PROBIMER® 77-9000 / HARDENER 77-9002

• Two-component-system, green version, glossy surface
• Halogen-free: exceeds JPCA standard, total halogen content after final curingless than 900 ppm
• High resolution
• Excellent small hole developability with high aspect ratio
• Optimized for long hold times between individual process steps
• Wide process windows offer high flexibility
• Excellent chemical, electrical and physical end properties
• High comparative tracking index (CTI) and high dielectric strength
• High resistance with aggressive post solder mask processes
• Easy strippable
• Halogen-free – exceeds JPCA Standard
• Green glossy version
• High resolution
• Excellent small hole developability with high aspect ratio
• Wide drying window
• Long hold times after drying and exposure
• High comparative tracking index (CTI)
• High dielectric strength
• High resistance with aggressive post solder mask processes

Room Requirements on Working Environment

In order to reach best results the following room requirements should be respected:

• Room Temperature: 22 ± 2 °C (71.6 ± 35.6 °F)
• Relative Humidity: 50 ± 5%
• Cleanroom Class 100’000 + 3 mm WS
• UV blocked light

Mixing

• Thoroughly mix the resin component and the hardener component for 10-15 minutes. Mixing in order to be done with gentle mechanical stirring. High shear mixing must be avoided in order to prevent entrapment of large amounts of air, which can cause bubbles and poor leveling of the printed coating.
• Dilution is generally not required. In specific cases a diluent may be added. We recommend a maximum dilution of 3% with Dipropyleneglycolmonomethylether (DPM) or specified thinner LSP-819. 

Pot life

At room temperature the ready-to-use mixture has a pot life of > 1 day. (Definition of pot life is related to increased dwell time in developer.)

Pre-cleaning

• For a good adhesion of the lacquer we recommend chemical and/or mechanical pre-cleaning.
• Hold times prior to coating have to be minimized, since oxidation may impair the adhesion of the lacquer.
• Only completely dried boards should be coated, this has to be ensured especially for boards with small holes or blind vias.

Screen printing

• PROBIMER® 77-9000 / 9002 is applied to printed wiring boards using vertical or horizontal screen printing equipment.
• Monofilament polyester mesh in the range of 32-48 (mesh/cm) or 80-120 (mesh/inch) is recommended. Squeegee hardness in range of 70-80 (Shore A)

Flash-off / drying

A flash-off time (RT) of 5-10 minutes before drying is recommended. To achieve good performance in resolution, developability of small holes and resistance to finishing processes the coated boards must be dried according to the following parameters:

Exposure

A hold time prior to exposure is not necessary. The spectral sensitivity is in the range of 350 - 420 nm. The exposure time depends on the parameters for the developing step.

Developing

The areas of unexposed PROBIMER® 77-9000 / 9002 should be developed in a continuous spray developing line. Developing is carried out in a 0.8-1.2 % aqueous alkaline solution.

Inspection and Stripping

In case of mishandling during exposure, such as mis-registration, boards can be stripped at 60-80 °C (140-176 °F) with 10% NaOH solution. After thermal cure the boards could be stripped in 50% KOH at 60-80 °C (140-176 °F) for approx. 60 minutes.

Final Curing

Thermal curing is required to ensure optimal properties in the cured film. It can be done in a standard convection oven.

After thermal curing, we recommend UV curing of 1000–2000 mJ/cm2 for increased chemical resistance. After curing Probimer lacquers exhibit extremely high chemical resistance and, thus, cannot be easily removed without damaging the board

UV-Curing

After thermal curing, we recommend UV curing of 1000–2000 mJ/cm2 for increased chemical resistance.

Legend Inks and Conformal Coatings

• In general, legend inks and conformal coatings exhibit well to excellent adhesion to boards coated with PROBIMER® 77-9000
• However, due to the large variety of available products preliminary trials are strongly recommended.

Production Release Trials

• A variety of flow agents, soldering machines and soldering techniques as well as cleaning processes are used to mount components on circuit boards.
• Adjustment of the processing parameters and design guidelines to ensure optimal use of solder masks leads to the best overall results.
• Users should carry out their own tests prior to release for production runs.

• Probimer products contain flammable solvents.
• When the line is in operation no open flame or light allowed in the vicinity.
• Before carrying out maintenance or repair work the line should be cleaned and the work area thoroughly ventilated.

• Probimer lacquers are complex chemical compounds.
• To ensure that these products exhibit consistent quality in application we recommend storage under the following conditions:
• PROBIMER® 77-9000 in original container at 2-25 ℃ (35.6-77 ℉)
• PROBIMER® 77-9002 in original containers at 2-25 ℃ (35.6-77 ℉)
• Under ‘EXP’ on the package label, the expiry date is indicated. Within this period the product should be used.