Products

Huntsman

Matching Product Technologies (7)

232 Products found on Huntsman

ARATHANE® 5750 A/B (LV) banner
Huntsman company logo
HuntsmanARATHANE® 5750 A/B (LV)
  • RTU Product Type:2K (2 component) Coating Resin System
  • Product End Uses:Electronic Components, Printed Circuit Board (PCB), Protective Coatings, Spacecraft
  • Chemical Family:Polyurethanes (PU)
  • Product Features:Easy to Repair, Heat Resistance, Humidity Resistance, Low Modulus, Low Out-Gassing, Reversion Resistance, Soft, Translucent

ARATHANE® 5750 A/B (LV) Coating is a translucent, soft, repairable, two-component urethane system designed specifically for insulating printed circuit boards and electronic components. ARATHANE® 5750-A/B (LV) Coating exhibits excellent reversion resistance under heat and high humidity conditions. As a cured coating, this material displays very low outgassing properties, which are critical for applications in outer space and high vacuum environments. It can be used as a protective coating for printed wiring boards, and it has dip, spray, and spread applications.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARATHANE® 7760 banner
Huntsman company logo
HuntsmanARATHANE® 7760
  • RTU Product Type:1K (1 component) Adhesive, Thermal Adhesive
  • Product End Uses:1K (1 Component) Adhesive, Printed Circuit Board (PCB)
  • Chemical Family:Chemical Mixtures & Blends
  • Product Features:Easy Handling, Good Processability, Good Thermal Conductivity, Good Thermal Expansion, High Hydrolytic Stability, Non-slump, Thermal Shock Resistance, Thixotropic

ARATHANE® 7760 Adhesive is a single-component, solvent-free material specifically formulated as a thermal transfer adhesive (TTA). It features excellent thermal shock resistance and is highly thixotropic with non-slump characteristics. This combination of physical properties improves process control capabilities. ARATHANE® 7760 Adhesive is easy to handle and is well-suited for automatic dispensing in high-output applications. It can be used for bonding, filleting, and protecting components on printed wiring boards or in other applications where high thermal expansion mismatches are problematic.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARATHANE® 7760-1 banner
Huntsman company logo
HuntsmanARATHANE® 7760-1
  • RTU Product Type:1K (1 component) Adhesive
  • Product End Uses:Printed Circuit Board (PCB), Wire Bonding
  • Product Features:Easy Handling, Enhanced Physical Properties, Excellent Reliability, Good Thermal Conductivity, High Hydrolytic Stability, High Purity, Low Out-Gassing, Non-slump, Reworkability, Thermal Shock Resistance, Thixotropic

ARATHANE® 7760-1 Adhesive is a mercury-free, solvent-free, single-component material specifically formulated as a thermal transfer adhesive (TTA). It features excellent thermal shock resistance and is highly thixotropic with non-slump characteristics. This combination of physical properties improves process control capabilities. ARATHANE® 7760-1 Adhesive is easy to handle and is well suited for automatic dispensing used in high-output applications. It can be used for bonding, fileting, and protection of components on printed wiring boards or in other applications where high thermal expansion mismatches are problematic.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARATHANE® 7762-1 banner
Huntsman company logo
HuntsmanARATHANE® 7762-1
  • RTU Product Type:1K (1 component) Adhesive
  • Product End Uses:Printed Circuit Board (PCB), Wire Bonding
  • Product Features:Easy Handling, Enhanced Physical Properties, Excellent Reliability, Excellent Solderability, Good Thermal Conductivity, High Hydrolytic Stability, High Purity, Low Out-Gassing, Non-slump, Reworkability, Thermal Shock Resistance, Thixotropic

ARATHANE® 7762-1 Adhesive is a mercury-free, single-component polyurethane specifically formulated as a thermal transfer adhesive (TTA). It is designed to have high purity and very low outgassing characteristics. It features extremely good thermal shock resistance combined with excellent hydrolytic stability and resistance to solder processing temperatures and most common printed wiring board cleaning chemicals. ARATHANE® 7762-1 Adhesive can be automatically dispensed for high-output applications and reduced handling. This adhesive is a variant of the ARATHANE® 7760-1 product, designed to provide a controlled bond line thickness (5 mil). It is ideally suited for bonding “flat packs,” PLCCs, and other devices where control of bond line thickness is critical or desired. It can be used for bonding, fileting, and protection of components on printed wiring boards or in other applications where high thermal expansion mismatches are problematic.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

Epoxy Curing Agent ECA 29 banner
Huntsman company logo
HuntsmanEpoxy Curing Agent ECA 29
  • Product Functions:Curing Agent, Intermediate
  • Chemical Family:Epoxy & Epoxy Derivatives
  • Product End Uses:Composites, Industrial Castings, Sheets
  • Material Compatibility:Epoxy (EP) Polymers
  • Processing & Application Methods:Casting
  • Product Features:Fast Gelation Properties, High Glass Transition Temperature, High Reactivity, Long Pot Life

Epoxy Curing Agent ECA 29 is a mixture of aliphatic polyamines derived from ethylenediamine and has an AHEW (amine-hydrogen equivalent weight) in the range of 36-38. Consisting of higher oligomers of TETA (triethylenetetramine), Epoxy Curing Agent ECA 29 amine may be particularly useful as an epoxy curing agent in applications where higher Tg (glass transition temperature) and reasonably fast reactivity are needed with longer pot-life than DETA or TETA hardeners. As illustrated by the following figure, the increasingly fast gel times with standard bisphenol A based epoxies of the ethyleneamine series EDA (AHEW = 15.03), DETA (AHEW = 20.6), and TETA (AHEW = 24.4) are attributable to their increasing functionality and to them being aliphatic amines. For these three amines, the gel times shorten through the series, even though their AHEWs are increasing, which decreases the concentration of reactants in stoichiometric mixtures. As might be expected, the amines with higher AHEW, and therefore lower amine group concentrations in the formulations, have somewhat lower maximum exotherm temperatures. Epoxy Curing Agent ECA 29 amine follows this trend of having a slightly lower exotherm temperature, however it provides a longer working time until gelation than do the lower functionality amines DETA or TETA. This is attributed to the higher proportion of secondary amino groups in this product. The high functionality of this amine also increases the level of crosslinking in the fully cured epoxy, resulting in a relatively high Tg of 143°C.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

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