ARALDITE® 12041 A/B

ARALDITE® 12041 A/B is a two-component epoxy resin casting system. It is transparent after curing and offers superior crack resistance for optoelectronic devices, especially for tip light-emitting diodes (LEDs).

RTU Product Type: Casting Resin

Product End Uses: Encapsulant, Light Emitting Diode (LED), Optoelectronics Devices

Chemical Family: Epoxy & Epoxy Derivatives

Composites Processing Methods: Casting

Features: Crack Resistant, Good Adhesion, High Clarity, High Light Transmission, Thermal Shock Resistant, UV Resistant

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Enhanced TDS

Identification & Functionality

Features & Benefits

Ready-to-Use Product Features
Product Features
  • Exhibit good UV resistance
  • Retain good clarity & light transmission at elevated temperature
  • Offer good crack resistance
  • Adhere to leadframe and housing firmly

Applications & Uses

Compatible Substrates & Surfaces
Composites Processing Methods
Product End Uses
System Preparation
  • Pre-Mixing: Component A to be preheated at 60°C/30min
  • Mixing: The mixture of component A/component B may be mixed using standard techniques.
  • Degassing: Use vacuum device; 0 - 10 mmHg
Application Information
  • Applicable for blue and white LED
  • Applicable for chip and high power LED

Properties

Physical Form

Regulatory & Compliance

Certifications & Compliance

Technical Details & Test Data

Typical Cured Information

 - 1

Fig 2: Viscosity increment at 50⁰C

Initial viscosity BH type Viscometer 20 rpm at 25⁰C :  2600 cps

Recommended cure schedule

LED Type Cure Step Temperature Time
Chip LED 1st Step Cure 130°C 1 hour
Post Cure 150°C 5 hours
Lamp LED 1st Step Cure 110°C 1 hour
2nd Step Cure 120°C 0.5 hours
Post Cure 150°C 5 hours

Note: Actual oven cure is dependent upon applications and substrate/component design.

Specimen cured at 130°C for 1 hr and 150°C for 5 hr

Property Test Method Test Values Unit At Condition
Glass Transition Temperature (Tg) DSC 125 °C -
Coefficient of Thermal Expansion - 58 ppm Below Tg
    149 ppm Above Tg
Hardness (Shore D) ASTM D-2240 88 - -
Flexural Strength ASTM D-790 15.08 kg/mm² 25°C
Flexural Modulus ASTM D-790 282.5 kg/mm² 25°C
Shrinkage - 0.97 % -
Water Pick-Up (Boiling at 100°C for 24 hours) ASTM D570 0.16 % -
Boiling for 24 hours - 1.76 % -
Volume Resistivity ASTM D257 1.11 x 10¹⁶ Ω·cm -
Dielectric Constant ASTM D150 3.01 - 1 MHz
Dielectric Loss ASTM D150 1.93 % 1 MHz
Refractive Index        
Wavelength (nm) Refractive Index Unit At Condition  
486 1.547 - -  
588 1.537 - -  
658 1.534 - -  

Transmittance (2mm Thickness)

       
Wavelength (nm) Transmittance Unit Test Condition  
400 80.84 % 2mm thickness  
500 84.22 % 2mm thickness  
600 84.45 % 2mm thickness  
700 87.05 % 2mm thickness  

Transmittance (UV Resistance after 365nm, 30mW/cm² for 1000 hours)

       
Wavelength (nm) Transmittance Unit Test Condition  
400 61.02 %

365nm, 1000 hours

 
500 78.19 %

365nm, 1000 hours

 
600 81.94 %

365nm, 1000 hours

 
700 85.02 %

365nm, 1000 hours

 

Transmittance (Heat Resistance at 120°C for 1000 hours)

       
Wavelength (nm) Transmittance Unit Test Condition  
400 71.52 %

120°C, 1000 hours

 
500 82.88 %

120°C, 1000 hours

 
600 84.42 %

120°C, 1000 hours

 
700 87.32 %

120°C, 1000 hours

 

Safety & Health

Handling Precautions

Mandatory and recommended industrial hygiene procedures should be followed whenever our products are being handled and processed.

Storage & Handling

Storage Conditions

The components have to be stored under dry conditions below 25°C, in tightly sealed original containers. Under these conditions, the shelf life will correspond to the expiry date stated on the label. After this date, the product may be processed only following reanalysis. Partly emptied containers should be closed tightly immediately after use.Disposal - Regular procedures approved by national and/or local authorities