Industrial Additives & Materials

Morpholine is a colorless, mobile, hygroscopic liquid with a characteristic amine-like odor.

OMICURE® DDA 8 is a powder product that is water-soluble, designed for industrial end uses as an epoxy curing agent. It functions effectively as a curing agent and hardener, enhancing the performance of various industrial additives.

OMICURE® DDA 8 E is a powder product that is water-soluble, specifically formulated for industrial end uses as an epoxy curing agent. It functions effectively as a curing agent, enhancing the performance of various industrial additives.

OMICURE® NC 10 is a solid product designed for the aerospace and aviation markets. It functions as an ACCELERATOR in industrial additives, providing enhanced performance in various applications. This product is insoluble in water.

OMICURE® NC 8 is a solid accelerator used as an industrial additive to speed up chemical reactions.

OMICURE® U 24M EX is a powder accelerator used as an industrial additive to speed up chemical reactions.

OMICURE® U 405 M EX is a powder product designed for industrial applications. It functions as an ACCELERATOR in industrial additives, enhancing performance and efficiency in various formulations.

OMICURE® U 52M, an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide (DICY) cure of epoxy resins. OMICURE® U 52M represents the micronized grade of OMICURE® U 52. Suggested use levels of OMICURE® U 52/OMICURE® U 52M in DGEBA/DICY are ≤ 5 phr. At 5 phr, curing can be accomplished in about one hour at 100°C and in less than five minutes at temperatures ≥ 150°C. Room temperature shelf lives (doubling of viscosity) are longer than six months. Cure times and shelf lives depend on the composition of the formulated product and the end application. Some of the factors that can affect shelf life include formulation ingredients and compounding parameters. Ingredients in which OMICURE® U 52/OMICURE® U 52M are insoluble at processing and storage temperatures will enhance overall storage stability.

OMICURE® U 52 M EX is a powder product designed for industrial applications. It functions as an ACCELERATOR in industrial additives, improving performance and efficiency in various formulations.

OMICURE® U52 M 10 C is a powder product suitable for the aerospace and aviation, as well as industrial markets. It functions as an ACCELERATOR in industrial additives, enhancing performance and efficiency in various applications.

PHENOXY™ PKFE is a high-viscosity phenoxy resin known for its toughness, ductility, and excellent thermal stability, adhesive strength, and vapor barrier properties. It can be crosslinked with isocyanates, melamine, or phenolic resins for enhanced chemical resistance, hardness, and adhesion to substrates like steel, aluminum, glass, carbon fibers, and plastics. It can be used in single-pack epoxies with latent hardeners like dicyandiamide to improve toughness and adhesion. PHENOXY™ PKFE is soluble in polar, aprotic solvents like MEK, cyclohexanone, and glycol ethers.

PHENOXY™ PKHA is a low-viscosity phenoxy resin known for its toughness, ductility, and excellent thermal stability, adhesive strength, and vapor barrier properties. It can be crosslinked with isocyanates, melamine, or phenolic resins to enhance chemical resistance, hardness, and adhesion on substrates such as steel, aluminum, glass, carbon fibers, and plastics like nylon and PET. PHENOXY™ PKHA can also be used in single-pack epoxies with latent hardeners like dicyandiamide for improved toughness and adhesion. It is soluble in many polar, aprotic solvents like MEK, cyclohexanone, and glycol ethers.

PHENOXY™ PKHB+ is a low-viscosity phenoxy resin offering excellent thermal stability, adhesive strength, and vapor barrier properties. It can be crosslinked with isocyanates, melamine, or phenolic resins for enhanced chemical resistance and adhesion to materials like steel, aluminum, glass, and plastics. Used in single-pack epoxies with latent hardeners like dicyandiamide, it improves toughness and adhesion. Soluble in polar, aprotic solvents like MEK, cyclohexanone, and glycol ethers.

PHENOXY™ PKHJ is a high-viscosity phenoxy resin known for its excellent thermal stability, adhesive strength, and vapor barrier properties. It can be crosslinked with isocyanates, melamine, or phenolic resins, offering strong chemical resistance, hardness, and adhesion to substrates like steel, aluminum, glass, carbon fibers, and plastics such as nylon and PET. PHENOXY™ PKHJ can be used in single-pack epoxies with latent hardeners like dicyandiamide to improve toughness and adhesion. It is soluble in polar, aprotic solvents like MEK, cyclohexanone, and glycol ethers.

PHENOXY™ PKHW 35 is a waterborne colloidal dispersion of Phenoxy resin for thermoset coatings and adhesives. It offers excellent thermal stability, adhesive strength, and vapor barrier properties. Crosslinked with isocyanates, melamine, or phenolic resins, it enhances chemical resistance and adhesion. Compatible with most waterborne polyurethanes and acrylics, it improves film hardness, dry-to-touch times, and gloss. Crosslinkers like isocyanates and epoxy silanes further enhance physical properties. Coatings exhibit excellent flexibility and surface hardness.