Products

Amine C-8 is a clear, dark amber liquid obtained as a co-product from a commercial continuous operation. It is composed primarily of a mixture of aliphatic and heterocyclic mono- and diamines. The morpholinyl ring is the dominant heterocyclic group present, and the oxyethylene linkage appears frequently in the various compounds. Amine C8 is completely miscible with water.

Amine C-9 is a clear, dark amber liquid obtained as a co-product from a commercial continuous operation. It is composed primarily of a mixture of tertiary alkanolamines. Amine C9 is completely miscible with water.

Aminoethylpiperazine - HP (AEP - HP) is a cyclic ethylene amine. It contains one primary, one secondary, and one tertiary amine. AEP is a single-component product that is clear, colorless, and has an ammonia-like odor.

Aminopropyldiethanolamine (APDEA) is a single-ingredient chemical from the amines family, known for its specific applications in various industrial processes.

Aminopropylmonomethylethanolamine (APMMEA) is a clear, low viscosity liquid with a high flash point and mild odor. It provides optimum pH control, emulsion stability, and enhanced pigment dispersion, making it ideal for low odor paint formulations. Its low freezing point (-40°C) improves freeze-thaw stability.

Aminopropylmorpholine (APM) is an alkylalkanol amine typically used as an epoxy accelerator or curing agent. It also serves as an intermediate in coatings applications.

BOND 1308 / HARDENER 15AX is a tough, two-component system that is well suited for a broad range of filter bonding applications. The high-strength epoxy adhesive features good stability in the presence of heat as well as flexural and compressive stresses. Bond 1308 resin/hardener systems bond well to metals and plastics. In addition to performing as adhesives, the products are suitable for use in potting and encapsulating applications.

BOND 1308 / HARDENER 95A6 is a tough, two-component system that is well suited for a broad range of filter bonding applications. The high-strength epoxy adhesive features good stability in the presence of heat as well as flexural and compressive stresses. Bond 1308 resin/hardener systems bond well to metals and plastics. In addition to performing as adhesives, the products are suitable for use in potting and encapsulating applications.

BOND 1308 / HARDENER 95A6 Triple Blue is a tough, two-component system that is well suited for a broad range of filter bonding applications. The high-strength epoxy adhesive features good stability in the presence of heat as well as flexural and compressive stresses. Bond 1308 resin/hardener systems bond well to metals and plastics. In addition to performing as adhesives, the products are suitable for use in potting and encapsulating applications.

CAPCURE® 3-800 is a mercaptan (-SH) terminated liquid curing agent that imparts rapid-cure characteristics to epoxy resins when combined with selected amines. These systems are unique in offering rapid cure rates at low temperatures and in thin films.

CAPCURE® 3830-81 is a liquid curing agent insoluble in water, used as an industrial additive for curing applications.

CAPCURE® 40 SEC HV is a water-soluble liquid curing agent used as an industrial additive in curing applications.

CG-1305 Resin/Hardener epoxy syntactic is a medium-density, pourable material for aircraft production and other industrial applications requiring high strength and low weight. This system combines good handling and good physical properties. CG-1305 Resin/Hardener epoxy syntactic is designed for reinforcing high stress areas in honeycomb structures and for potting applications. CG-1305 Resin / Hardener epoxy syntactic is qualified to BMS 5-28, Type 7, Class 3.

CR MY 700 is a liquid processing additive used in industrial applications. It is insoluble in water, providing effective performance in various industrial processes that require reliable additives for processing.

E-GRADE® Choline Hydroxide is a clear aqueous solution with a high pH and a mild odor. It has a very low corrosion rate on copper and other metallic surfaces and has been demonstrated to effectively remove both positive and negative photoresists. The product is an effective replacement for TMAH and is available in higher concentrations than TMAH in both water and organic solvents (for R&D). The combination of low corrosion rates, photoresist removal, etching, and lower toxicity makes E-GRADE® Choline Hydroxide an effective, safer-to-handle alternative to TMAH in next-generation semiconductor cleans, with performance enhancements such as faster photoresist removal rates and selective metal removal rates.