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Huntsman

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16 Products found on Huntsman

ARALDITE® MT 35600 banner
Huntsman company logo
HuntsmanARALDITE® MT 35600
  • Chemical Family:Epoxy & Epoxy Derivatives
  • Polymer Name:Benzoxazine
  • Product End Uses:Laminates, Printed Circuit Board (PCB), Structural Adhesive
  • Material Compatibility:Phenolic Epoxy Resin Polymers
  • Processing & Application Methods:Encapsulation, Prepreg Processing, Pressure Molding, Pultrusion, Resin Transfer Molding (RTM)
  • Glass Transition Temperature (Tg):160.0 - 180.0 °C
  • Product Features:Dimensional Stability, Excellent Thermal Properties, Good Electrical Properties, Good Mechanical Properties, High Modulus, High Performance, High Temperature Resistance, Improved Dimensional Stability, Low Water Absorption

ARALDITE® MT 35600 is a bisphenol-A-based benzoxazine thermoset resin that can be homopolymerized or co-reacted with epoxy or phenol resins, resulting in polymers with excellent thermal and mechanical properties.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® MT 35700 banner
Huntsman company logo
HuntsmanARALDITE® MT 35700
  • Chemical Family:Epoxy & Epoxy Derivatives
  • Polymer Name:Benzoxazine, Bisphenol-F Epoxy Resin
  • Product End Uses:Laminates, Printed Circuit Board (PCB), Structural Adhesive
  • Material Compatibility:Phenolic Epoxy Resin Polymers
  • Processing & Application Methods:Encapsulation, Prepreg Processing, Pressure Molding, Pultrusion, Resin Transfer Molding (RTM)
  • Glass Transition Temperature (Tg):145.0 - 170.0 °C
  • Product Features:Chemical Resistance, Dimensional Stability, Excellent Chemical Resistance, Excellent Thermal Properties, Flame Resistance, Good Flammability Resistance, Good Mechanical Properties, High Modulus, High Performance, High Temperature Resistance, Improved Dimensional Stability, Low Water Absorption

ARALDITE® MT 35700 is a bisphenol-F-based benzoxazine thermoset resin that can be homopolymerized or co-reacted with epoxy or phenol resins, resulting in polymers with excellent thermal and mechanical properties. The chemical structure is shown below.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

EPALLOY® 8250 banner
Huntsman company logo
HuntsmanEPALLOY® 8250
  • Chemical Family:Epoxy & Epoxy Derivatives
  • Product End Uses:Chemical-Resistant Coatings, Conductive Adhesive, Encapsulant, Film Adhesives, Floor Coatings, Laminating Adhesive
  • Processing & Application Methods:Lamination, Prepreg Processing
  • Product Features:Chemical Resistance, Excellent Chemical Resistance, High Solid Content, Low Viscosity, Non-Crystallizing

EPALLOY® 8250 CI exhibits a very low room temperature viscosity. Close process control produces a resin significantly lower in viscosity than other commercially available epoxy novolacs of similar functionality. EPALLOY® 8250 CI combines low hydrolyzable chlorides with good reactivity. It is non-crystallizing and compatible with all standard curatives and most epoxy resin systems and solvents. Because of its low viscosity, EPALLOY® 8250 CI is an excellent resin for formulating 100% solids coatings and trowelable flooring. Those formulations will cure at room temperature and provide chemical resistance to concentrated acids and aggressive solvents. EPALLOY® 8250 CI is also the preferred resin for use in electronic encapsulation, laminating and film adhesives.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

OMICURE® U 24 M banner
Huntsman company logo
HuntsmanOMICURE® U 24 M
  • Product Functions:Accelerator, Catalyst
  • Chemical Name:3,3'-(4-Methyl-1,3-phenylene)bis(1,1-dimethylurea)
  • Chemical Family:Urea & Urea Derivatives
  • CAS Number:17526-94-2
  • Product End Uses:1K (1 Component) Adhesive, Encapsulant, Film Adhesives, Potting Compound, Powder Coating
  • Material Compatibility:Epoxy (EP) Polymers
  • Processing & Application Methods:Prepreg Processing

OMICURE® U 24 M is an aromatic substituted urea used as a latent ACCELERATOR for the dicyandiamide cure of epoxy resins. It reduces the time and temperature required for curing one-component products. Compared to other substituted ureas, toluene bis dimethyl urea offers the greatest acceleration while having minimal impact on cured properties. Suggested use levels are and lt;5 phr, with curing times of about 50 minutes at 100°C and under 3 minutes at temperatures and gt;150°C. It provides a room temperature shelf life of over 3 months when used with DGEBA/DICY. Storage stability improves when insoluble ingredients are used. OMICURE® U 24M can be incorporated with dicy in formulations.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

OMICURE® U 52 M banner
Huntsman company logo
HuntsmanOMICURE® U 52 M
  • Product Functions:Accelerator
  • Chemical Name:4,4'-Methylene Bis-Phenyldimethyl Urea
  • Chemical Family:Urea & Urea Derivatives
  • CAS Number:10097-09-3, 7631-86-9
  • Product End Uses:1K (1 Component) Adhesive, Encapsulant, Film Adhesives, Potting Compound, Powder Coating, Pre-pregs
  • Material Compatibility:Epoxy (EP) Polymers
  • Processing & Application Methods:Prepreg Processing

OMICURE® U 52M, an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide (DICY) cure of epoxy resins. OMICURE® U 52M represents the micronized grade of OMICURE® U 52. Suggested use levels of OMICURE® U 52/OMICURE® U 52M in DGEBA/DICY are ≤ 5 phr. At 5 phr, curing can be accomplished in about one hour at 100°C and in less than five minutes at temperatures ≥ 150°C. Room temperature shelf lives (doubling of viscosity) are longer than six months. Cure times and shelf lives depend on the composition of the formulated product and the end application. Some of the factors that can affect shelf life include formulation ingredients and compounding parameters. Ingredients in which OMICURE® U 52/OMICURE® U 52M are insoluble at processing and storage temperatures will enhance overall storage stability.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

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