Brands

ARA® Cool curing agents open new opportunities to formulate industrial coatings with very fast cure, even in cold conditions. The launch of the new ARA® Cool range enables Huntsman to meet demands for faster processing at low temperatures, as well as reduced VOC emissions. ARA® Cool products produce coatings with low blush, chemical resistance and excellent film aesthetics. These products can be formulated with a variety of Huntsman ARALDITE® resins.

ARA® XTREME resins are very low-viscosity, high-functionality and high-purity, amine-based resins with relatively good storage stability. They cure very rapidly to produce products having exceptionally high-heat deflection temperatures and high crosslinking density.

ARADUR® curing agents are supplied in liquid or solid form and can be used in conjunction with ARALDITE® epoxy resins to achieve a broad range of thermal, mechanical and electrical properties. This complete line of high-performance curing agents includes reactive polyamides, polyamido amines, aliphatic amines, cycloaliphatic amines, aromatic amines, anhydrides and novolacs.

The ARALDITE® brand encompasses high-performance epoxy, acrylic, and polyurethane adhesives and high-performance specialty epoxy and benzoxazine resin systems. ARALDITE® adhesives cover a broad range of applications and offer both production and performance benefits to industrial, consumer and construction markets. ARALDITE® specialty thermoset resins are supplied in liquids or solids, and in a range of viscosities, functionalities and epoxy equivalent weights for a wide range of industrial applications, while ARALDITE® specialty epoxy resins are typically based on bisphenol-A, bisphenol-F, phenol novolacs, cresol novolacs, amino phenol, methylene dianiline, cycloaliphatics, and isocyanuric acid.

EPALLOY® specialty epoxy resins deliver improved performance in high-performance maintenance and marine coatings, adhesives, encapsulants and composites. These specialty epoxy resins provide better chemical resistance, thermal performance, modulus, cure speed and UV resistance than standard liquid epoxy resins.

ERISYS® epoxy functional reactive modifiers enhance performance, reduce viscosity, and improve handling and processing of epoxy formulations. Their benefits include enhanced flexibility and toughness, while maintaining chemical resistance and UV stability. Some of the products are high in bio-renewal content.

HYPOX® elastomer-modified epoxies enhance fracture toughness, low-temperature mechanical properties, impact/crack/chip resistance, peel strength and/or the flexibility of epoxy coatings, adhesives, sealants, and composites. HYPOX®️ RF and RM elastomer-modified, low-viscosity epoxy resins combine high-elastomer content with the convenience of handling epoxy resins.

PHENOXY™ resins serve as performance-enhancing additives for epoxy systems and in select thermoplastic applications. They promote adhesion and improve performance in coatings for difficult-to-adhere-to substrates, such as glass and polished metals. They serve as a strengthening enhancer in carbon fiber composites, as well as promote flexibility and boost chemical resistance in industrial and transportation applications.

PROBIMER® laser direct imaging materials are designed for electronic applications. They provide unique, proprietary binder technology that has been optimized for advanced photo speed, high-resolution and high image accuracy for the production of High-Density Interconnect (HDI) fine-pitch BGA boards. They offer high-registration accuracy and tight clearance in LDI processing.

REN® branded materials such as RENLAM®, RENGEL®, RENINFUSION® and RENPIM® encompass a wide range of composites and tooling products that enhance the performance of epoxy resins in industrial and manufacturing applications, ensuring optimal strength, durability, and resistance. They are most often used in high-performance environments and are easy to mix and apply.

TACTIX® specialty epoxy resins are designed for special applications. Our TACTIX® product range is typically based on bisphenol-A, tri(hydroxphenyl) methane and dicyclopentadiene.