Products

EPALLOY® 5000 resin is the diepoxide of the hydrogenated bisphenol A. Due to its saturated ring structure, this resin will find utility in applications requiring resistance to ultraviolet light exposure. Formulations based on standard DGEBA resins usually do not perform well in this environment. Curing agent selection should be done with great care to achieve optimum weathering resistance with EPALLOY® 5000 resin. Products with improved chalking resistance and gloss retention can be formulated. EPALLOY® 5000 resin exhibits a significantly lower viscosity than DGEBA. Higher filler loadings can, therefore, be achieved, resulting in cost reduction and reduced shrinkage. The adhesion and chemical resistance characteristics of EPALLOY® 5000 resin formulations are expected to be like those of standard DGEBA systems.

EPALLOY® 5001 N Resin is a hydrogenated bisphenol-A epoxy resin with improved chalking resistance and gloss retention to achieve optimal weathering resistance. Formulations based on EPALLOY® 5001 N Resin show improved cure speeds of up to 50% compared to the standard epoxidized hydrogenated bisphenol-A, EPALLOY® 5000 Resin. EPALLOY® 5001 N Resin shows improved adhesion and hardness development while maintaining low yellowing and excellent UV resistance. It contains no unsaturation or aromatic structures, providing excellent resistance to outdoor weathering. Cycloaliphatic amines are the recommended curing agents to achieve optimum weathering resistance, while aromatic compounds or acids should be avoided as they may reduce UV resistance.

EPALLOY® 5200 Resin is a difunctional cycloaliphatic glycidyl ester based on hexahydrophthalic anhydride. It is a low-viscosity resin primarily designed for use with anhydride curing agents in electrical insulation applications. Because it is fully aliphatic, it is well-suited to withstand sun and UV exposure in outdoor use. When cured with accelerated anhydride curing agents, glass transition temperatures in excess of 110°C can be attained.

EPALLOY® 7192 N is an unmodified, high-molecular-weight bisphenol-A-based epoxy resin that is a semisolid material at room temperature. It is particularly well-suited for use in formulating durable high-solids coatings, toughened adhesives, laminating resins, and prepreg molding compounds. Compared to lower-molecular-weight epoxy resins, it provides faster cure, improved adhesion, more durable cured systems, and enhanced toughness, though with somewhat reduced high-temperature performance.

EPALLOY® 8220 is a low-viscosity, epoxidized bisphenol-F resin that provides low hydrolyzable chloride content, a high degree of reactivity, and outstanding chemical resistance. EPALLOY® 8220 resin contains no diluent and is compatible with all standard curatives and most resin systems and solvents.

EPALLOY® 8230 N resin is a very low-viscosity epoxidized bisphenol-F resin that combines low hydrolyzable chlorides with a high degree of reactivity and outstanding chemical resistance. It is non-crystallizing and compatible with all standard curatives and most resin systems and solvents.

EPALLOY® 8240 is a liquid used in coatings and markings and paints and coatings applications. It is designed for use in CASE (coatings, adhesives, sealants, and elastomers) technologies, providing essential performance features for various industrial processes in the coatings sector.

EPALLOY® 8240 MIBK 90 N is a liquid that is slightly soluble in water. It is used in various industrial applications, particularly in coatings and related sectors, providing specific performance properties for processing and formulation needs.

EPALLOY® 8250 CI exhibits a very low room temperature viscosity. Close process control produces a resin significantly lower in viscosity than other commercially available epoxy novolacs of similar functionality. EPALLOY® 8250 CI combines low hydrolyzable chlorides with good reactivity. It is non-crystallizing and compatible with all standard curatives and most epoxy resin systems and solvents. Because of its low viscosity, EPALLOY® 8250 CI is an excellent resin for formulating 100% solids coatings and trowelable flooring. Those formulations will cure at room temperature and provide chemical resistance to concentrated acids and aggressive solvents. EPALLOY® 8250 CI is also the preferred resin for use in electronic encapsulation, laminating and film adhesives.

EPALLOY® 8330 MAK 80 is a liquid used in coatings and markings and paints and coatings applications. It is slightly soluble in water and is designed for use in CASE (coatings, adhesives, sealants, and elastomers) technologies, providing essential performance features for various industrial processes in the coatings sector.

EPALLOY® 8350 MEK 85 N resin is a solution of a high-functionality, high-viscosity epoxidized phenol novolac resin, supplied at 85% solids in methyl ethyl ketone (MEK). When cured, formulations containing EPALLOY® 8350 MEK 85 N resin offer improved chemical resistance and higher glass transition temperatures compared to formulations with lower functionality epoxy resins.

EPALLOY® 9000 is a 3.0-functional epoxy resin based on tris-hydroxyphenyl ethane, exhibiting very low melt viscosity. It is designed for applications requiring high-temperature performance. At room temperature, EPALLOY® 9000 is a clear glass, which becomes a viscous liquid at mildly elevated temperatures, making it suitable for bonding, coating, sealing, and filling applications. Its high functionality and aromatic character produce very hard cured compositions with excellent thermal and chemical resistance. Additionally, EPALLOY® 9000 can enhance tensile, flexural, and compressive strength in epoxy formulations.

EPOXY CURING AGENT ECA 29 is a mixture of aliphatic polyamines derived from ethylenediamine and has an AHEW (amine-hydrogen equivalent weight) in the range of 36-38. Consisting of higher oligomers of TETA (triethylenetetramine), EPOXY CURING AGENT ECA 29 amine may be particularly useful as an epoxy curing agent in applications where higher Tg (glass transition temperature) and reasonably fast reactivity are needed with longer pot-life than DETA or TETA hardeners. As illustrated by the following figure, the increasingly fast gel times with standard bisphenol A based epoxies of the ethyleneamine series EDA (AHEW = 15.03), DETA (AHEW = 20.6), and TETA (AHEW = 24.4) are attributable to their increasing functionality and to them being aliphatic amines. For these three amines, the gel times shorten through the series, even though their AHEWs are increasing, which decreases the concentration of reactants in stoichiometric mixtures. As might be expected, the amines with higher AHEW, and therefore lower amine group concentrations in the formulations, have somewhat lower maximum exotherm temperatures. EPOXY CURING AGENT ECA 29 amine follows this trend of having a slightly lower exotherm temperature, however it provides a longer working time until gelation than do the lower functionality amines DETA or TETA. This is attributed to the higher proportion of secondary amino groups in this product. The high functionality of this amine also increases the level of crosslinking in the fully cured epoxy, resulting in a relatively high Tg of 143°C.

ERISYS® GE-10 CI, epoxidized ortho cresol, is a low-viscosity, aromatic mono-epoxide. It is intended for use as a reactive diluent for high-viscosity epoxy resins. ERISYS® GE-10 CI is compatible at all concentrations with these resins, and resin/diluent blends can be cured using any epoxy resin curing agent.

ERISYS® GE 10 EX is an epoxidized ortho cresol used as a reactive diluent for high-viscosity epoxy resins. It provides minimal change to the performance properties of diluted formulations, reduces crystallization, and is ideal for environmentally challenging applications like floor coatings and concrete repair.