Products

Huntsman

Matching Product Technologies (6)

132 Products found on Huntsman

ARATHANE® 5750 A/B (LV) banner
Huntsman company logo
HuntsmanARATHANE® 5750 A/B (LV)
  • RTU Product Type:2K (2 component) Coating Resin System
  • Application Area:Electronic Components, Printed Circuit Boards, Spacecraft
  • Chemical Family:Polyurethanes (PU)
  • Features:Easy to Repair, Heat Resistance, Humidity Resistant, Low Modulus, Low Outgassing, Reversion Resistance, Soft, Translucent

ARATHANE® 5750 A/B (LV) Coating is a translucent, soft, repairable, two-component urethane system designed specifically for insulating printed circuit boards and electronic components. ARATHANE® 5750-A/B (LV) Coating exhibits excellent reversion resistance under heat and high humidity conditions. As a cured coating, this material displays very low outgassing properties, which are critical for applications in outer space and high vacuum environments. It can be used as a protective coating for printed wiring boards, and it has dip, spray, and spread applications.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARATHANE® 7760 banner
Huntsman company logo
HuntsmanARATHANE® 7760
  • RTU Product Type:1K (1 component) Adhesive, Thermal Adhesive
  • Application Area:Printed Circuit Boards
  • Chemical Family:Chemical Mixtures & Blends
  • Features:Ease of Handling, Good Process Control, Good Thermal Conductivity, Good Thermal Expansion, High Hydrolytic Stability, Non-slump, Thermal Shock Resistant, Thixotropic

ARATHANE® 7760 Adhesive is a single-component, solvent-free material specifically formulated as a thermal transfer adhesive (TTA). It features excellent thermal shock resistance and is highly thixotropic with non-slump characteristics. This combination of physical properties improves process control capabilities. ARATHANE® 7760 Adhesive is easy to handle and is well-suited for automatic dispensing in high-output applications. It can be used for bonding, filleting, and protecting components on printed wiring boards or in other applications where high thermal expansion mismatches are problematic.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARATHANE® 7760-1 banner
Huntsman company logo
HuntsmanARATHANE® 7760-1
  • RTU Product Type:1K (1 component) Adhesive
  • Application Area:Printed Circuit Boards, Wire Bonding
  • Features:Ease of Handling, Enhanced Physical Properties, Good Thermal Conductivity, High Hydrolytic Stability, High Purity, High Reliability, Low Outgassing, Non-slump, Reworkability, Thermal Shock Resistant, Thixotropic

ARATHANE® 7760-1 Adhesive is a mercury-free, solvent-free, single-component material specifically formulated as a thermal transfer adhesive (TTA). It features excellent thermal shock resistance and is highly thixotropic with non-slump characteristics. This combination of physical properties improves process control capabilities. ARATHANE® 7760-1 Adhesive is easy to handle and is well suited for automatic dispensing used in high-output applications. It can be used for bonding, fileting, and protection of components on printed wiring boards or in other applications where high thermal expansion mismatches are problematic.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

ARATHANE® 7762-1 banner
Huntsman company logo
HuntsmanARATHANE® 7762-1
  • RTU Product Type:1K (1 component) Adhesive
  • Application Area:Printed Circuit Boards, Wire Bonding
  • Features:Ease of Handling, Enhanced Physical Properties, Excellent Solderability, Good Thermal Conductivity, High Hydrolytic Stability, High Purity, High Reliability, Low Outgassing, Non-slump, Reworkability, Thermal Shock Resistant, Thixotropic

ARATHANE® 7762-1 Adhesive is a mercury-free, single-component polyurethane specifically formulated as a thermal transfer adhesive (TTA). It is designed to have high purity and very low outgassing characteristics. It features extremely good thermal shock resistance combined with excellent hydrolytic stability and resistance to solder processing temperatures and most common printed wiring board cleaning chemicals. ARATHANE® 7762-1 Adhesive can be automatically dispensed for high-output applications and reduced handling. This adhesive is a variant of the ARATHANE® 7760-1 product, designed to provide a controlled bond line thickness (5 mil). It is ideally suited for bonding “flat packs,” PLCCs, and other devices where control of bond line thickness is critical or desired. It can be used for bonding, fileting, and protection of components on printed wiring boards or in other applications where high thermal expansion mismatches are problematic.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

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