OMICURE® DDA 10

OMICURE ® DDA 10, like other grades of Dicy, is dispersed into a resin system where it remains stable until activated by heat. Without an accelerator, such as a substituted urea, dicyandiamide has an activation temperature of about 350 °F and a formulated storage stability of over six months. When catalyzed with a latent accelerator, like one of the OMICURE ® U series of substituted ureas, onecomponent adhesive and sealant formulas can be prepared with cure temperatures of 225-250 °F and excellent stability. The fine particle size of OMICURE ® DDA 10 will help aid good dispersion, prevent settling, and promote uniform cure to formulated systems without worry of ‘hot spots.’ Epoxy systems cured with OMICURE ® DDA 10 are characterized by outstanding adhesion, making it a preferred choice for adhesive formulations. OMICURE ® DDA 10 is compatible with all epoxy resins, including bisphenol A and F epoxies and epoxy novolacs, can be used with diluted or undiluted resins, and is compatible with a wide variety of fillers and pigments. OMICURE ® DDA 10 is safe to handle and is considered nontoxic.

• One-component adhesives
• Epoxy powder coatings
• Prepregs, composites, and film adhesives
• Electronic potting and encapsulating compounds

OMICURE® DDA 10 should be stored in a dry place, in the sealed original containers, at temperatures below 50°C (122°F). Under these storage conditions, the product has a shelf life of 24 months (from date of manufacture). The products should not be exposed to direct sunlight.