Products

ARALDITE® CT 2200 / ARADUR® HT 903 / Mineral Filler is a solid, hot-curing casting resin system for producing castings with good electrical and mechanical end-properties.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® CY 179-1 is a liquid cycloaliphatic epoxy resin with low viscosity for easy processing. The resin can be used with epoxy curatives to produce parts with high-temperature performance, low and stable dielectric properties, and superior arc, tracking, and UV resistance. This product is recommended for manufacturing high-voltage electrical components intended for use in aggressive outdoor environments.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® CY 221 / ARADUR® HY 956 is a low-viscosity, unfilled epoxy casting resin system that cures at room temperature. It allows high filler addition and is used for encapsulating or potting low voltage and electronic components.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® CY 5622 / ARADUR® HY 1235 / ACCELERATOR DY 062 / Filler Silica Flour (Silanized) is a liquid, hot-curing, cycloaliphatic epoxy resin system for outdoor applications in severe climatic conditions. It is used for outdoor electrical insulation material for medium and high voltage applications in humid conditions, such as apparatus components, pin/post insulators, bushings, instrument transformers, and sensors.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® CY 5897 / ARADUR® HY 5897 HARDENER is a two-part, liquid, thermosetting casting resin system based on epoxy and anhydride components, designed for medium and high voltage insulating components in APG applications. With a Tg above 105°C, it offers excellent thermal shock and crack resistance, superior electrical properties, and a high-quality appearance.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® DBF / ARADUR® HY 842 is a low-viscosity, unfilled epoxy casting resin system, curing at room temperature. High filler addition possibility.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARALDITE® MY 757 / ARALDITE® CY 223 / HARDENER HY 842 / HARDENER HY 956 / HARDENER HY 1473 is a casting system for processing and curing at room temperature or slightly higher temperatures. Low initial viscosity. High filler addition possibility. It is used in encapsulating or potting low voltage and electronic components.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.