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Huntsman is a global, differentiated, and specialty chemicals company. For more than 50 years, we have been using science and ingenuity to innovate and create products that enable more sustainable and comfortable lives for millions of people around the world. From our research and development scientists and technical service teams to our sales and customer service professionals, we are dedicated to helping you find the right material solutions to your most pressing technical challenges.

E-GRADE® 3-methyl-2-oxazolidinone (E-GRADE® MEOX) is primarily used in stripping, cleaning, and wet etching formulations in the semiconductor, display, and PCB industries. 

E-GRADE® 3-methyl-2-oxazolidinone (E-GRADE® MEOX)

TEROL® 518 is a modified aromatic polyester polyol.

TEROL® 518

Diethylenetriamine (DETA) is a linear ethyleneamine containing two primary nitrogens and one secondary nitrogen. DETA is a single-component product that is clear and colorless, with an ammonia-like odor.

Diethylenetriamine (DETA)

EPIBOND® 315 A/B Adhesive is an extrudable, two-component, room-temperature curing epoxy adhesive designed for service temperatures up to 400°F (204°C). This product is suitable for bonding a wide variety of materials, such as metals, composites, and many other dissimilar substrates. The combination of high shear strength and compression makes this adhesive well-suited for aerospace applications and composites requiring a liquid shim. EPIBOND® 315 A/B offers rapid strength build-up with an easy-to-process mix ratio.

EPIBOND® 315 A/B

E-GRADE® THEMAH provides safer handling alternatives to tetramethylammonium hydroxide (TMAH). Both are strong, metal ion-free organic bases suited for etching silicon and for photoresist developing and stripping applications. In addition, Huntsman has developed a library of many new experimental quaternary ammonium compounds (quats), enabling a range of products for different applications. These are available in aqueous and solvent-based formulations. Huntsman’s platform of TMAH alternatives is being developed with the aspiration of providing less toxic alternatives to TMAH for the next generation of semiconductor cleans.

E-GRADE® THEMAH

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OMICURE® curing agents, accelerators and catalysts are one-part epoxies which are important to many industries for lightweight, high-performance composites. These additives accelerate cure speed and lower cure temperature in one-part epoxy systems.

OMICURE®

The ARATHANE® brand represents high performance epoxy and polyurethane systems for use in encapsulation and insulation applications for electronic components, the impregnation of electro composites, and as an adhesive in other markets.

ARATHANE®

AIROUT™

KRYSTALSLIM

Our high-performance EPIBOND® adhesives for aerospace and automotive applications provide superior joining and bonding solutions for plastics, metals, composite materials and other substrates. EPIBOND® adhesives offer productivity and manufacturing process improvements, as well as reductions in weight over other fastening methods. Additionally, manufacturers can select adhesives that are flame retardant, resistant to fatigue, chemicals and temperatures, and with mechanical properties that vary from rigid to flexible and offer long-term durability. Our products are specified in numerous OEM applications ranging from interior parts such as seats, lavatories, overhead bins, galleys and monuments to exterior parts such as nacelles, landing gear doors and control surfaces.

EPIBOND®

IROGRAN® is a specialized, polyester-based thermoplastic polyurethane (TPU) grade material used in extrusion and injection molding applications, including cable and wire, hoses and tubes, film and sheet, seals and other technical parts.

IROGRAN®

HYPRO® Reactive Liquid Polymer is a low molecular weight synthetic rubber with chemical functionality. These reactive additives incorporate rubber properties into epoxies, acrylates, vinyl esters and polyesters. They improve the toughness and low-temperature properties in coatings, adhesives, sealants and composites. HYPRO® reactive liquid polymers are butadiene homo-polymers and butadiene-acrylonitrile copolymers with terminal functionality.

HYPRO®

<p>The TEROL® family of polyester polyols are a critical component in the production of MDI-based polyurethane insulation systems – the most effective insulants available in the market, as measured by R-value. Insulation products based on TEROL® polyols include polyisocyanurate (PIR), boardstock systems (PUR), spray polyurethane foam (SPF) and pour-in-place applications, including entry doors, garage doors, coolers, refrigerators and commercial freezers.<br>
A proprietary process enables the use of waste PET (polyethylene terephthalate) bottles, that may have been destined for landfills or found their way into oceans, in the production of TEROL® polyols. Both pre-consumer and post-consumer sources of PET are used.<br>
Advantages of TEROL® polyols:</p>

<ul>
	<li>PET content / renewable resource content</li>
	<li>Improved fire properties from high aromatic content</li>
	<li>High functionality for improved physical property performance and fast de-mold times</li>
	<li>Specifically formulated for use with a wide range of blowing agents</li></ul>


TEROL®

HYPOX® elastomer-modified epoxies enhance fracture toughness, low-temperature mechanical properties, impact/crack/chip resistance, peel strength and/or the flexibility of epoxy coatings, adhesives, sealants, and composites. HYPOX®️ RF and RM elastomer-modified, low-viscosity epoxy resins combine high-elastomer content with the convenience of handling epoxy resins.

