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Huntsman Brand
18 Products
found on Huntsman
Huntsman
EPIBOND® 8000 FR A/B
RTU Product Type:
Structural Adhesive, 2K (2 component) Adhesive, Epoxy Adhesive, Fire Retardant
Application Area:
Aerospace Interior Application, Vertical Application, Honeycomb Panel
Compatible Substrates & Surfaces:
Composites, Metal
Features:
Wide Service Temperature Range, Pumpable, Thixotropic, Easy To Apply, Easy to Mix, High Peel Strength, High Shear, Flame Retardant, Non-Sagging, Good Gap Filling Capabilities, Low Halogen Content
EPIBOND® 8000 A/B is an extrudable two-component epoxy structural adhesive designed for applications requiring FST properties or flame retardancy (FAR 25.853). This adhesive is suitable for bonding a wide variety of composite materials, metal, and other dissimilar substrates. EPIBOND® 8000 A/B does not contain any halogenated or antimony-based flame retardant additives. This adhesive has a convenient mix ratio, moderate work life, and is easily dispensed from cartridges or metering equipment.
Huntsman
EPIBOND® 8543 C/B
RTU Product Type:
Epoxy Adhesive, Syntactic Adhesive, Structural Adhesive
Applications:
Aerospace Interior Application
Regulatory & Compliance:
Boeing BMS 5-123, Type 1, Class 3
EPIBOND® 8543-C / B epoxy adhesive is an extremely fast-setting system for quick repair and bonding applications, even at colder temperatures. At 77°F (25°C), bonded parts may be handled in 10 minutes and will develop high strength within one hour. EPIBOND® 8543-C / B epoxy adhesive is supplied in contrasting colors. Complete mixing is indicated by a uniform gray color. This product is qualified to BMS 5-123, Type 1, Class 3.
Huntsman
EPIBOND® 315M A/B
RTU Product Type:
Epoxy Adhesive, Structural Adhesive, 2K (2 component) Adhesive, Conductive Adhesive
Chemical Family:
Epoxy & Epoxy Derivatives
Applications:
Space Shuttle, Spacecraft, Composites, Space Mission Applications, Electrostatic Application, Metal, Satellite
EPIBOND® 315M A/B is a two-component epoxy adhesive that contains MIRALON® carbon nanotube pulp for decreased electrical resistance for ESD applications. This product is suitable for bonding a wide variety of materials such as metals, composites, and other dissimilar substrates.
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