I-BOND®

Huntsman Brand

I-BOND® resins from Huntsman are powerful, formaldehyde-free and fast-curing resins for the composite wood panel industry. They are used for bonding: Oriented Strand Board (OSB), Medium Density Fiberboard (MDF), Particleboard (PB), and Wood Fiber Insulation Board (WFI). I-BOND® resins contain no added formaldehyde (NAF) and are considered "exempt" under the requirements of the California Air Resources Board (CARB) standards. Using I-BOND® resins classifies products as both CARB I and CARB II compliant. I-BOND® resins are also compliant with the European EPF-S standard, as well as the Japanese F**** (F 4 star) formaldehyde emission standard.
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