Brands

ARADUR® curing agents are supplied in liquid or solid form and can be used in conjunction with ARALDITE® epoxy resins to achieve a broad range of thermal, mechanical and electrical properties. This complete line of high-performance curing agents includes reactive polyamides, polyamido amines, aliphatic amines, cycloaliphatic amines, aromatic amines, anhydrides and novolacs.

The ARALDITE® brand encompasses high-performance epoxy, acrylic, and polyurethane adhesives and high-performance specialty epoxy and benzoxazine resin systems. ARALDITE® adhesives cover a broad range of applications and offer both production and performance benefits to industrial, consumer and construction markets. ARALDITE® specialty thermoset resins are supplied in liquids or solids, and in a range of viscosities, functionalities and epoxy equivalent weights for a wide range of industrial applications, while ARALDITE® specialty epoxy resins are typically based on bisphenol-A, bisphenol-F, phenol novolacs, cresol novolacs, amino phenol, methylene dianiline, cycloaliphatics, and isocyanuric acid.

The ARATHANE® brand represents high performance epoxy and polyurethane systems for use in encapsulation and insulation applications for electronic components, the impregnation of electro composites, and as an adhesive in other markets.

ERISYS® epoxy functional reactive modifiers enhance performance, reduce viscosity, and improve handling and processing of epoxy formulations. Their benefits include enhanced flexibility and toughness, while maintaining chemical resistance and UV stability. Some of the products are high in bio-renewal content.

OMICURE® curing agents, accelerators and catalysts are one-part epoxies which are important to many industries for lightweight, high-performance composites. These additives accelerate cure speed and lower cure temperature in one-part epoxy systems.

PROBIMER® laser direct imaging materials are designed for electronic applications. They provide unique, proprietary binder technology that has been optimized for advanced photo speed, high-resolution and high image accuracy for the production of High-Density Interconnect (HDI) fine-pitch BGA boards. They offer high-registration accuracy and tight clearance in LDI processing.

VERSAMID® polyamide resins have proven to be superior curing agents in many applications, such as industrial maintenance and marine coatings, high-performance architectural paints, high-solids, and conventional coatings.