Products

ERISYS® GE 11, epoxidized para-tertiary butyl phenol, is an aromatic mono-epoxide. GE-11 is intended for use as a reactive diluent for high-viscosity epoxy resins and is compatible at all concentrations with those resins. Resin/diluent blends can be cured using any curing agent for epoxy resins.

ERISYS® GE 20 reactive diluent is an epoxidized neopentyl glycol, a low-viscosity, aliphatic diepoxide. It is designed as a reactive diluent for high-viscosity epoxy resins, compatible at all concentrations, and can be cured with any epoxy resin curing agent.

ERISYS® GE 21 epoxidized butanediol is a low-viscosity, aliphatic diepoxide used as a reactive diluent for high-viscosity epoxy resins. It is compatible at all concentrations and can be cured with any epoxy resin curing agent.

ERISYS® GE 22 CI, epoxidized cyclohexanedimethanol, is a low-viscosity, cycloaliphatic diepoxide. It is intended for use as a reactive diluent for high-viscosity epoxy resins. ERISYS® GE 22 CI is compatible at all concentrations with these resins, and resin/diluent blends can be cured using any epoxy resin curing agent.

ERISYS® GE 22 EX CI is a low-viscosity, cycloaliphatic diepoxide, epoxidized cyclohexanedimethanol. It is used as a reactive diluent for high-viscosity epoxy resins and is compatible at all concentrations. Resin/diluent blends can be cured with any epoxy resin curing agent.

ERISYS® GE 24 Polyglycol Diglycidyl Ether is the diepoxide of an aliphatic polyglycol. Its low viscosity, relatively high equivalent weight, and aliphatic structure suggest use as a diluent and/or flexibilizer in high-viscosity, brittle epoxy formulations. As a diluent, ERISYS® GE 24 Polyglycol Diglycidyl Ether lowers viscosity for improved substrate wetting and/or higher filler loading. As a flexibilizer, it improves elongation, peel strength, resistance to thermal cycling, and impact. Depending on the concentration, the final formulation may experience some decrease in chemical and/or heat resistance.

ERISYS® GE 25 Diluent, epoxidized 1,6-Hexanediol, is a low-viscosity, aliphatic diepoxide. It is intended for use as a reactive diluent for high-viscosity epoxy resins. ERISYS® GE 25 Diluent is compatible at all concentrations with the resins and resin/diluent blends, and can be cured using any epoxy resin curing agent.

ERISYS® GE 35 N is a liquid epoxy-based binder and resin used as an industrial additive in epoxy resins.

ERISYS® GE 35H N resin is a special grade of the triglycidyl ether of castor oil. It is a low-viscosity polyepoxide resin that imparts flexibility, impact resistance, and thermal shock resistance to epoxy formulations.

ERISYS® GE 5 is a liquid binder from Huntsman's ERISYS® series, belonging to the chemical family of epoxy and epoxy derivatives, specifically glycidyl ethers. It is designed for use in epoxy resins, enhancing their performance in various industrial applications

ERISYS® GE 6 is a liquid epoxy-based binder and resin used as an industrial additive in epoxy resins, belonging to the chemical family of epoxy derivatives and glycidyl ethers.

ERISYS® GE 60, epoxidized sorbitol, is an aliphatic multifunctional epoxy resin. This resin imparts higher reactivity and crosslink density to epoxy resin formulations. Additionally, ERISYS® GE-60 can be used to crosslink acid-functional polyurethane and acrylic resins for improved chemical resistance in UV-resistant coatings.

ERISYS® GS-110, the monoglycidyl ester of neodecanoic acid, can be used as a diluent for high-viscosity epoxy resins. GS-110 has a low viscosity, low vapor pressure, and a less irritating odor than other low-viscosity monofunctional diluents. As with all monofunctional aliphatic epoxides, increasing levels of GS-110 in epoxy resins will lengthen gel times and modify cured properties. Some decrease in thermal and chemical resistance and modulus may occur.

ERISYS® GS 120 diluent is a diepoxide of a long-chain aliphatic dimer acid, used as a reactive additive to increase flexibility in rigid epoxy systems. It reduces viscosity, improves filler loading, and enhances toughness, impact, and thermal shock resistance, though with a slight sacrifice in elevated temperature performance and chemical resistance.

ERISYS® RDGE N-1 resin is a very low-viscosity aromatic diepoxide, primarily used as a reactive modifier in epoxy formulations. It is compatible with all epoxy resin curing agents, offering formulators flexibility in curing agent selection due to its high reactivity.