PROBIMER® 77-7179 / Hardener 77-7180

• Two-component-system, semi-matte surface
• High resolution
• Excellent small hole developability with high aspect ratio
• Optimized for long hold times between individual process steps
• Wide process windows offer high flexibility
• Excellent chemical, electrical and physical end properties
• Fulfills the requirements of IPC SM-840, classes H&T
• Corresponds to the requirements of well-known OEMs
• High comparative index (CTI) and high dielectric strength
• Excellent adhesion of conformal coatings
• High resistance with aggressive post solder mask processes
• Ideally suited for SIT process (Second Image Transfer)

• High resolution
• Excellent small hole developability with high aspect ratio
• Wide drying window
• Long hold times after drying and exposure
• High comparative tracking index (CTI)
• High dielectric strength
• Excellent adhesion of legend inks and conformal coatings
• High resistance with aggressive post solder mask processes
• Well proven for applications in automotive and mobile PCB

• High resolution
• Excellent small hole developability with high aspect ratio
•  Wide drying window
•  Long hold times after drying and exposure
•  High comparative tracking index (CTI)
•  High dielectric strength
•  Excellent adhesion of legend inks and conformal coatings
•  High resistance with aggressive post solder mask processes
•  Well proven for applications in automotive and mobile PCB

• Two-component-system, semi-matte surface
• High resolution
•  Excellent small hole developability with high aspect ratio
• Optimized for long hold times between individual process steps
• Wide process windows offer high flexibility
• Excellent chemical, electrical and physical end properties
• Fulfills the requirements of IPC SM-840, classes H&T
• Corresponds to the requirements of well-known OEMs
• High comparative index (CTI) and high dielectric strength
•  Excellent adhesion of conformal coatings
• High resistance with aggressive post solder mask processes
• Ideally suited for SIT process (Second Image Transfer)

Exposure: A hold time prior to exposure is not necessary. The spectral sensitivity is in the range of 350 - 420 nm. The exposure time depends on the parameters for the developing step.

In order to reach best results the following room requirements should be respected:

1. Room Temperature: 22 ±2 °C (71.6 ± 35.6 °F)
2. Relative Humidity 50 ± 5%
3. Cleanroom Class 100’000
4. Overpressure Cleanroom + 3 mm WS

After thermal curing, we recommend UV curing of 1000–2000 mJ/cm2 for increased chemical resistance.

A hold time prior to exposure is not necessary. The spectral sensitivity is in the range of 350 - 420 nm. The exposure time depends on the parameters for the developing step.

In case of mishandling during exposure, such as mis-registration, boards can be stripped at 60-80 °C (140-176 °F) with 10% NaOH solution.

• PROBIMER® 77 7179/7180 Solder Mask is applied to printed wiring boards using vertical or horizontal screen printing equipment. Monofilament polyester mesh in the range of 32-43 (mesh/cm) or 80-110 (mesh/inch) is recommended.

Thermal curing is required to ensure optimal properties in the cured film. It can be done in a standard convection oven.

After curing PROBIMER® lacquers exhibit extremely high chemical resistance and, thus, cannot be easily removed without damaging the board.

A flash-off time of 10 minutes or more before drying is recommended. To achieve good performance in resolution, developability of small holes and resistance to finishing processes, the coated boards must be dried according to the following parameters:

• Thoroughly mix these two components for 10-15 minutes. Mixing should be done with gentle mechanical stirring or shaking. High shear mixing must be avoided in order to prevent entrapment of large amounts of air, which can cause bubbles and poor leveling of printed coating.
• Hold time of 30 min before use is recommended after ink mixing. In specific cases a diluent may be added. We recommend a maximum dilution of 3% with Dipropyleneglycolmonomethylether (DPM).

A hold time prior to exposure is not necessary. The spectral sensitivity is in the range of 350 - 420 nm. The exposure time depends on the parameters for the developing step.

• For a good adhesion of the lacquer we recommend chemical and/or mechanical pre-cleaning. Hold times prior to coating have to be minimized, since oxidation may impair the adhesion of the lacquer. Only completely dried boards should be coated, this has to be ensured especially for boards with small holes or blind vias.

