Products

Huntsman

Matching Product Technologies (5)

32 Products found on Huntsman

AGOMET® F 305 A/B banner
Huntsman company logo
HuntsmanAGOMET® F 305 A/B
  • RTU Product Type:2K (2 component) Adhesive, Reactive Adhesive, Structural Adhesive
  • Product End Uses:Cables, Chipboards, Electrical Components, Loudspeaker Membranes, Printed Circuit Board (PCB), Transformers
  • Material Compatibility:Acrylonitrile Butadiene Styrene (ABS) Substrate, Aluminum Substrate, Cellulose Substrate, Copper Alloy Substrate, Copper Substrate, Ferrite Substrate, Metal Substrate, Papers, Plastics Substrate, Polycarbonate (PC) Substrate, Polyester Substrate, Polyphenylene Ether (PPE) Polymers, Polyphenylene Ether (PPE) Substrate, Polystyrene (PS) Substrate, Polyvinyl Chloride (PVC) Substrate, Steel Substrate, Wood Substrate
  • Chemical Family:Methacrylates
  • Product Features:Fast Curing, Fast Setting, Good Tensile Properties, Good Thermal Stability, High Peel Strength, Low Viscosity, Moisture Resistance, Room Temperature Curing

AGOMET® F 305 A/B is a low-viscosity, two-component, room-temperature curing, "no mix" methacrylate adhesive suitable for bonding metals and plastics. The high cure rate of this product at room temperature allows it to cure bonded parts in a short time. The adhesive has an assembly time of 1 - 2 minutes, and after 5 minutes, the bonded parts are cured and will reach their final cured strength within 24 hours. Bonds made with AGOMET® F 305 A/B exhibit excellent tensile shear strength, peel strength, as well as excellent moisture and heat resistance.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® AW 2101 / HARDENER HW 2951 banner
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HuntsmanARALDITE® AW 2101 / HARDENER HW 2951
  • RTU Product Type:2K (2 Component) Gap Filler, 2K (2 component) Adhesive, Structural Adhesive
  • Product End Uses:Printed Circuit Board (PCB)
  • Material Compatibility:Carbon Fiber Reinforced Plastic (CFRP) Substrate, Ceramic Substrate, Composite Substrate, Elastomer & Rubber Substrate, Glass Substrate, Glass-reinforced Plastic (GRP) Substrate, Metal Substrate, Plastics Substrate, Sheet Molding Compound (SMC) Substrate, Steel Substrate, Thermoplastic Substrate
  • Chemical Family:Epoxy & Epoxy Derivatives
  • Product Features:Easily Sandable, Excellent Strength, Fast Curing, Good Gap Filling Capabilities, High Toughness, Non-Sagging, Oil Resistance, Petrol Resistance, Room Temperature Curing, Thixotropic

ARALDITE® AW 2101 / HARDENER HW 2951 is a rapid cure, multipurpose, two-component, room temperature curing industrial paste adhesive of high strength and toughness. It is suitable for bonding a wide variety of metals, ceramics, glass, rubber, rigid plastics, and many other materials in common use.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® MT 35600 banner
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HuntsmanARALDITE® MT 35600
  • Chemical Family:Epoxy & Epoxy Derivatives
  • Polymer Name:Benzoxazine
  • Product End Uses:Laminates, Printed Circuit Board (PCB), Structural Adhesive
  • Material Compatibility:Phenolic Epoxy Resin Polymers
  • Processing & Application Methods:Encapsulation, Prepreg Processing, Pressure Molding, Pultrusion, Resin Transfer Molding (RTM)
  • Glass Transition Temperature (Tg):160.0 - 180.0 °C
  • Product Features:Dimensional Stability, Excellent Thermal Properties, Good Electrical Properties, Good Mechanical Properties, High Modulus, High Performance, High Temperature Resistance, Improved Dimensional Stability, Low Water Absorption

ARALDITE® MT 35600 is a bisphenol-A-based benzoxazine thermoset resin that can be homopolymerized or co-reacted with epoxy or phenol resins, resulting in polymers with excellent thermal and mechanical properties.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® MT 35700 banner
Huntsman company logo
HuntsmanARALDITE® MT 35700
  • Chemical Family:Epoxy & Epoxy Derivatives
  • Polymer Name:Benzoxazine, Bisphenol-F Epoxy Resin
  • Product End Uses:Laminates, Printed Circuit Board (PCB), Structural Adhesive
  • Material Compatibility:Phenolic Epoxy Resin Polymers
  • Processing & Application Methods:Encapsulation, Prepreg Processing, Pressure Molding, Pultrusion, Resin Transfer Molding (RTM)
  • Glass Transition Temperature (Tg):145.0 - 170.0 °C
  • Product Features:Chemical Resistance, Dimensional Stability, Excellent Chemical Resistance, Excellent Thermal Properties, Flame Resistance, Good Flammability Resistance, Good Mechanical Properties, High Modulus, High Performance, High Temperature Resistance, Improved Dimensional Stability, Low Water Absorption

ARALDITE® MT 35700 is a bisphenol-F-based benzoxazine thermoset resin that can be homopolymerized or co-reacted with epoxy or phenol resins, resulting in polymers with excellent thermal and mechanical properties. The chemical structure is shown below.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARATHANE® 5750 A/B (LV) banner
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HuntsmanARATHANE® 5750 A/B (LV)
  • RTU Product Type:2K (2 component) Coating Resin System
  • Product End Uses:Electronic Components, Printed Circuit Board (PCB), Protective Coatings, Spacecraft
  • Chemical Family:Polyurethanes (PU)
  • Product Features:Easy to Repair, Heat Resistance, Humidity Resistance, Low Modulus, Low Out-Gassing, Reversion Resistance, Soft, Translucent

ARATHANE® 5750 A/B (LV) Coating is a translucent, soft, repairable, two-component urethane system designed specifically for insulating printed circuit boards and electronic components. ARATHANE® 5750-A/B (LV) Coating exhibits excellent reversion resistance under heat and high humidity conditions. As a cured coating, this material displays very low outgassing properties, which are critical for applications in outer space and high vacuum environments. It can be used as a protective coating for printed wiring boards, and it has dip, spray, and spread applications.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

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