Brands

The ARALDITE® brand encompasses high-performance epoxy, acrylic, and polyurethane adhesives and high-performance specialty epoxy and benzoxazine resin systems. ARALDITE® adhesives cover a broad range of applications and offer both production and performance benefits to industrial, consumer and construction markets. ARALDITE® specialty thermoset resins are supplied in liquids or solids, and in a range of viscosities, functionalities and epoxy equivalent weights for a wide range of industrial applications, while ARALDITE® specialty epoxy resins are typically based on bisphenol-A, bisphenol-F, phenol novolacs, cresol novolacs, amino phenol, methylene dianiline, cycloaliphatics, and isocyanuric acid.

The ARATHANE® brand represents high performance epoxy and polyurethane systems for use in encapsulation and insulation applications for electronic components, the impregnation of electro composites, and as an adhesive in other markets.

The POLYRESYST™ family of products comprises adhesive systems, polyurea systems and priming systems for multiple applications.

Huntsman’s building blocks and POLYRESYST™ coatings systems are developed to protect substrates used across numerous applications, industries an environment.

We provide a broad variety of options (Polyurethane, Polyurea or Hybrid systems) that can cover the physical properties you need. In combination with proper surface preparation, this can make them ideal for all kinds of materials and many applications.

Huntsman offers also a complete range of high-performance POLYRESYST™ polyurethane adhesives and specialty components for multiple applications. From indoor to outdoor, floor to roof you can rely on us to deliver strong and lasting solutions able to suit your requirements.

Our offering includes:

• Wood adhesives - for structural support
• Panel adhesives - for advanced lamination
• 3K mortars - for improved compatibility
• Binders - for durable recycling

PROBIMER® laser direct imaging materials are designed for electronic applications. They provide unique, proprietary binder technology that has been optimized for advanced photo speed, high-resolution and high image accuracy for the production of High-Density Interconnect (HDI) fine-pitch BGA boards. They offer high-registration accuracy and tight clearance in LDI processing.