Pot Life: At room temperature the ready-to-use mixture has a pot life of 3 days. (Definition of pot life is related to increased dwell time in developer.)

Pre-Cleaning: For a good adhesion of the lacquer we recommend chemical and/or mechanical pre-cleaning. Hold times prior to coating have to be minimized, since oxidation may impair the adhesion of the lacquer. Only completely dried boards should be coated, this has to be ensured especially for boards with small holes or blind vias.

Screen Printing: PROBIMER® 77-7179 / 7180 is applied to printed wiring boards using vertical or horizontal screen printing equipment. Monofilament polyester mesh in the range of 32-43 (mesh/cm) or 80-110 (mesh/inch) is recommended.

UV Cure

• After thermal curing, we recommend UV curing of 1000–2000 mJ/cm2 for increased chemical resistance.

Legend Inks and Conformal Coatings

• In general, legend inks and conformal coatings exhibit good to excellent adhesion to boards coated with Probimer 77 7179/7180 Solder Mask. However, due to the large variety of available products preliminary trials are strongly recommended.

Production Release Trials

• A variety of flow agents, soldering machines and soldering techniques as well as cleaning processes are used to mount components on circuit boards. Adjustment of the processing parameters and design guidelines to ensure optimal use of solder masks leads to the best overall results. Users should carry out their own tests prior to release for production runs.

Inspection and Stripping: In case of mishandling during exposure, such as mis-registration, boards can be stripped at 60-80 ℃ (140-176 ℉) with 10% NaOH solution.

Thermal curing is required to ensure optimal properties in the cured film. It can be done in a standard convection oven.

After curing Probimer lacquers exhibit extremely high chemical resistance and, thus, cannot be easily removed without damaging the board.

Room Requirements on Working Environment: In order to reach best results the following room requirements should be respected:

• Room Temperature: 20 - 24 ℃
• Relative Humidity: 45 - 55%
• Cleanroom Class: 100’000
• Overpressure Cleanroom: + 3 mm WS
• UV blocked light

Ink Mixing: Thoroughly mix these two components for 10-15 minutes. Mixing should be done with gentle mechanical stirring or shaking. High shear mixing must be avoided in order to prevent entrapment of large amounts of air, which can cause bubbles and poor leveling of printed coating. Hold time of 30 min before use is recommended after ink mixing. In specific cases a diluent may be added. We recommend a maximum dilution of 3% with Dipropyleneglycolmonomethylether (DPM).

Developing: The areas of unexposed PROBIMER® 77-7179 / 7180 should be developed in a continuous spray developing line. Developing is carried out in a 0.8-1.2% Na2CO3 aqueous alkaline solution.

Flash-off / Drying: A flash-off time of 10 minutes or more before drying is recommended. To achieve good performance in resolution, developability of small holes and resistance to finishing processes, the coated boards must be dried according to the following parameters:

• PROBIMER® lacquers are complex chemical compounds. To ensure that thesemproducts exhibit consistent quality in application we recommend storage under thefollowing conditions:

1.  PROBIMER® 77/7179 Solder Mask in original container at 5-25 °C (41-77 °F)
2.  Hardener 77/7180 Solder Mask in original containers at 5-25 °C (41-77 °F)

Probimer lacquers are complex chemical compounds. To ensure that these products exhibit consistent quality in application we recommend storage under the following conditions:

• Probimer® 77/7179 Solder Mask in original container at 5-25 ℃ (41-77 ℉)
• Hardener 77/7180 Solder Mask in original containers at 5-25 ℃ (41-77 ℉)

Under ‘EXP’ on the package label, the expiry date is indicated. Within this period the product should be used.

• At room temperature the ready-to-use mixture has a pot life of 3 days. (Definition of pot life is related to increased dwell time in developer.)

PROBIMER® 77-7179 / 7180 contain flammable solvents. Contact with heat, spark and open flame is hazardous.