OMICURE® DDA 5

OMICURE® DDA 5 CI EX is an ultra-micronized grade of Dicyandiamide, a solid latent curing agent for epoxy resins. OMICURE® DDA 5 CI EX, like other grades of Dicy, is dispersed into a resin system where it remains stable until activated by heat. Without an accelerator, such as a substituted urea, dicyandiamide has an activation temperature of about 175°C and a formulated storage stability of over six months. When catalyzed with a latent accelerator, like one of the OMICURE® U series of substituted ureas, one component adhesive and sealant formulas can be prepared with cure temperatures of 100- 120°C and excellent stability. The ultra-fine particle size of OMICURE DDA 5 CI EX will help to aid good dispersion, prevent settling, maximize reactivity, promote uniform cure to formulated systems, and avoid issues of ‘hot spots’. Epoxy systems cured with OMICURE® DDA 5 CI EX are characterized by outstanding adhesion making it a preferred choice for adhesive formulations. OMICURE® DDA 5 CI EX is compatible with all epoxy resins, including Bisphenol A and F epoxies and epoxy novolacs, can be used with diluted or undiluted resins, and is compatible with a wide variety of fillers and pigments. OMICURE® DDA 5 CI EX is safe to handle and is considered non-toxic.