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Huntsman is a global, differentiated, and specialty chemicals company. For more than 50 years, we have been using science and ingenuity to innovate and create products that enable more sustainable and comfortable lives for millions of people around the world. From our research and development scientists and technical service teams to our sales and customer service professionals, we are dedicated to helping you find the right material solutions to your most pressing technical challenges.

E-GRADE® 3-methyl-2-oxazolidinone (E-GRADE® MEOX) is primarily used in stripping, cleaning, and wet etching formulations in the semiconductor, display, and PCB industries. Most are water-soluble and contain aminoglycol or polyether structures where both the amine and glycol functions contribute to their performance. The range of primary, secondary, and tertiary amines and structures allows the selection of base strength and corrosion rates based on the needs of the application.

E-GRADE® 3-methyl-2-oxazolidinone (E-GRADE® MEOX)

E-GRADE® THEMAH provides safer handling alternatives to tetramethylammonium hydroxide (TMAH). Both are strong, metal ion-free organic bases suited for etching silicon and for photoresist developing and stripping applications. In addition, Huntsman has developed a library of many new experimental quaternary ammonium compounds (quats), enabling a range of products for different applications. These are available in aqueous and solvent-based formulations. Huntsman’s platform of TMAH alternatives is being developed with the aspiration of providing less toxic alternatives to TMAH for the next generation of semiconductor cleans.

E-GRADE® THEMAH

TEROL® 518 is a modified aromatic polyester polyol.

TEROL® 518

EPIBOND® 315 A/B Adhesive is an extrudable, two-component, room-temperature curing epoxy adhesive designed for service temperatures up to 400°F (204°C). This product is suitable for bonding a wide variety of materials, such as metals, composites, and many other dissimilar substrates. The combination of high shear strength and compression makes this adhesive well-suited for aerospace applications and composites requiring a liquid shim. EPIBOND® 315 A/B offers rapid strength build-up with an easy-to-process mix ratio.

EPIBOND® 315 A/B

Diethylenetriamine (DETA) is a linear ethyleneamine containing two primary nitrogens and one secondary nitrogen. DETA is a single-component product that is clear and colorless, with an ammonia-like odor.

Diethylenetriamine (DETA)

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OMICURE® curing agents, accelerators and catalysts are one-part epoxies which are important to many industries for lightweight, high-performance composites. These additives accelerate cure speed and lower cure temperature in one-part epoxy systems.

OMICURE®

The ARATHANE® brand represents high performance epoxy and polyurethane systems for use in encapsulation and insulation applications for electronic components, the impregnation of electro composites, and as an adhesive in other markets.

ARATHANE®

AIROUT™

KRYSTALSLIM

Our high-performance EPIBOND® adhesives for aerospace and automotive applications provide superior joining and bonding solutions for plastics, metals, composite materials and other substrates. EPIBOND® adhesives offer productivity and manufacturing process improvements, as well as reductions in weight over other fastening methods. Additionally, manufacturers can select adhesives that are flame retardant, resistant to fatigue, chemicals and temperatures, and with mechanical properties that vary from rigid to flexible and offer long-term durability. Our products are specified in numerous OEM applications ranging from interior parts such as seats, lavatories, overhead bins, galleys and monuments to exterior parts such as nacelles, landing gear doors and control surfaces.

EPIBOND®

IROGRAN® is a specialized, polyester-based thermoplastic polyurethane (TPU) grade material used in extrusion and injection molding applications, including cable and wire, hoses and tubes, film and sheet, seals and other technical parts.

IROGRAN®

HYPRO® Reactive Liquid Polymer is a low molecular weight synthetic rubber with chemical functionality. These reactive additives incorporate rubber properties into epoxies, acrylates, vinyl esters and polyesters. They improve the toughness and low-temperature properties in coatings, adhesives, sealants and composites. HYPRO® reactive liquid polymers are butadiene homo-polymers and butadiene-acrylonitrile copolymers with terminal functionality.

