Products

EPALLOY® 8240 MIBK 90 N is a liquid that is slightly soluble in water. It is used in various industrial applications, particularly in coatings and related sectors, providing specific performance properties for processing and formulation needs.

EPALLOY® 8250 CI exhibits a very low room temperature viscosity. Close process control produces a resin significantly lower in viscosity than other commercially available epoxy novolacs of similar functionality. EPALLOY® 8250 CI combines low hydrolyzable chlorides with good reactivity. It is non-crystallizing and compatible with all standard curatives and most epoxy resin systems and solvents. Because of its low viscosity, EPALLOY® 8250 CI is an excellent resin for formulating 100% solids coatings and trowelable flooring. Those formulations will cure at room temperature and provide chemical resistance to concentrated acids and aggressive solvents. EPALLOY® 8250 CI is also the preferred resin for use in electronic encapsulation, laminating and film adhesives.

EPALLOY® 8330 MAK 80 is a liquid used in coatings and markings and paints and coatings applications. It is slightly soluble in water and is designed for use in CASE (coatings, adhesives, sealants, and elastomers) technologies, providing essential performance features for various industrial processes in the coatings sector.

EPALLOY® 8350 MEK 85 N resin is a solution of a high-functionality, high-viscosity epoxidized phenol novolac resin, supplied at 85% solids in methyl ethyl ketone (MEK). When cured, formulations containing EPALLOY® 8350 MEK 85 N resin offer improved chemical resistance and higher glass transition temperatures compared to formulations with lower functionality epoxy resins.

EPALLOY® 9000 is a 3.0-functional epoxy resin based on tris-hydroxyphenyl ethane, exhibiting very low melt viscosity. It is designed for applications requiring high-temperature performance. At room temperature, EPALLOY® 9000 is a clear glass, which becomes a viscous liquid at mildly elevated temperatures, making it suitable for bonding, coating, sealing, and filling applications. Its high functionality and aromatic character produce very hard cured compositions with excellent thermal and chemical resistance. Additionally, EPALLOY® 9000 can enhance tensile, flexural, and compressive strength in epoxy formulations.

ERISYS® GE-10 CI, epoxidized ortho cresol, is a low-viscosity, aromatic mono-epoxide. It is intended for use as a reactive diluent for high-viscosity epoxy resins. ERISYS® GE-10 CI is compatible at all concentrations with these resins, and resin/diluent blends can be cured using any epoxy resin curing agent.

ERISYS® GE 10 EX is an epoxidized ortho cresol used as a reactive diluent for high-viscosity epoxy resins. It provides minimal change to the performance properties of diluted formulations, reduces crystallization, and is ideal for environmentally challenging applications like floor coatings and concrete repair.

ERISYS® GE 11, epoxidized para-tertiary butyl phenol, is an aromatic mono-epoxide. GE-11 is intended for use as a reactive diluent for high-viscosity epoxy resins and is compatible at all concentrations with those resins. Resin/diluent blends can be cured using any curing agent for epoxy resins.

ERISYS® GE 12 is a liquid processing additive used in industrial applications. It is slightly soluble in water, providing effective performance in various processes that require specific properties for industrial use.

ERISYS® GE 20 reactive diluent is an epoxidized neopentyl glycol, a low-viscosity, aliphatic diepoxide. It is designed as a reactive diluent for high-viscosity epoxy resins, compatible at all concentrations, and can be cured with any epoxy resin curing agent.

ERISYS® GE 21 epoxidized butanediol is a low-viscosity, aliphatic diepoxide used as a reactive diluent for high-viscosity epoxy resins. It is compatible at all concentrations and can be cured with any epoxy resin curing agent.

ERISYS® GE 22 CI, epoxidized cyclohexanedimethanol, is a low-viscosity, cycloaliphatic diepoxide. It is intended for use as a reactive diluent for high-viscosity epoxy resins. ERISYS® GE 22 CI is compatible at all concentrations with these resins, and resin/diluent blends can be cured using any epoxy resin curing agent.

ERISYS® GE 22 EX CI is a low-viscosity, cycloaliphatic diepoxide, epoxidized cyclohexanedimethanol. It is used as a reactive diluent for high-viscosity epoxy resins and is compatible at all concentrations. Resin/diluent blends can be cured with any epoxy resin curing agent.

ERISYS® GE 24 Polyglycol Diglycidyl Ether is the diepoxide of an aliphatic polyglycol. Its low viscosity, relatively high equivalent weight, and aliphatic structure suggest use as a diluent and/or flexibilizer in high-viscosity, brittle epoxy formulations. As a diluent, ERISYS® GE 24 Polyglycol Diglycidyl Ether lowers viscosity for improved substrate wetting and/or higher filler loading. As a flexibilizer, it improves elongation, peel strength, resistance to thermal cycling, and impact. Depending on the concentration, the final formulation may experience some decrease in chemical and/or heat resistance.

ERISYS® GE 25 Diluent, epoxidized 1,6-Hexanediol, is a low-viscosity, aliphatic diepoxide. It is intended for use as a reactive diluent for high-viscosity epoxy resins. ERISYS® GE 25 Diluent is compatible at all concentrations with the resins and resin/diluent blends, and can be cured using any epoxy resin curing agent.