Products

E-GRADE® Sulfolane is a liquid processing aid used in automotive, transportation and semiconductor manufacturing applications. It offers effective performance in various industrial processes, providing support in specific chemical and material processing tasks.

E-GRADE® THEMAH provides safer handling alternatives to tetramethylammonium hydroxide (TMAH). Both are strong, metal ion-free organic bases suited for etching silicon and for photoresist developing and stripping applications. In addition, Huntsman has developed a library of many new experimental quaternary ammonium compounds (quats), enabling a range of products for different applications. These are available in aqueous and solvent-based formulations. Huntsman’s platform of TMAH alternatives is being developed with the aspiration of providing less toxic alternatives to TMAH for the next generation of semiconductor cleans.

E-GRADE® Tetraethylenepentamine (E-GRADE® TEPA) is primarily used in stripping, cleaning, and wet etching formulations in the semiconductor, display, and PCB industries. The range of primary, secondary, and tertiary amines and structures allows the selection of base strength and corrosion rates based on the needs of the application.

E-GRADE® Triethanolamine 75 (E-GRADE® TEA 75) is primarily used in stripping, cleaning, and wet etching formulations in the semiconductor, display, and PCB industries. Most are water-soluble and contain aminoglycol or polyether structures, where both the amine and glycol functions contribute to their performance. Huntsman also offers purification services to assist in trace metal reduction for a broad range of amines, including those not manufactured by Huntsman.

E-GRADE® Triethylenetetramine (E-GRADE® TETA) is primarily used in stripping, cleaning, and wet etching formulations in the semiconductor, display, and PCB industries. The range of primary, secondary, and tertiary amines structures allows the selection of base strength and corrosion rates based on the needs of the application.

ELASTAMINE® RE-900 is an aliphatic polyether diamine with good water solubility. The melting point of RE-900 is around room temperature, making it liquid at room temperature and easy to use. The terminal amino group of polyetheramine products has high activity, making the product suitable for modifying various polymers, such as in the polycondensation reaction of polyamide (nylon) synthesis. By introducing polyetheramine into the polymer main chain, the modified product exhibits better flexibility and hydrophilicity.

EPALLOY® 5000 resin is the diepoxide of the hydrogenated bisphenol A. Due to its saturated ring structure, this resin will find utility in applications requiring resistance to ultraviolet light exposure. Formulations based on standard DGEBA resins usually do not perform well in this environment. Curing agent selection should be done with great care to achieve optimum weathering resistance with EPALLOY® 5000 resin. Products with improved chalking resistance and gloss retention can be formulated. EPALLOY® 5000 resin exhibits a significantly lower viscosity than DGEBA. Higher filler loadings can, therefore, be achieved, resulting in cost reduction and reduced shrinkage. The adhesion and chemical resistance characteristics of EPALLOY® 5000 resin formulations are expected to be like those of standard DGEBA systems.

EPALLOY® 7192 N is an unmodified, high-molecular-weight bisphenol-A-based epoxy resin that is a semisolid material at room temperature. It is particularly well-suited for use in formulating durable high-solids coatings, toughened adhesives, laminating resins, and prepreg molding compounds. Compared to lower-molecular-weight epoxy resins, it provides faster cure, improved adhesion, more durable cured systems, and enhanced toughness, though with somewhat reduced high-temperature performance.

EPALLOY® 8225 is a liquid formaldehyde-phenol-epichlorohydrin copolymer used in various industrial applications.

ERISYS® GE 22 CI, epoxidized cyclohexanedimethanol, is a low-viscosity, cycloaliphatic diepoxide. It is intended for use as a reactive diluent for high-viscosity epoxy resins. ERISYS® GE 22 CI is compatible at all concentrations with these resins, and resin/diluent blends can be cured using any epoxy resin curing agent.

ERISYS® GS-110, the monoglycidyl ester of neodecanoic acid, can be used as a diluent for high-viscosity epoxy resins. GS-110 has a low viscosity, low vapor pressure, and a less irritating odor than other low-viscosity monofunctional diluents. As with all monofunctional aliphatic epoxides, increasing levels of GS-110 in epoxy resins will lengthen gel times and modify cured properties. Some decrease in thermal and chemical resistance and modulus may occur.

Ethyleneamine E-100 is a mixture of tetra-ethylene-pent-amine (TEPA), penta-ethylene-hexamine (PEHA), hexa-ethylene-heptamine (HEHA), and higher molecular weight products. E-100 is a complex mixture of various linear, cyclic, and branched products with a number-average molecular weight of 250-300 g/mole.

Ethyleneamine EA-300 is a polyamine mixture of tetraethylenepentamine (TEPA) and higher molecular weight ethyleneamine products. It contains linear, cyclic, and branched products with a number-average molecular weight of approximately 270 g/mole.

GABEPRO™ GPM-830 PT is a liquid curing agent used as an industrial additive in various curing processes.

GABEPRO™ GPM-895 FC hardener is a mercaptan-based epoxy hardener that provides a 40-second gel time when mixed 1:1 with standard bisphenol-A epoxy resin under ambient conditions. It improves bonds between glass and metals such as brass and bronze. Ideal for two-component mixing equipment in assembly line use, it can also function as a catalyst or co-curing agent, imparting typical mercaptan properties with enhanced adhesion.