HYPRO®

<p>The TEROL® family of polyester polyols are a critical component in the production of MDI-based polyurethane insulation systems – the most effective insulants available in the market, as measured by R-value. Insulation products based on TEROL® polyols include polyisocyanurate (PIR), boardstock systems (PUR), spray polyurethane foam (SPF) and pour-in-place applications, including entry doors, garage doors, coolers, refrigerators and commercial freezers.<br>
A proprietary process enables the use of waste PET (polyethylene terephthalate) bottles, that may have been destined for landfills or found their way into oceans, in the production of TEROL® polyols. Both pre-consumer and post-consumer sources of PET are used.<br>
Advantages of TEROL® polyols:</p>

<ul>
	<li>PET content / renewable resource content</li>
	<li>Improved fire properties from high aromatic content</li>
	<li>High functionality for improved physical property performance and fast de-mold times</li>
	<li>Specifically formulated for use with a wide range of blowing agents</li></ul>


TEROL®

HYPOX® elastomer-modified epoxies enhance fracture toughness, low-temperature mechanical properties, impact/crack/chip resistance, peel strength and/or the flexibility of epoxy coatings, adhesives, sealants, and composites. HYPOX®️ RF and RM elastomer-modified, low-viscosity epoxy resins combine high-elastomer content with the convenience of handling epoxy resins.

HYPOX®

ARALDITE® CW 2245 N is a liquid resin designed for encapsulation and industrial additive functions. It is ideal for battery and electronic materials technologies, particularly in electrical and electronics markets.

ARALDITE® CW 2245 N

ARALDITE® MY 720 is a tetrafunctional epoxy resin suitable for high-performance composite applications. Cured at 120°C (250°F) to 175°C (350°F), Araldite® MY 720 provides outstanding performance characteristics at elevated temperatures. When post-cured at 200°C (400°F), the system exhibits properties exceeding 220°C (430°F). Araldite® MY 720 systems can display Tgs.

ARALDITE® MY 720

ACCELERATOR DY 5196 is a colorless liquid hardener from the industrial additives family. It has a slight odor and is used to enhance curing processes in various applications.

ACCELERATOR DY 5196

ARALDITE® LY 1555 is a liquid thermoset resin designed for industrial applications. It functions as a resin, binder, and matrix material in composite materials. The resin is immiscible and insoluble in water, ensuring strong and reliable performance in various industrial processes.

ARALDITE® LY 1555

ERISYS® GE 6 is a liquid epoxy-based binder and resin used as an industrial additive in epoxy resins, belonging to the chemical family of epoxy derivatives and glycidyl ethers.

ERISYS® GE 6

ARALDITE® AW 136H / HARDENER HY 991 is a multipurpose, two-component, room-temperature curing, viscous liquid adhesive with high strength and toughness. It is suitable for bonding a wide variety of metals, ceramics, and many other substrates in common use.

ARALDITE® AW 136H / HARDENER HY 991

NYCHEM® MCP 710

XCN SF HY 24-2 is a liquid industrial additive used in electrical insulation applications. It supports industries such as electrical and electronics, power, and utilities, offering reliable performance in chemical mixtures and blends for enhanced electrical component functionality.

XCN SF HY 24-2

ARALDITE® PY 307-1 epoxy resin is an unmodified, low-viscosity epoxy phenol novolac resin recommended for solvent-free and high-solids coatings. Having an average functionality greater than two, it is a true multifunctional epoxy resin. Due to this functionality, it provides a high crosslink density when properly cured with a variety of hardeners. Thus, coatings based on Araldite®PY 307-1 epoxy resin exhibit excellent chemical and thermal resistance, superior to coatings based on conventional epoxy resins.  Araldite®PY 307-1 epoxy resin is also compatible in all proportions with liquid bisphenol-A and bisphenol-F epoxy resins, providing possibilities for formulating solvent-free and high solids coatings.

ARALDITE® PY 307-1

Huntsman

Huntsman Corporation uses science and ingenuity to create innovations that play a critical role in the everyday lives of many millions of people. The company’s products are used in a diverse range of 

E-GRADE®

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E-GRADE® Morpholine is primarily used in stripping, cleaning, and wet etching formulations in the semiconductor, display, and PCB industries. Most are water-soluble and contain aminoglycol or polyether structures where both the amine and glycol functions contribute to their performance. The range of primary, secondary, and tertiary amines and structures allows the selection of base strength and corrosion rates based on the needs of the application.

E-GRADE® Morpholine

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Huntsman - E-GRADE Morpholine - Amines - Metal Removal - High Purity

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	Value	Units	Test Method / Conditions
pH	11.0	-

	Value	Units	Test Method / Conditions
Boiling Point	129.0 °C	°C
Molecular Weight	87.0 g/mol	g/mol
Viscosity	2.0 cSt	cSt