PROBIMER® 88-92101 / HARDENER 88-99001

• Two-component-system, semi-matt surface
• High resolution and definition
• Wide process windows offer high flexibility
• Excellent chemical, electrical and physical end properties
• Fulfills the requirements of IPC SM-840-E, classes H & T
• Corresponds to the requirements of well-known OEMs
• High resistance with aggressive post solder mask metal finishes

• Green semi-matt version
• High thermal cycling resistance
• High thermal aging resistance
• Halogen-free exceeds JPCA Standard
• Low drying temperature level
• No leaching in final finishing chemistries
• High resistance with aggressive post solder mask processes
• High resolution in bar code laser process
• Excellent small hole developability with high aspect ratio
• Excellent performance in e-corrosion resistance

• Two-component-system, semi-matt surface
• High resolution and definition
• Wide process windows offer high flexibility
• Excellent chemical, electrical and physical end properties
• Fulfills the requirements of IPC SM-840-E, classes H & T
• Corresponds to the requirements of well-known OEMs

Flash-off/Drying: A flash-off time of 30 minutes before drying is recommended. To achieve good performance in resolution, developability of small holes and resistance to finishing processes the coated boards must be dried according to the following parameters

A maximum hold time of 24 hours between drying and development has to be complied.

Processing Information: In order to reach best results the following room requirements should be respected:

• Room Temperature: 20 - 24 ℃
• Relative Humidity: 45 - 55%
• Cleanroom Class: 100000
• Overpressure Cleanroom: + 3 mm WS
• UV blocked light

Ink Mixing: Thoroughly mix the resin component and the hardener component for 10-15 minutes. Mixing can be done by hand with a spatula or with gentle mechanical stirring. High shear mixing must be avoided in order to prevent entrapment of large amounts of air, which can cause bubbles and poor levelling of the printed coating. Hold the mixed content for at least 30 min for debubbling before use. In specific cases, to avoid coating bubbles between high copper tracks diluent may be added. The viscosity is preferably adjusted to 140~160 dpa.s in this case. We recommend a maximum dilution of 5% with Dipropyleneglycolmonomethylether (DPM).

Pot Life: At room temperature the ready-to-use mixture has a pot life of 1 day. (Definition of pot life is related to increased dwell time in developer.)

Pre-Cleaning: For a good adhesion of the lacquer we recommend chemical and/or mechanical pre-cleaning. Hold times prior to coating have to be minimized, since oxidation may impair the adhesion of the lacquer. Only completely dried boards should be coated, this has to be ensured especially for boards with small holes or blind vias.

Screen Printing: Probimer 88 / 92101 is applied to printed wiring boards using vertical or horizontal screen printing equipment. The recommended dry film thickness is 20-25µm. Monofilament polyester mesh in the range of 32-43 (mesh/cm) or 80-110 (mesh/inch) .

Developing: The areas of unexposed Probimer 88 / 92101 should be developed in a continuous spray developing line. Developing is carried out in a 1.0 % sodium carbonate aqueous alkaline solution

Thermal curing is required to ensure optimal properties in the cured film. It can be done in a standard convection oven.

Exposure: A hold time prior to exposure is not necessary. The spectral sensitivity is in the range of 350 - 420 nm. The exposure time depends on the parameters for the developing step.

Inspection and Stripping: In case of mishandling during exposure, such as mis-registration, boards can be stripped at 60-80°C (140-176 °F) with 10% NaOH solution. After thermal cure the boards could be stripped in 50% KOH at 60-80 °C (140-176 °F) for approx. 60 minutes.

A hold time prior to exposure is not necessary. The spectral sensitivity is in the range of 350 - 420 nm. The exposure time depends on the parameters for the developing step.

Production Release Trials: A variety of flow agents, soldering machines and soldering techniques as well as cleaning processes are used to mount components on circuit boards. Adjustment of the processing parameters and design guidelines to ensure optimal use of solder masks leads to the best overall results. Users should carry out their own tests prior to release for production runs.

Thermal curing is required to ensure optimal properties in the cured film. It can be done in a standard convection oven.
 

The areas of unexposed PROBIMER® 88 / 92101 should be developed in a continuous spray developing line. Developing is carried out in a 1.0 % Na2CO3 aqueous alkaline solution.
 

Room Requirements on Working Environment

A flash-off time of 30 minutes before drying is recommended. To achieve good performance in resolution, developability of small holes and resistance to finishing processes the coated boards must be dried according to the following parameters:
 

A maximum hold time of 24 hours between drying and development has to be complied.

For a good adhesion of the lacquer we recommend chemical and/or mechanical pre-cleaning. Hold times prior to coating have to be minimized, since oxidation may impair the adhesion of the lacquer. Only completely dried boards should be coated, this has to be ensured especially for boards with small holes or blind vias.

At room temperature the ready-to-use mixture has a pot life of 1 day. (Definition of pot life is related to increased dwell time in developer.)

PROBIMER® lacquers are complex chemical compounds. To ensure that these products exhibit consistent quality in application we recommend storage under the following conditions: PROBIMER® 88 / 92101 in original container at 5-25°C (41-77 °F) Hardener 88 / 99001 in original container at 5-25°C (41-77 °F) Under ‘EXP’ on the package label, the expiry date is indicated. Within this period the product should be used.

Probimer lacquers are complex chemical compounds. To ensure that these products exhibit consistent quality in application we recommend storage under the following conditions:

• PROBIMER® 88-92101 in original container at 5-25 ℃ (41-77 ℉)
• PROBIMER® 88-99001 in original containers at 5-25 ℃ (41-77 ℉)

Under ‘EXP’ on the package label, the expiry date is indicated. Within this period the product should be used.