Products

Aminopropylmorpholine (APM) is an alkylalkanol amine typically used as an epoxy ACCELERATOR or curing agent. It also serves as an intermediate in coatings applications.

CG-1305 Resin/Hardener epoxy syntactic is a medium-density, pourable material for aircraft production and other industrial applications requiring high strength and low weight. This system combines good handling and good physical properties. CG-1305 Resin/Hardener epoxy syntactic is designed for reinforcing high stress areas in honeycomb structures and for potting applications. CG-1305 Resin / Hardener epoxy syntactic is qualified to BMS 5-28, Type 7, Class 3.

DALTOPIR® FR is a liquid elastomer-based material used in building envelope and roofing, building materials, cold-chain and insulation, and industrial applications. It functions as a resin, binder, and matrix material in composite materials, offering high durability for foam insulation and other demanding applications.

DALTOPIR® HFR is commonly used in combination with SUPRASEC® 2085 polymeric MDI, to produce PIR foam for the manufacturing of composite panels by a continuous lamination process. When using DALTOPIR® polyol formulated system, panel producers can achieve a smooth PIR foam processing. Combined with a suitable process and panel design, the resulting composite panel with this specific PIR foam core helps panel producers to achieve both Reaction to fire and Resistance to fire classifications. Foam made with DALTOPIR® HFR 33354 polyol formulated system can be used for thicknesses ranging from 30 mm up to 200 mm, for both wall and roof profiles. To ensure long term adhesion and durability, the use of a primer is required.

DALTOPIR® PRIM is a primer for PIR cores for fire-rated composite panels.

DALTOPIR® XHFR is commonly used in combination with SUPRASEC® 2085 polymeric MDI, to produce high index PIR foam for the manufacturing of composite panels by a continuous lamination process. The polyol blend contains up to 20% recycled content as defined in ISO 14021 and can allow for smooth foam processing and reduced foam friability like conventional Huntsman composite panel systems.

DALTOPUR® FR is a fire-rated polyurethane (PUR) insulation technology designed to improve the manufacture and performance of composite sandwich panels.

Diethylenetriamine (DETA) is a linear ethyleneamine containing two primary nitrogens and one secondary nitrogen. DETA is a single-component product that is clear and colorless, with an ammonia-like odor.

EPALLOY® 5000 resin is the diepoxide of the hydrogenated bisphenol A. Due to its saturated ring structure, this resin will find utility in applications requiring resistance to ultraviolet light exposure. Formulations based on standard DGEBA resins usually do not perform well in this environment. Curing agent selection should be done with great care to achieve optimum weathering resistance with EPALLOY® 5000 resin. Products with improved chalking resistance and gloss retention can be formulated. EPALLOY® 5000 resin exhibits a significantly lower viscosity than DGEBA. Higher filler loadings can, therefore, be achieved, resulting in cost reduction and reduced shrinkage. The adhesion and chemical resistance characteristics of EPALLOY® 5000 resin formulations are expected to be like those of standard DGEBA systems.

EPALLOY® 8220 is a low-viscosity, epoxidized bisphenol-F resin that provides low hydrolyzable chloride content, a high degree of reactivity, and outstanding chemical resistance. EPALLOY® 8220 resin contains no diluent and is compatible with all standard curatives and most resin systems and solvents.

EPALLOY® 8230 N resin is a very low-viscosity epoxidized bisphenol-F resin that combines low hydrolyzable chlorides with a high degree of reactivity and outstanding chemical resistance. It is non-crystallizing and compatible with all standard curatives and most resin systems and solvents.

EPALLOY® 8250 CI exhibits a very low room temperature viscosity. Close process control produces a resin significantly lower in viscosity than other commercially available epoxy novolacs of similar functionality. EPALLOY® 8250 CI combines low hydrolyzable chlorides with good reactivity. It is non-crystallizing and compatible with all standard curatives and most epoxy resin systems and solvents. Because of its low viscosity, EPALLOY® 8250 CI is an excellent resin for formulating 100% solids coatings and trowelable flooring. Those formulations will cure at room temperature and provide chemical resistance to concentrated acids and aggressive solvents. EPALLOY® 8250 CI is also the preferred resin for use in electronic encapsulation, laminating and film adhesives.

EPALLOY® 9000 is a 3.0-functional epoxy resin based on tris-hydroxyphenyl ethane, exhibiting very low melt viscosity. It is designed for applications requiring high-temperature performance. At room temperature, EPALLOY® 9000 is a clear glass, which becomes a viscous liquid at mildly elevated temperatures, making it suitable for bonding, coating, sealing, and filling applications. Its high functionality and aromatic character produce very hard cured compositions with excellent thermal and chemical resistance. Additionally, EPALLOY® 9000 can enhance tensile, flexural, and compressive strength in epoxy formulations.

EPOCAST® 1618-D / B epoxy syntactic is a low-density, flame-retardant compound for potting fasteners in honeycomb structures. The lightweight epoxy is easy to extrude through a 1/8 in (3 mm) nozzle orifice but is non-flowing after application. Epocast® 1618 D/B epoxy syntactic sets quickly at room temperature and is qualified to BMS 5-28, Type 18, Class 1. It is the suggested alternative for the discontinued Epocast® 1616 A/B epoxy syntactic, Epocast® 1618 A/B epoxy syntactic, and Epocast® 1620 A/B epoxy syntactic systems.

EPOCAST® 1619-1 A/B is a low-density, flame-retardant compound for potting fasteners in honeycomb structures. The lightweight epoxy can be poured or extruded through a 1/8 in. (3mm) nozzle orifice. It is resistant to water, fungus, and most aircraft fluids and qualified for Boeing BMS5-28, Type 19