E-GRADE® THEMAH

E-GRADE® THEMAH provides safer handling alternatives to tetramethylammonium hydroxide (TMAH). Both are strong, metal ion-free organic bases suited for etching silicon and for photoresist developing and stripping applications. In addition, Huntsman has developed a library of many new experimental quaternary ammonium compounds (quats), enabling a range of products for different applications. These are available in aqueous and solvent-based formulations. Huntsman’s platform of TMAH alternatives is being developed with the aspiration of providing less toxic alternatives to TMAH for the next generation of semiconductor cleans.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

Product Functions: Cleaning Agent, Solvent

Chemical Family: Chemical Mixtures & Blends

Product End Uses: Chemical Mechanical Planarization (CMP), Etching, Photoresist Stripper, Photoresists, Printed Circuit Board (PCB), Semiconductor Etching, Semiconductors

Product Features: Ease of Processing, Good Solubility, High Purity, High pH, Low Corrosion, Low Trace Metals, Low Volatility, Reduces Processing Time

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Enhanced TDS

Identification & Functionality

Chemical Family
Chemical Mixtures & Blends
Function
Solvent,Cleaning Agent
Product Functions
Cleaning Agent,
Solvent
Technologies
Industrial Additives & Materials
Product Families
Industrial Additives & Materials — Battery & Electronic Materials
Electronic Chemicals

Features & Benefits

Product Features
Ease of Processing,
Good Solubility,
High Purity,
High pH,
Low Corrosion,
Low Trace Metals,
Low Volatility,
Reduces Processing Time
Product Features
  • Organic base
  • High purity, low trace metal
  • TMAH replacement
  • Available at 45 wt%
  • Water or solvent based
  • Low metal corrosion
  • CMP slurries and pCMP cleans
  • PERR

Applications & Uses

Product End Uses
Chemical Mechanical Planarization (CMP),
Etching,
Photoresist Stripper,
Photoresists,
Printed Circuit Board (PCB),
Semiconductor Etching,
Semiconductors
Markets
Electrical & Electronics
Applications
Electrical & Electronics — Parts & Components
Printed Circuit Boards (PCBs),
Semiconductor Manufacturing

Properties

Physical Form
Liquid
Soluble In
Water Soluble

Regulatory & Compliance

Chemical Inventories
ENCS (Japan),
IECSC (China),
KECI (Korea),
TCSI (Taiwan),
TSCA (USA)

Technical Details & Test Data

pH - Concentration Dependence

Alkalinity: TMAH > Choline > THEMAH

TiN Etch with Hydrogen Peroxide

  • At appropriate pH and concentration, E-GRADE® THEMAH with H₂O₂ can be used for titanium nitride (TiN) strip (etch rate >20 nm/min), which offers wider and more controllable strip rate window comparing to TMAH.
Test Data

  • Cu wafer treated with E-GRADE® THEMAH demonstrated smoother surface compared to Cu treated with TMAH. (pH 12.8, 30°C for 30 min)

  • Silicon wafers, treated with E-GRADE® THEMAH, demonstrate significant reductions in reflectivity and improvement in uniformity when compared to wafers treated with TMAH.
  • This texturization reduces light reflection and improves absorption for photovoltaic devices.

Packaging & Availability

Regional Availability
  • Global

Other

Appearance (SDS)
Liquid
Color (SDS)
Colorless
Odor (SDS)
Amine like
Chemical Properties
ValueUnitsTest Method / Conditions
pH12.9-
Physical Properties
ValueUnitsTest Method / Conditions
Molecular Weight181.0g/mol