particle size of approximately 70 microns. It offers excellent thermal stability, adhesion, cohesion strength, and vapor barrier properties. PHENOXY™ PKHP 80 integrates easily into liquid resins due to its high surface area, with recommended incorporation levels in epoxy resins ranging from 5% to 25%. When used with latent hardeners like dicyandiamide, it improves toughness and adhesion on substrates such as steel, aluminum, glass, carbon fibers, and plastics like nylon and PET.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

TACTIX® 556 banner
Huntsman company logo
HuntsmanTACTIX® 556
  • Chemical Family:Epoxy & Epoxy Derivatives
  • Functions:Binder & Resin
  • End Uses:Composite Materials
  • Compatible Substrates & Surfaces:Composites
  • Features:Good Moisture Resistance, Good Toughness, High Temperature Performance, Low Moisture Content, Low Polarity, Low Water Absorption

TACTIX® 556 is a low moisture, hydrocarbon epoxy novolac resin. These compounds have a dicyclopentadiene backbone with a low average molecular polarity, a feature critical to low moisture absorption. Indeed, the moisture absorption of TACTIX® 556 is considerably lower than that of typical phenolic novolacs such as ARALDITE® EPN 1139 and ARALDITE® EPN 1138 resins. TACTIX® 556 resin shows exceptional ability to retain properties under conditions of moisture and elevated temperature. Additionally, its outstanding properties come with no sacrifice to processability. Similar to Bis-A epoxy resin, TACTIX® 556 resin can be used with a variety of conventional hardeners to optimize specific properties. TACTIX® 556 resin is ideal for new uses where retention of properties under hot and wet conditions is critical.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.