8 Products found on Huntsman
ACCELERATOR DY 067 is a tertiary amine based ACCELERATOR for high temperature cure epoxy systems.
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ARALDITE® 2047-1 A/B is a cold curing two-part methacrylate adhesive for metal and plastic bonding. Depending on the method of processing, ARALDITE® 2047-1 A/B fills joints up to a gap width of approximately 5mm. With many bonds, an expensive pretreatment of the parts to be joined is not necessary, or can be reduced to a minimum. The adhesive can be processed at temperatures up to 40°C. Higher temperatures shorten the setting time.
E-GRADE® 1,3-dimethyl-2-imidazolidinone (E-GRADE® DMEU) is primarily used in stripping, cleaning, and wet etching formulations in the semiconductor, display, and PCB industries.
E-GRADE® 3-methyl-2-oxazolidinone (E-GRADE® MEOX) is primarily used in stripping, cleaning, and wet etching formulations in the semiconductor, display, and PCB industries.
EPIBOND® 115 A/B is an extrudable, two-component, heat-curing epoxy structural adhesive designed for service temperatures up to 300°F (149°C). This product is suitable for bonding a wide variety of materials, such as metals, composites, and other similar substrates. The combination of high strength and high Tg performance makes this adhesive well-suited for aerospace and other demanding applications. EPIBOND® 115 A/B contains 5 mil (125 micron) spacer beads to help provide a uniform bond line required in high-stress areas.
EPIBOND® 1210 A-1/9861 Epoxy Adhesive is a two-part paste that provides good properties at temperatures up to 300°F (149°C). This adhesive is ideal for spacecraft applications due to its low out-gassing properties. EPIBOND® 1210 A-1/9861 Epoxy Adhesive mixes to a semi-paste consistency and can be applied in glue lines of up to 50 mils for gap-filling applications. It bonds metals, composite laminates, most thermoplastics, rubbers, and many other dissimilar materials. The epoxy adhesive is also available in different working life versions—EPIBOND® 1210 A-1/B and EPIBOND® 1210 A-1/Hardener 9861.
EPIBOND® 215 A/B Adhesive is an extrudable, two-component, room temperature-curing epoxy structural adhesive designed for service temperatures up to 300°F (149°C). This adhesive is suitable for bonding a wide variety of materials such as metals, composites, and many other dissimilar substrates. The combination of high peel strength and high shear makes this adhesive well suited for aerospace and other demanding applications. EPIBOND® 215 A/B structural adhesive can replace up to five competitive adhesives and is 75% lighter than mechanical fasteners.
EPIBOND® 8000 A/B is an extrudable two-component epoxy structural adhesive designed for applications requiring FST properties or flame retardancy (FAR 25.853). This adhesive is suitable for bonding a wide variety of composite materials, metal, and other dissimilar substrates. EPIBOND® 8000 A/B does not contain any halogenated or antimony-based flame retardant additives. This adhesive has a convenient mix ratio, moderate work life, and is easily dispensed from cartridges or metering equipment.
