OMICURE® U 52 M

OMICURE® U 52M, an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide (DICY) cure of epoxy resins. OMICURE® U 52M represents the micronized grade of OMICURE® U 52. Suggested use levels of OMICURE® U 52/OMICURE® U 52M in DGEBA/DICY are ≤ 5 phr. At 5 phr, curing can be accomplished in about one hour at 100°C and in less than five minutes at temperatures ≥ 150°C. Room temperature shelf lives (doubling of viscosity) are longer than six months. Cure times and shelf lives depend on the composition of the formulated product and the end application. Some of the factors that can affect shelf life include formulation ingredients and compounding parameters. Ingredients in which OMICURE® U 52/OMICURE® U 52M are insoluble at processing and storage temperatures will enhance overall storage stability.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

Product Functions: Accelerator

Chemical Name: 4,4'-Methylene Bis-Phenyldimethyl Urea

Chemical Family: Urea & Urea Derivatives

CAS Number: 10097-09-3, 7631-86-9

Product End Uses: 1K (1 Component) Adhesive, Encapsulant, Film Adhesives, Potting Compound, Powder Coating, Pre-pregs

Material Compatibility: Epoxy (EP) Polymers

Processing & Application Methods: Prepreg Processing

Enhanced TDS

Identification & Functionality

Features & Benefits

Product Features
Advantages

The addition of OMICURE® U 52M to epoxy/DICY formulations produces shelf-stable one-part products that cure in shorter times and/or at lower temperatures. Of the Huntsman Advanced Materials substituted urea, methylene bis (phenyl dimethyl urea) provides the best combination of acceleration, long shelf life and maintenance of cured properties in DICY-cured DGEBA.

Applications & Uses

Markets
Applications
Application Information
  • One-component adhesives
  • Epoxy powder coatings
  • Prepregs, composites, and film adhesives
  • Electronic potting and encapsulating compounds

Regulatory & Compliance

Packaging & Availability

Regional Availability
  • Americas
  • Asia Pacific
  • EIMEA

Storage & Handling

Storage Information

OMICURE® U 52M should be stored in a dry place, preferably in the sealed original container, at temperatures between 2 and 40 °C. The product should not be stored exposed to direct sunlight.

Handling Precautions
  • OMICURE® U 52M is a fine powder classified as a nuisance dust. It is not a primary skin or eye irritant but will cause respiratory irritation with prolonged dust inhalation.
  • The use of engineering controls to keep the material confined or convey dust away from the breathing zone is the preferred method of handling.
  • Alternatively, an approved dust respirator and impervious clothing should be worn if the material becomes airborne.
  • Allowing the dust to settle on vegetation may cause harm and may prevent germination.

Other

Appearance
Off-white to white powder
Color (SDS)
White as off-white
Labeling Claims
Material Compatibility
Odor (SDS)
Ammoniacal
Physical Form
Processing & Application Methods
Product End Uses
Physical Properties
ValueUnitsTest Method / Conditions
Melting Point220.0-230.0°C