Products

ARALDITE® 2033 A/B is a room temperature curing, self-extinguishing epoxy adhesive. It has been tested against stringent norms for electronics and railway applications. This adhesive has well-balanced tensile properties: a medium modulus and a high elongation at break. It is suitable for structural applications requiring high strength.

ARALDITE® 5864 A/B Epoxy Adhesive is a two-component, thixotropic, room-temperature-curing paste. It offers high strength, toughness, and excellent environmental stability and chemical resistance. Ideal for bonding electronic components, GRP structures, and parts exposed to elevated temperatures or aggressive environments, this product is a UL® recognized system component in the 180°C class for electrical insulation systems.

ARALDITE® AV 138-2 / ARADUR® HW 5900 HARDENER is a two-component thixotropic epoxy adhesive that is suitable for metal bonding. The adhesive is designed for room-temperature curing and for bonding metals that may be exposed to high temperatures and/or harsh environments.

ARALDITE® CW 2245 / ARADUR® HY 177 is a flame-retardant, epoxy-based casting system for processing and curing at room temperature or slightly higher temperatures.

ARALDITE® CY 224 / ARADUR® HY 924 / Filler Silica is a heat-cure, ready-to-use resin designed for electrical and electronics applications, including switches and relays. It is ideal for electronic encapsulation, insulation, high and medium voltage insulation, and apparatus components. The resin offers excellent high-temperature properties, toughness, electrical and mechanical properties, a high glass transition temperature, and thermal shock resistance.

ARALDITE® CY 228-1 / ARADUR® HY 918-1 / FLEXIBILIZER DY 045 / ACCELERATOR DY 062 is a liquid, low-viscosity, hot-curing casting resin system based on Bisphenol A. Reactivity and flexibility can be adapted easily. It is used for indoor electrical insulators for medium and high voltage, such as switch parts, apparatus components, pin- and post-insulators, and bushings, as well as power distribution, current, and voltage transformers.

ARALDITE® CY 228-2 / ARADUR® HY 918-1 / FLEXIBILIZER DY 062 / Filler Silica Flour is a liquid, low-viscosity, hot-curing casting resin system based on Bisphenol A. Reactivity can be adapted by adjusting the accelerator amount. It is used for indoor electrical insulators for medium and high voltage, such as switch parts, apparatus components, pin- and post-insulators, and bushings.

ARALDITE® CY 30010 / ARADUR® HY 30011 is an impregnation system for electrical insulation. It is an ARALDITE HRI - Hydrolysis Resistant Impregnation System. It is a liquid, hot-curing, anhydride-free impregnation system used in coils, air core reactors, motors, and generators with medium and high power ratings.

ARATHANE® 5753 A/B (LV) Casting Compound is a translucent, amber, two-component polyurethane casting compound that, when cured, provides excellent electrical insulation to electrical/electronic parts. Arathane® 5753-A/B (LV) Casting Compound exhibits excellent reversion resistance under heat and high humidity conditions. As a cured system, this material meets NASA outgassing properties, which are critical for applications in outer space and high vacuum environments. Arathane® 5753-A/B (LV) Casting Compound is typically recommended for encapsulating coils, trimpots, potentiometers, and modules with complicated circuitry and/or stress-sensitive components.

ARATHANE® 5753-A/B (LV) is a translucent, amber, two-component polyurethane casting compound that, when cured, provides excellent electrical insulation to electrical/electronic parts. It exhibits excellent reversion resistance under heat and high humidity conditions. As a cured system, this material meets NASA outgassing properties critical for applications in outer space and high vacuum environments. It is typically recommended for encapsulating coils, trim pots, potentiometers, and modules with complicated circuitry and/or stress-sensitive components. It is used in Stress-sensitive components and non-terrestrial encapsulating applications.