Enhanced TDS
Identification & Functionality
- Chemical Family
- Composite Materials Functions
- Function
- Curing Agent
- Plastics & Elastomers Functions
- Technologies
- Product Families
- Chemical Structure
Features & Benefits
- Labeling Claims
- Materials Features
- Product Features
- DICY paste (28% DICY in epoxy resin). Particle size: 98% < 10 μm. Eliminates manipulation of dicyandiamide in powder form and the need for heavy dispersion equipments. Homogeneous, agglomerate-free dispersion. Easy to manipulate and introduce in epoxy resins formulations.
- Good latency at RT - curing above 120°C
- Standard modulus Medium Tg
- Dispersion of DICY in epoxy resin
- Fast reaction at high temperature
Applications & Uses
- Compatible Polymers & Resins
- Composites End Use
Properties
- Physical Form
Regulatory & Compliance
Packaging & Availability
- Regional Availability
Other
- Appearance
- White ultra fine paste
- Color (SDS)
- White
- Odor (SDS)
- Slight
- Physical Properties
Value Units Test Method / Conditions Viscosity 28000.0-40000.0 mPa.s mPa.s At 25°C