E-GRADE® THEMAH

E-GRADE® THEMAH provides safer handling alternatives to tetramethylammonium hydroxide (TMAH). Both are strong, metal ion-free organic bases suited for etching silicon and for photoresist developing and stripping applications. In addition, Huntsman has developed a library of many new experimental quaternary ammonium compounds (quats), enabling a range of products for different applications. These are available in aqueous and solvent-based formulations. Huntsman’s platform of TMAH alternatives is being developed with the aspiration of providing less toxic alternatives to TMAH for the next generation of semiconductor cleans.

Functions: Cleaning Agent, Solvent

Chemical Family: Chemical Mixtures & Blends

End Uses: Printed Circuit Boards, Semiconductor, ̇Photoresists

Applicable Processes: Chemical Mechanical Planarization (CMP), Etching Applications, Photoresist Strippers Manufacturing, Semiconductor Etching

Features: Ease of Processing, Good Solubility, High Purity, High pH, Low Corrosion, Low Trace Metals, Low Volatility, Reduced Processing Time

    Enhanced TDS

    Identification & Functionality

    Chemical Family
    Chemical Mixtures & Blends
    Function
    Solvent,Cleaning Agent
    Industrial Additives Functions
    Cleaning Agent,
    Solvent
    Technologies
    Industrial Additives & Materials
    Product Families
    Industrial Additives & Materials — Battery & Electronic Materials
    Electronic Chemicals

    Features & Benefits

    Industrial Additives Features
    Ease of Processing,
    Good Solubility,
    High Purity,
    High pH,
    Low Corrosion,
    Low Trace Metals,
    Low Volatility,
    Reduced Processing Time
    Product Features
    • Organic base
    • High purity, low trace metal
    • TMAH replacement
    • Available at 45 wt%
    • Water or solvent based
    • Low metal corrosion
    • CMP slurries and pCMP cleans
    • PERR

    Applications & Uses

    Applicable Processes
    Chemical Mechanical Planarization (CMP),
    Etching Applications,
    Photoresist Strippers Manufacturing,
    Semiconductor Etching
    Industrial Additives End Use
    Printed Circuit Boards,
    Semiconductor,
    ̇Photoresists
    Markets
    Electrical & Electronics
    Applications
    Electrical & Electronics — Parts & Components
    Printed Circuit Boards (PCBs),
    Semiconductor Manufacturing

    Properties

    Physical Form
    Liquid
    Soluble In
    Water Soluble

    Regulatory & Compliance

    Chemical Inventories
    ENCS (Japan),
    IECSC (China),
    KECI (Korea),
    TCSI (Taiwan),
    TSCA (USA)

    Technical Details & Test Data

    TiN Etch with Hydrogen Peroxide

    • At appropriate pH and concentration, E-GRADE® THEMAH with H₂O₂ can be used for titanium nitride (TiN) strip (etch rate >20 nm/min), which offers wider and more controllable strip rate window comparing to TMAH.
    Test Data

    • Cu wafer treated with E-GRADE® THEMAH demonstrated smoother surface compared to Cu treated with TMAH. (pH 12.8, 30°C for 30 min)

    • Silicon wafers, treated with E-GRADE® THEMAH, demonstrate significant reductions in reflectivity and improvement in uniformity when compared to wafers treated with TMAH.
    • This texturization reduces light reflection and improves absorption for photovoltaic devices.
    pH - Concentration Dependence

    Alkalinity: TMAH > Choline > THEMAH

    Packaging & Availability

    Regional Availability
    • Global

    Other

    Appearance (SDS)
    Liquid
    Color (SDS)
    Colorless
    Odor (SDS)
    Amine like
    Chemical Properties
    ValueUnitsTest Method / Conditions
    pH12.9-
    Physical Properties
    ValueUnitsTest Method / Conditions
    Molecular Weight181.0 g/molg/mol