Products

REN® HY 33 is a hardener used in casting resin applications within industrial markets. It is listed in chemical inventories such as AIIC (Australia), DSL (Canada), ENCS (Japan), IECSC (China), KECI (Korea), PICCS (Philippines), TCSI (Taiwan), and TSCA (USA), ensuring comprehensive regulatory compliance.

REN® HY 5160-1 is a hardener used in casting resin applications within industrial markets. It is listed in chemical inventories such as AIIC (Australia), DSL (Canada), IECSC (China), KECI (Korea), PICCS (Philippines), TCSI (Taiwan), and TSCA (USA), ensuring global regulatory compliance.

REN® HY 5161-1 is a hardener used in casting resin applications within industrial markets. It complies with EC No.1907/2006 and is listed in chemical inventories such as AIIC (Australia), DSL (Canada), IECSC (China), KECI (Korea), TCSI (Taiwan), and TSCA (USA), ensuring regulatory adherence.

REN® HY 5162-1 is a hardener used in tooling processes within industrial applications. It is listed in California Proposition 65 and is included in chemical inventories such as AIIC (Australia), DSL (Canada), IECSC (China), KECI (Korea), TCSI (Taiwan), and TSCA (USA), ensuring global regulatory compliance.

REN® HY 5289 is a liquid resin used in industrial additive applications. It is listed in chemical inventories such as AIIC (Australia), CHINV (Switzerland), DSL (Canada), ENCS (Japan), IECSC (China), KECI (Korea), PICCS (Philippines), TCSI (Taiwan), and TSCA (USA), ensuring compliance with global regulations.

REN® HY 98 is a liquid hardener used in industrial additive applications. It is listed in chemical inventories such as AIIC (Australia), DSL (Canada), IECSC (China), KECI (Korea), PICCS (Philippines), TCSI (Taiwan), and TSCA (USA), ensuring global regulatory compliance.

RESIN 012 Clear is a resin used in electronics manufacturing and encapsulation processes. It is suitable for industrial additive applications in electronics and optical sectors, offering reliable performance in these specialized fields.

RESIN 014 is a resin used in electronics manufacturing and encapsulation processes. It is designed for industrial additive applications in electronics and optical fields, providing effective solutions for these specialized uses.

RESIN O51/1 is a resin used in electronics manufacturing and encapsulation processes. It is suitable for industrial additive applications in electronics and optical sectors, offering high-performance solutions for these specialized fields.

RESIN RX 1741 A is a resin used in electronics manufacturing and encapsulation processes. It is ideal for industrial additive applications in electrical components, electronics, and optical sectors, providing durable and reliable solutions for these specialized fields.

RESIN RX 1741 B is a resin used in electronics manufacturing and encapsulation processes. It is suitable for industrial additive applications in electronics and optical sectors, offering strong performance and reliability for these specialized applications.

RESIN S 10 is a specialized additive used in electronics manufacturing and encapsulation processes. It serves as a resin component for industrial additives, supporting applications in electronics and optical industries by providing essential material properties for encapsulation and manufacturing needs.

RESIN S 20 is utilized in electronics manufacturing and encapsulation processes. It functions as a resin within industrial additives, contributing to end uses in electronics and optical applications by delivering necessary encapsulation and material support.

RESIN S 30 is engineered for use in electronics manufacturing and encapsulation processes. As an industrial additive resin, it supports end uses in electronics and optical applications by delivering essential encapsulation and structural properties.

RESIN S 40 is designed for electronics manufacturing and encapsulation processes. It acts as a resin in industrial additives, enabling its use in electronics and optical applications by providing essential encapsulation and structural support.