E-GRADE® THEMAH

E-GRADE® THEMAH provides safer handling alternatives to tetramethylammonium hydroxide (TMAH). Both are strong, metal ion-free organic bases suited for etching silicon and for photoresist developing and stripping applications. In addition, Huntsman has developed a library of many new experimental quaternary ammonium compounds (quats), enabling a range of products for different applications. These are available in aqueous and solvent-based formulations. Huntsman’s platform of TMAH alternatives is being developed with the aspiration of providing less toxic alternatives to TMAH for the next generation of semiconductor cleans.

Functions: Cleaning Agent, Solvent

Chemical Family: Chemical Mixtures & Blends

End Uses: Printed Circuit Boards, Semiconductor, ̇Photoresists

Applicable Processes: Chemical Mechanical Planarization (CMP), Etching Applications, Photoresist Strippers Manufacturing, Semiconductor Etching

Features: Control Ferrous Metal Corrosion, Ease of Processing, Excellent Dispersibility, Good Solubility, High Purity, High pH, Low Corrosion, Low Trace Metals, Low Volatility, Reduced Processing Time

Safety Data Sheet
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Identification & Functionality

Chemical Family
Chemical Mixtures & Blends
Function
Solvent,Cleaning Agent
Industrial Additives Functions
Cleaning Agent,
Solvent
Technologies
Industrial Additives & Materials
Product Families
Industrial Additives & Materials — Battery & Electronic Materials
Electronic Chemicals

Features & Benefits

Industrial Additives Features
Control Ferrous Metal Corrosion,
Ease of Processing,
Excellent Dispersibility,
Good Solubility,
High Purity,
High pH,
Low Corrosion,
Low Trace Metals,
Low Volatility,
Reduced Processing Time
Product Features
  • Organic base
  • High purity, low trace metal
  • TMAH replacement
  • Available at 45 wt%
  • Water or solvent based
  • Low metal corrosion
  • CMP slurries and pCMP cleans
  • PERR

Applications & Uses

Applicable Processes
Chemical Mechanical Planarization (CMP),
Etching Applications,
Photoresist Strippers Manufacturing,
Semiconductor Etching
Industrial Additives End Use
Printed Circuit Boards,
Semiconductor,
̇Photoresists
Markets
Electrical & Electronics
Applications
Electrical & Electronics — Parts & Components
Printed Circuit Boards (PCBs),
Semiconductor Manufacturing

Properties

Physical Form
Liquid
Soluble In
Water Soluble

Regulatory & Compliance

Chemical Inventories
DSL (Canada),
ENCS (Japan),
IECSC (China),
KECI (Korea),
TCSI (Taiwan),
TSCA (USA)

Technical Details & Test Data

Test Data

  • Cu wafer treated with E-GRADE® THEMAH demonstrated smoother surface compared to Cu treated with TMAH. (pH 12.8, 30°C for 30 min)

  • Silicon wafers, treated with E-GRADE® THEMAH, demonstrate significant reductions in reflectivity and improvement in uniformity when compared to wafers treated with TMAH.
  • This texturization reduces light reflection and improves absorption for photovoltaic devices.
pH - Concentration Dependence

Alkalinity: TMAH > Choline > THEMAH

TiN Etch with Hydrogen Peroxide

  • At appropriate pH and concentration, E-GRADE® THEMAH with H₂O₂ can be used for titanium nitride (TiN) strip (etch rate >20 nm/min), which offers wider and more controllable strip rate window comparing to TMAH.

Packaging & Availability

Regional Availability
  • Global

Other

Appearance (SDS)
Liquid
Color (SDS)
Colorless
Odor (SDS)
Amine like
Chemical Properties
ValueUnitsTest Method / Conditions
pH12.9-
Physical Properties
ValueUnitsTest Method / Conditions
Molecular Weight181.0 g/molg/mol