ARALDITE® CY 5997 / ARADUR® HY 5998-1 / ACCELERATOR DY 067 / Filler Silica flour

ARALDITE® CY 5997 / ARADUR® HY 5998-1 / ACCELERATOR DY 067 / Filler Silica flour is a liquid, hot-curing, low-viscosity casting resin system designed for producing castings with excellent mechanical properties and superior thermal shock resistance.

RTU Product Type: Casting Resin

Product End Uses: Electrically Insulating Components

Chemical Family: Epoxy & Epoxy Derivatives

Composites Processing Methods: Automatic Pressure Gelation (APG)

Features: Glossy Surface Aspects, Good Electrical Properties, Good Mechanical Properties, High Filler Loading, High Voltage Insulation, Improves Demoulding, Low Viscosity, Thermal Shock Resistant

Cure Method: Heat Cure

Enhanced TDS

Identification & Functionality

Features & Benefits

Ready-to-Use Product Features
Features and Benefits
  • High filler load possible
  • Good thermal shock resistance
  • Good mechanical and electrical properties
  • Improved demoulding properties
  • Glossy surface of the castings

Applications & Uses

Application Area
Composites Processing Methods
Cure Method
Product End Uses
Markets
Applications
Application Information

Indoor electrical insulating material for medium and high voltage applications: insulators and bushings, switch and apparatus components,etc.

Properties

Physical Form

Technical Details & Test Data

System Preparation

General instructions for preparing liquid resin systems.

Long pot life is desirable in the processing of any casting resin system. Mix all of the components together very thoroughly at room temperature or slightly above and under vacuum. Intensive wetting of the filler is extremely important. Proper mixing will result in:

  • Better flow properties and reduced tendency to shrinkage
  • Lower internal stresses and therefore improved mechanical properties on object
  • Improved partial discharge behaviour in high voltage applications.

For the mixing of medium to high viscous casting resin systems and for mixing at lower temperatures, we recommend special thin film degassing mixers that may produce additional self-heating of 10-15°C as a result of friction. For low viscous casting resin systems, conventional anchor mixers are usually sufficient.

In larger plants, two pre-mixers are used to mix the individual components with the respective quantities of fillers and additives under vacuum. Metering pumps then feed these premixes to the final mixer or a continuous mixer. The individual premixes can be stored at elevated temperature (about 60°C) for up to about 1 week, de-pending on formulation. Intermittent agitation during storage is advisable to prevent filler sedimentation.

Mixing time can vary from 0.5 to 3 hours, depending on mixing temperature, quantity, mixing equipment and the particular application. The required vacuum is 0.5 to 8 mbar. Degassing time is recommended at least 1 hour. The vapour pressure of the individual components should be taken into account.

In the case of dielectrically highly stressed parts, we recommend checking the quality consistency and pre-drying of the filler. Their moisture content should be max. 0.2%.

Processing Information

The effective pot-life of the mix is about 2 days at temperatures below 25°C. Conventional batch mixers should be cleaned once a week or at the end of work. For longer interruptions of work, the pipes of the mixing and metering installations have to be cooled and cleaned with the resin component to prevent sedimentation and/or undesired viscosity increase. Interruptions over a week-end (approx. 48h) without cleaning are possible if the pipes are cooled at temperatures below 18°C. For data on viscosity increase and gel time at various temperatures, refer to Figs: 4.1.

Mold temperature
APG process 130 - 160°C
Conventional vacuum casting 80 - 100°C


Demolding times (depending on mold temperature and casting volume)
APG process 10 - 45 min
Conventional vacuum casting 4 - 8h


Cure conditions
APG process 4h at 140°C
Conventional vacuum casting 4h at 80°C and 10h at 130°C or 4h at 80°C and 6h at 140°C


To determine whether cross-linking has been carried to completion and the final proper- ties are optimal, it is necessary to carry out relevant measurements on the actual object or to measure the glass transition temperature. Different gelling and cure cycles in the manufacturing process could lead to a different cross-linking and glass transition temperature respectively.

