Products

ARALDITE® MY 740 / HARDENER HY 1102 / ACCELERATOR DY 062 is a heat-cure, ready-to-use resin designed for switches and relays applications. It is ideal for bushings, coils, electrical laminates, rods, and tubes. The resin offers excellent aging resistance, good electrical properties, and good mechanical properties, ensuring reliable performance in electrical and electronic components.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® MY 790-1 / ARADUR® HY 1102 is a liquid, hot-curing impregnating system based on distilled Bis-A resin and anhydride hardener, with a long pot life, high glass transition temperature, and excellent electrical and mechanical properties.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® MY 790-1 / ARADUR® HY 1102 / ACCELERATOR DY 9577 / ACCELERATOR DY 073-1 is a liquid, hot-curing impregnating system based on distilled Bis-A resin and anhydride hardener with long pot-life, high glass transition temperature and excellent electrical and mechanical end properties.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

EPOCAST® 1614-A3 Epoxy Structural Syntactic Adhesive is a flame-retardant, low-density, frozen, one-component material used to reinforce honeycomb composite parts requiring high compressive strength at elevated temperatures up to 350°F (177°C). This material has been qualified to NTR-MS 1301A Ty II, CL IV, GR F, and RMS 027 Type XII specifications and meets the requirements of BMS5-28, Ty 14, CL 1 & 2, and other specifications. EPOCAST® 1614-A3 Epoxy Structural Syntactic Adhesive does not contain any SVHC (Substance of Very High Concern) as defined under REACH.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

EPOCAST® 1645 A/B is a two-component, ultra-low-density, flame-retardant epoxy void filler designed for edge filling/reinforcing of honeycomb structures used in aerospace interior applications. Both Epocast® 1645 FR A and B are non-sticky, very soft pastes which can be easily mixed and applied manually and are water-cleanable after application. EPOCAST® 1645 A/B sets quickly at room temperature and is sandable shortly after application. It is well-suited for aerospace applications requiring low density, high strength, and rapid component assembly.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

EX 6240 / EX 6241 HARDENER is a liquid, heat-curing, two-component epoxy casting system containing fillers. This system is fusible to make excellent crack-resistant parts that can be used for the manufacturing of electrical bushings or dry-type transformers. The resin system can be processed by automatic pressure gelation (APG) or conventional encapsulation, such as gravity casting under vacuum. It is used in Dry-type transformers, Electrical bushings, and Electrical encapsulation.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

OMICURE® DDA 10 is a micronized dicyandiamide curing agent for epoxy resins, with a mean particle size of 12 μm and 2% silica as an anticaking aid. It remains stable until activated by heat (350 °F), offering over six months of storage stability. When catalyzed, it enables one-component adhesive and sealant formulas with cure temperatures of 225-250 °F. Its fine particle size ensures good dispersion, uniform curing, and excellent adhesion. Compatible with all epoxy resins and various fillers, OMICURE® DDA 10 is safe, non-toxic, and ideal for adhesive formulations.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

PROBIMER® 77-7179 / 7180 is a photoimageable, negative-working solder mask optimized for flood screen print application. Probimer 77 7179/7180 Solder Mask exhibits a semi-matte surface and offers high process flexibility and excellent small hole developability with a high aspect ratio. It is developed in an aqueous alkaline solution.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

PROBIMER® 88-91101 / HARDENER 88-99101 is a high-temperature resistant solder mask, featuring an alkaline developable two-component system, suitable for screen printing applications.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

PROBIMER® 88-92101 / HARDENER 88-99001 is a photoimageable, negative-working solder mask optimized for flood screen print application. The solder mask exhibits a semi-matte surface and has high temperature resistance. Probimer 88 92101 is halogen-free and meets the requirements of the JPCA standard. It is developed in aqueous alkaline solution.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

RenLam® LY 120 is a low-viscosity epoxy resin Ren® HY 99 is a cycloaliphatic polyamine

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

URALANE® 5776-A/B polyurethane adhesive is a two-part system designed for bonding metals and aluminum as well as plastic substrates including phenolics, epoxies, polyesters, and many thermoplastics. URALANE® 5776-A/B polyurethane adhesive has a semi-paste consistency for easy handling and spreading. The adhesive’s long work-life facilitates assembly of large parts. Bonded assemblies can be cured at room temperature in 5-7 days or accelerated with heat cure and, once cured, exhibit high peel strength.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.