Brands

Huntsman accelerators are commonly used in combination with ARALDITE® epoxy resins, ARADUR® hardeners and JEFFAMINE® polyetheramines to accelerate the reaction rate of epoxy thermoset systems. Properly used accelerators can be an integral part of fine-tuning the reactivity of slower reacting resin formulations and can also serve to beneficially influence properties such as glass transition temperature (Tg), modulus, strength, elongation at break, and chemical resistance.

AGOMET® adhesives are methyl methacrylate-based adhesives that offer good adhesion to metals, thermoset composites and most thermoplastics. AGOMET® adhesives offer a choice of simple processing methods at room temperature with minimum surface preparation. The adhesives offer a wide range of curing speeds and cured mechanical properties from rigid to flexible.

ARADUR® curing agents are supplied in liquid or solid form and can be used in conjunction with ARALDITE® epoxy resins to achieve a broad range of thermal, mechanical and electrical properties. This complete line of high-performance curing agents includes reactive polyamides, polyamido amines, aliphatic amines, cycloaliphatic amines, aromatic amines, anhydrides and novolacs.

The ARALDITE® brand encompasses high-performance epoxy, acrylic, and polyurethane adhesives and high-performance specialty epoxy and benzoxazine resin systems. ARALDITE® adhesives cover a broad range of applications and offer both production and performance benefits to industrial, consumer and construction markets. ARALDITE® specialty thermoset resins are supplied in liquids or solids, and in a range of viscosities, functionalities and epoxy equivalent weights for a wide range of industrial applications, while ARALDITE® specialty epoxy resins are typically based on bisphenol-A, bisphenol-F, phenol novolacs, cresol novolacs, amino phenol, methylene dianiline, cycloaliphatics, and isocyanuric acid.

The ARATHANE® brand represents high performance epoxy and polyurethane systems for use in encapsulation and insulation applications for electronic components, the impregnation of electro composites, and as an adhesive in other markets.

ARA® XTREME resins are very low-viscosity, high-functionality and high-purity, amine-based resins with relatively good storage stability. They cure very rapidly to produce products having exceptionally high-heat deflection temperatures and high crosslinking density.

AVALON® TPU grades enable casual, sport, leisure, and professional footwear manufacturers to develop tough yet comfortable shoes in a variety of designs and colors. Also used as molded parts for industrial, transportation and consumer goods applications.

We offer high-purity, low-trace metal E-GRADE® amines, including quaternary amines, amine oxides, and solvents for formulation into semiconductor chip manufacturing including formulated cleaning, etching, and stripping. Our E-GRADE® unit, located at our manufacturing site in Conroe, Texas, provides the global supply footprint, R&D expertise, and broad portfolio to help meet the stringent quality process standards of the semiconductor industry – from blending, purification through cleanroom packaging.

EPALLOY® specialty epoxy resins deliver improved performance in high-performance maintenance and marine coatings, adhesives, encapsulants and composites. These specialty epoxy resins provide better chemical resistance, thermal performance, modulus, cure speed and UV resistance than standard liquid epoxy resins.

Our high-performance EPIBOND® adhesives for aerospace and automotive applications provide superior joining and bonding solutions for plastics, metals, composite materials and other substrates. EPIBOND® adhesives offer productivity and manufacturing process improvements, as well as reductions in weight over other fastening methods. Additionally, manufacturers can select adhesives that are flame retardant, resistant to fatigue, chemicals and temperatures, and with mechanical properties that vary from rigid to flexible and offer long-term durability. Our products are specified in numerous OEM applications ranging from interior parts such as seats, lavatories, overhead bins, galleys and monuments to exterior parts such as nacelles, landing gear doors and control surfaces.

EPOCAST® high-performance epoxy edge and void fillers are designed for reinforcing honeycomb composite panels in aircraft floors, galley walls, overhead bins, bulkheads and more. These products are available in self-extinguishing or flame-retardant versions to meet FAA regulations. EPOCAST® void fillers are produced in a range of densities to meet a variety of performance and handling requirements. Many of our edge sealing materials feature easy-to-apply viscosities, as well as sag-resistance properties for use on vertical surfaces. EPOCAST® laminating systems are designed for use in the manufacturing and repair of composite radomes, fairings, flight control surfaces, and cargo/cabin panels. These systems offer excellent mechanical strength and many are flame-retardant.

ERISYS® epoxy functional reactive modifiers enhance performance, reduce viscosity, and improve handling and processing of epoxy formulations. Their benefits include enhanced flexibility and toughness, while maintaining chemical resistance and UV stability. Some of the products are high in bio-renewal content.

HYPRO® Reactive Liquid Polymer is a low molecular weight synthetic rubber with chemical functionality. These reactive additives incorporate rubber properties into epoxies, acrylates, vinyl esters and polyesters. They improve the toughness and low-temperature properties in coatings, adhesives, sealants and composites. HYPRO® reactive liquid polymers are butadiene homo-polymers and butadiene-acrylonitrile copolymers with terminal functionality.

IROGRAN® is a specialized, polyester-based thermoplastic polyurethane (TPU) grade material used in extrusion and injection molding applications, including cable and wire, hoses and tubes, film and sheet, seals and other technical parts.