EPALLOY® 7192 N is an unmodified, high-molecular-weight bisphenol-A-based epoxy resin that is a semisolid material at room temperature. It is particularly well-suited for use in formulating durable high-solids coatings, toughened adhesives, laminating resins, and prepreg molding compounds. Compared to lower-molecular-weight epoxy resins, it provides faster cure, improved adhesion, more durable cured systems, and enhanced toughness, though with somewhat reduced high-temperature performance.
Chemical Family: Epoxy & Epoxy Derivatives
Functions: Binder & Resin
End Uses: Chemical-Resistant Coatings, Encapsulant, High-Solids Primer, Powder Coating
Features: Fast Curing, Faster Cure Time, Good Toughness, Improves Adhesion
Physical Form: Liquid