ARALDITE® 2014 A/B is a two-component, room temperature curing, thixotropic paste adhesive with high strength and excellent chemical resistance. It is used for bonding metals, electronic components, GRP structures, and many other items exposed to higher than normal temperatures or more aggressive environments. Its low outgassing makes it suitable for specialist electronic telecommunications and aerospace applications.
The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.
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