Products

ERISYS® GE 5 is a liquid binder from Huntsman's ERISYS® series, belonging to the chemical family of epoxy and epoxy derivatives, specifically glycidyl ethers. It is designed for use in epoxy resins, enhancing their performance in various industrial applications

ERISYS® GE 6 is a liquid epoxy-based binder and resin used as an industrial additive in epoxy resins, belonging to the chemical family of epoxy derivatives and glycidyl ethers.

ERISYS® GE 60, epoxidized sorbitol, is an aliphatic multifunctional epoxy resin. This resin imparts higher reactivity and crosslink density to epoxy resin formulations. Additionally, ERISYS® GE-60 can be used to crosslink acid-functional polyurethane and acrylic resins for improved chemical resistance in UV-resistant coatings.

ERISYS® GS-110, the monoglycidyl ester of neodecanoic acid, can be used as a diluent for high-viscosity epoxy resins. GS-110 has a low viscosity, low vapor pressure, and a less irritating odor than other low-viscosity monofunctional diluents. As with all monofunctional aliphatic epoxides, increasing levels of GS-110 in epoxy resins will lengthen gel times and modify cured properties. Some decrease in thermal and chemical resistance and modulus may occur.

ERISYS® GS 120 diluent is a diepoxide of a long-chain aliphatic dimer acid, used as a reactive additive to increase flexibility in rigid epoxy systems. It reduces viscosity, improves filler loading, and enhances toughness, impact, and thermal shock resistance, though with a slight sacrifice in elevated temperature performance and chemical resistance.

ERISYS® RDGE N-1 resin is a very low-viscosity aromatic diepoxide, primarily used as a reactive modifier in epoxy formulations. It is compatible with all epoxy resin curing agents, offering formulators flexibility in curing agent selection due to its high reactivity.

ERISYS® RN 2650 N is a blend of epoxidized resorcinol (RDGE) and epoxidized phenol novolac resins. It reduces viscosity, improving substrate wetting and filler loading. After curing, it provides superior chemical and elevated temperature resistance. It is compatible with all standard epoxy curing agents and can be blended with other resins.

EUREMELT™ 2096-1 Markets is a solid hot melt adhesive designed for industrial applications. It features low melt viscosity and a low melting point, making it compatible with various substrates, including leather, metal, plastics, and wood.

EUREMELT™ 2140-1 Markets is a solid adhesive designed for industrial applications. It is compatible with plastics and porous substrates, providing effective bonding solutions for various manufacturing needs.

Ethylene Diamine (EDA) is the lowest molecular weight ethyleneamine. It contains two primary nitrogens. EDA is a singlecomponent product that is clear and colorless, with an ammonia-like odor.

Ethyleneamine E-100 is a mixture of tetra-ethylene-pent-amine (TEPA), penta-ethylene-hexamine (PEHA), hexa-ethylene-heptamine (HEHA), and higher molecular weight products. E-100 is a complex mixture of various linear, cyclic, and branched products with a number-average molecular weight of 250-300 g/mole.

Ethyleneamine EA-300 is a polyamine mixture of tetraethylenepentamine (TEPA) and higher molecular weight ethyleneamine products. It contains linear, cyclic, and branched products with a number-average molecular weight of approximately 270 g/mole.

I-BOND® MDF EM 4330 is a liquid resin used in building envelope and roofing, cold-chain and insulation, furniture, industrial, and wood applications. It serves as a binder and matrix material for composites, particularly in fiberboards, providing enhanced performance for various industrial uses.

I-BOND® MDF EMFC 4332 is an emulsifiable resin used as the sole resin in producing standard or special quality MDF. It provides a stable emulsion for up to 2 hours and helps reduce the risk of blow line blockage.

I-BOND® MDF FC 4392 is an emulsifiable resin used as the sole resin in producing standard or special quality MDF. It provides a stable emulsion for up to 2 hours and helps reduce the risk of blow line blockage.