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Featured Products
EPIBOND®
EPIBOND® 315 A/B
EPIBOND® 315 A/B Adhesive is an extrudable, two-component, room-temperature curing epoxy adhesive designed for service temperatures up to 400°F (204°C). This product is suitable for bonding a wide variety of materials, such as metals, composites, and many other dissimilar substrates. The combination of high shear strength and compression makes this adhesive well-suited for aerospace applications and composites requiring a liquid shim. EPIBOND® 315 A/B offers rapid strength build-up with an easy-to-process mix ratio.
Applications: Aerospace & Aviation
Product Families: 2K Liquid Reactive Adhesives, Structural Adhesives
Chemical Family: Epoxy & Epoxy Derivatives