HYPOX®

HYPRO® 1300X13 F CTBN is a liquid-form elastomer-modified material used in automotive and transportation applications. It offers enhanced properties for various automotive materials, making it ideal for formulations requiring improved toughness and flexibility.

HYPRO® 1300X13 F CTBN

ARALDITE® PY 307-1 epoxy resin is an unmodified, low-viscosity epoxy phenol novolac resin recommended for solvent-free and high-solids coatings. Having an average functionality greater than two, it is a true multifunctional epoxy resin. Due to this functionality, it provides a high crosslink density when properly cured with a variety of hardeners. Thus, coatings based on Araldite®PY 307-1 epoxy resin exhibit excellent chemical and thermal resistance, superior to coatings based on conventional epoxy resins.  Araldite®PY 307-1 epoxy resin is also compatible in all proportions with liquid bisphenol-A and bisphenol-F epoxy resins, providing possibilities for formulating solvent-free and high solids coatings.

ARALDITE® PY 307-1

ARADUR® HW 5939 is a paste used in industrial additive applications, specifically for insulating materials, offering enhanced performance and durability in insulation processes.

ARADUR® HW 5939

ARALDITE® GY 509 resin is a very low viscosity epoxy resin modified with Araldite® DY 027 product, a reactive diluent. is a very low viscosity epoxy resin modified with Araldite® DY 027, a reactive diluent.

ARALDITE® GY 509

ARALDITE® CW 2245 N is a liquid resin designed for encapsulation and industrial additive functions. It is ideal for battery and electronic materials technologies, particularly in electrical and electronics markets.

ARALDITE® CW 2245 N

ARALDITE® LY 556 / REN® HY 5212 is an epoxy resin, formulated amine hardener, with excellent chemical resistance. Used in industrial composites and structural composites.

ARALDITE® LY 556 / REN® HY 5212

CAPCURE® 3830-81 is a liquid curing agent insoluble in water, used as an industrial additive for curing applications.

CAPCURE® 3830-81

Dimethylethanolamine - 50% (DMEA 50) is a clear, colorless, mobile liquid with an ammoniacal odor. Since the product contains both a tertiary amine group and a hydroxyl group, it undergoes reactions typical of amines and alcohols.

Dimethylethanolamine - 50% (DMEA 50)

SUPRASEC® 2004 is a member of the Liquid Pure MDI isocyanate family. These products have been modified to remain liquid at ambient temperatures. SUPRASEC 2004 MDI Isocyanate is a modified diphenylmethane diisocyanate with a clear to slightly hazy appearance. This product is designed as an alternative to difunctional products such as pure 4,4 MDI or materials containing elevated levels of 2,4 MDI. When used as a precursor for a prepolymer, the resulting material may experience a slightly different performance with an identical B-Side resin. As a result, formulations may need minor adjustments to meet the end requirements.

SUPRASEC® 2004

Huntsman

Huntsman Corporation uses science and ingenuity to create innovations that play a critical role in the everyday lives of many millions of people. The company’s products are used in a diverse range of 

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Applicable Processes Polyurethane Manufacturing - Huntsman

I-BOND® resins from Huntsman are powerful, formaldehyde-free and fast-curing resins for the composite wood panel industry. They are used for bonding: Oriented Strand Board (OSB), Medium Density Fiberboard (MDF), Particleboard (PB), and Wood Fiber Insulation Board (WFI). I-BOND® resins contain no added formaldehyde (NAF) and are considered "exempt" under the requirements of the California Air Resources Board (CARB) standards. Using I-BOND® resins classifies products as both CARB I and CARB II compliant. I-BOND® resins are also compliant with the European EPF-S standard, as well as the Japanese F**** (F 4 star) formaldehyde emission standard.

I-BOND®

MDI (methylene diphenyl diisocyanate) is one of the basic components used to make polyurethane foam. Polyurethane foam is made by reacting an isocyanate (MDI) with a polyol. Huntsman sells many differentiated grades of MDI in the Americas under the RUBINATE® name, and in Europe and Asia under the SUPRASEC® name.

RUBINATE®

Polyurethane Manufacturing

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