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I-BOND®
Applications:
Industrial, Cold-Chain & Insulation, Furniture
Chemical Family:
Isocyanates (MDI), Diisocyanates, Isocyanates
End Uses:
Panels, Fiberboards, Boots
Polymer Name:
Polyurethane (MDI-based)
Product Families:
Thermoset Resins, Plastics, Other Reinforcements
I-BOND® resins from Huntsman are powerful, formaldehyde-free and fast-curing resins for the composite wood panel industry. They are used for bonding: Oriented Strand Board (OSB), Medium Density Fiberboard (MDF), Particleboard (PB), and Wood Fiber Insulation Board (WFI). I-BOND® resins contain no added formaldehyde (NAF) and are considered "exempt" under the requirements of the California Air Resources Board (CARB) standards. Using I-BOND® resins classifies products as both CARB I and CARB II compliant. I-BOND® resins are also compliant with the European EPF-S standard, as well as the Japanese F**** (F 4 star) formaldehyde emission standard.