 

Processing Viscosities

 

 - 1

Fig.4.1: Viscosity increase at 60 and 80°C (measurements with Rheomat 115) (Shear velocity D = 10 s⁻¹)

 

Gelation and Cure Times

 

 - 1

Fig.4.2: Gel time as a function of temperature (measured with Gelnorm Instrument, ISO 9396)

 

Mechanical and Physical Properties

 

Key Value Unit Test Method Condition
Tensile strength 77 - 87 MPa ISO 527

Cured for 4h at 140°C

Elongation at break 0.95 - 1.05 % ISO 527

Cured for 4h at 140°C

E modulus from tensile test 10,500 - 12,500 MPa ISO 527

Cured for 4h at 140°C

Flexural strength 110 - 120 MPa ISO 178

Cured for 4h at 140°C

Surface strain 1.00 - 1.20 % ISO 178

Cured for 4h at 140°C

E modulus from flexural test 10,500 - 12,500 MPa ISO 178

Cured for 4h at 140°C

Critical stress intensity factor (K1C) 2.20 - 2.60 MPa·m¹/² CG 216-0/89

Cured for 4h at 140°C

Specific energy at break (G1C) 400 - 500 J/m² CG 216-0/89

Cured for 4h at 140°C

Thermal conductivity 1.00 - 1.05 W/m·K Similar to ISO 8894-1

Cured for 4h at 140°C

Coefficient of linear thermal expansion (20-40°C) 33 - 37 x10⁻⁶ K⁻¹ ISO 11359-2

Cured for 4h at 140°C

Glass transition temperature (DSC) 110 - 125 °C ISO 11357-2

Cured for 4h at 140°C

Water absorption (10 days at 23°C) 0.10 - 0.20 % by wt ISO 62

Cured for 4h at 140°C

Water absorption (60 minutes at 100°C) 0.05 - 0.10 % by wt ISO 62

Cured for 4h at 140°C

Density (Filler load: 67% by weight) 1.86 - 1.88 g/cm³ ISO 1183

Cured for 4h at 140°C

 

 

Electrical Properties

 

Key Value Unit Test Method Condition
Breakdown strength (IEC 60243-1) 23 - 28 kV/mm IEC 60243-1

Cured for 4h at 140°C

Tracking resistance (IEC 60112) CTI > 600 - < 1   IEC 60112

Cured for 4h at 140°C

Tracking resistance (with test solution B)

CTI > 600M - < 1

  IEC 60112

Cured for 4h at 140°C

HV arc resistance (IEC 61621) 175 - 185 sec IEC 61621

Cured for 4h at 140°C

Loss factor (tan δ) at 25°C (IEC 60250) 2.7 % IEC 60250

Cured for 4h at 140°C

Dielectric constant (εr) at 25°C (IEC 60250) 4.1   IEC 60250

Cured for 4h at 140°C

Volume resistivity at 25°C (IEC 60093) 2.5 * 10¹⁵ Ω·cm IEC 60093

Cured for 4h at 140°C

 

 

 - 1

Fig.6.1: Loss factor (tan δ) and Dielectric constant (εr) as a function of temperature (measurement frequency: 50 Hz, IEC 60250)


 - 1

Fig.6.2: Volume resistivity (ρ) as a function of temperature (measurement voltage: 1000 V, IEC 60093)

Storage & Handling

Storage Conditions

Store the components in a dry place according to the storage conditions stated on the label in tightly sealed original containers. Under these conditions, the shelf life will correspond to the expiry date stated on the label. After this date, the product may be processed only after reanalysis. Partly emptied containers should be tightly closed immediately after use.

Other

Application Information
ValueUnitsTest Method / Conditions
Mix Ratio0.007 %(W)%(W)Accelerator : Resin
Mix Ratio3.4 %(W)%(W)Filler : Resin
Mix Ratio0.83 %(W)%(W)Hardener : Resin