Brands

I-BOND® resins from Huntsman are powerful, formaldehyde-free and fast-curing resins for the composite wood panel industry. They are used for bonding: Oriented Strand Board (OSB), Medium Density Fiberboard (MDF), Particleboard (PB), and Wood Fiber Insulation Board (WFI). I-BOND® resins contain no added formaldehyde (NAF) and are considered "exempt" under the requirements of the California Air Resources Board (CARB) standards. Using I-BOND® resins classifies products as both CARB I and CARB II compliant. I-BOND® resins are also compliant with the European EPF-S standard, as well as the Japanese F**** (F 4 star) formaldehyde emission standard.

The ARATHANE® brand represents high performance epoxy and polyurethane systems for use in encapsulation and insulation applications for electronic components, the impregnation of electro composites, and as an adhesive in other markets.

REN® branded materials such as RENLAM®, RENGEL®, RENINFUSION® and RENPIM® encompass a wide range of composites and tooling products that enhance the performance of epoxy resins in industrial and manufacturing applications, ensuring optimal strength, durability, and resistance. They are most often used in high-performance environments and are easy to mix and apply.

MDI (methylene diphenyl diisocyanate) is one of the basic components used to make polyurethane foam. Polyurethane foam is made by reacting an isocyanate (MDI) with a polyol. Huntsman sells many differentiated grades of MDI in the Americas under the RUBINATE® name, and in Europe and Asia under the SUPRASEC® name.

MDI (methylene diphenyl diisocyanate) is one of the basic components used to make polyurethane foam. Polyurethane foam is made by reacting an isocyanate (MDI) with a polyol. Huntsman sells many differentiated grades of MDI in the Americas under the RUBINATE® name, and in Europe and Asia under the SUPRASEC® name.