OMICURE®

OMICURE® DDA 10 is a micronized dicyandiamide curing agent for epoxy resins, with a mean particle size of 12 μm and 2% silica as an anticaking aid. It remains stable until activated by heat (350 °F), offering over six months of storage stability. When catalyzed, it enables one-component adhesive and sealant formulas with cure temperatures of 225-250 °F. Its fine particle size ensures good dispersion, uniform curing, and excellent adhesion. Compatible with all epoxy resins and various fillers, OMICURE® DDA 10 is safe, non-toxic, and ideal for adhesive formulations.

OMICURE® DDA 5 CI EX is an ultra-micronized grade of Dicyandiamide, a solid latent curing agent for epoxy resins. OMICURE® DDA 5 CI EX, like other grades of Dicy, is dispersed into a resin system where it remains stable until activated by heat. Without an accelerator, such as a substituted urea, dicyandiamide has an activation temperature of about 175°C and a formulated storage stability of over six months. When catalyzed with a latent accelerator, like one of the OMICURE® U series of substituted ureas, one component adhesive and sealant formulas can be prepared with cure temperatures of 100- 120°C and excellent stability. The ultra-fine particle size of OMICURE DDA 5 CI EX will help to aid good dispersion, prevent settling, maximize reactivity, promote uniform cure to formulated systems, and avoid issues of ‘hot spots’. Epoxy systems cured with OMICURE® DDA 5 CI EX are characterized by outstanding adhesion making it a preferred choice for adhesive formulations. OMICURE® DDA 5 CI EX is compatible with all epoxy resins, including Bisphenol A and F epoxies and epoxy novolacs, can be used with diluted or undiluted resins, and is compatible with a wide variety of fillers and pigments. OMICURE® DDA 5 CI EX is safe to handle and is considered non-toxic.

OMICURE® DDA 8 is a powder product that is water-soluble, designed for industrial end uses as an epoxy curing agent. It functions effectively as a curing agent and hardener, enhancing the performance of various industrial additives.

OMICURE® DDA 8 E is a powder product that is water-soluble, specifically formulated for industrial end uses as an epoxy curing agent. It functions effectively as a curing agent, enhancing the performance of various industrial additives.

OMICURE® NC 10 is a solid product designed for the aerospace and aviation markets. It functions as an ACCELERATOR in industrial additives, providing enhanced performance in various applications. This product is insoluble in water.

OMICURE® NC 8 is a solid accelerator used as an industrial additive to speed up chemical reactions.

OMICURE® U 24 M is an aromatic substituted urea used as a latent ACCELERATOR for the dicyandiamide cure of epoxy resins. It reduces the time and temperature required for curing one-component products. Compared to other substituted ureas, toluene bis dimethyl urea offers the greatest acceleration while having minimal impact on cured properties. Suggested use levels are and lt;5 phr, with curing times of about 50 minutes at 100°C and under 3 minutes at temperatures and gt;150°C. It provides a room temperature shelf life of over 3 months when used with DGEBA/DICY. Storage stability improves when insoluble ingredients are used. OMICURE® U 24M can be incorporated with dicy in formulations.

OMICURE® U 24M EX is a powder accelerator used as an industrial additive to speed up chemical reactions.

OMICURE® U 35M N is a cycloaliphatic substituted urea used as a latent ACCELERATOR for the dicyandiamide curing of epoxy resins. It enables shelf-stable one-part epoxy/dicy formulations that cure faster or at lower temperatures. OMICURE® U-35 N provides the longest room temperature shelf life among CVC substituted ureas. The micronized version is OMICURE® U-35M N. While less efficient than aromatic ureas by weight, it achieves cures in about one hour at 115°C and under seven minutes at temperatures of 150°C or higher. Suggested use levels are up to 5 phr, with cure times depending on formulation and application.

OMICURE® U-405, an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. The addition of OMICURE® U-405 to these formulations produces shelf-stable one-part products that cure in shorter times and/or at lower temperatures. OMICURE® U-405M represents the micronized grade of OMICURE® U-405. OMICURE® U-405 is most similar in structure to monuron and diuron. However, OMICURE® U-405 does not contain any chlorine and is, therefore, safer to use than monuron or diuron. When substituting OMICURE® U-405 for either of these products, the formulator should use approximately 30%-50% less 94 to achieve similar degrees of acceleration. Suggested use levels of OMICURE U-405 are <5 phr. At 100 °C, cures can be obtained in about one hour and in less than four minutes at temperatures at 150 °C. Cure times are dependent on the composition of the formulated product and your end application. Some of the factors that can affect shelf life are formulation ingredients and compounding parameters. Ingredients in which OMICURE® U-405 is insoluble at processing and storage temperatures will enhance overall storage stability. OMICURE® U-405 can be incorporated into your formulation concurrent with the DICY addition.

OMICURE® U 405 M EX is a powder product designed for industrial applications. It functions as an ACCELERATOR in industrial additives, enhancing performance and efficiency in various formulations.

OMICURE® U 405 N is an aromatic substituted urea used as a latent ACCELERATOR for dicyandiamide-cured epoxy resins, shortening cure times and temperatures for shelf-stable one-part products. The micronized OMICURE® U-405M N is chlorine-free and safer than Monuron and Diuron. Use levels are ≤ 5 phr, with curing in about 1 hour at 100°C and under 4 minutes at ≥150°C. Shelf life improves with insoluble ingredients and OMICURE® U-405 N can be added with dicy in formulations.

OMICURE® U 52M, an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide (DICY) cure of epoxy resins. OMICURE® U 52M represents the micronized grade of OMICURE® U 52. Suggested use levels of OMICURE® U 52/OMICURE® U 52M in DGEBA/DICY are ≤ 5 phr. At 5 phr, curing can be accomplished in about one hour at 100°C and in less than five minutes at temperatures ≥ 150°C. Room temperature shelf lives (doubling of viscosity) are longer than six months. Cure times and shelf lives depend on the composition of the formulated product and the end application. Some of the factors that can affect shelf life include formulation ingredients and compounding parameters. Ingredients in which OMICURE® U 52/OMICURE® U 52M are insoluble at processing and storage temperatures will enhance overall storage stability.

OMICURE® U 52 M EX is a powder product designed for industrial applications. It functions as an ACCELERATOR in industrial additives, improving performance and efficiency in various formulations.

OMICURE® U 410 M N is an aromatic substituted urea used as a latent ACCELERATOR for the dicyandiamide cure of epoxy resins, reducing cure time and temperature. It provides the greatest acceleration but may slightly reduce room temperature shelf life and Tg. OMICURE® U-410M cures faster than OMICURE® U-24M with minimal impact on Tg. Suggested use levels are and lt; 5 phr, with curing in about 30 minutes at 100°C and 3 minutes at and gt;150°C. It offers a room temperature shelf life of and gt;3 months with and lt;1 phr and can be incorporated with dicy in formulations.