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Huntsman

Industrial Additives & Materials
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501 Products found on Huntsman  in Industrial Additives & Materials

E-GRADE® THEMAH banner
Huntsman company logo
HuntsmanE-GRADE® THEMAH
  • Product Functions:Cleaning Agent, Solvent
  • Chemical Family:Chemical Mixtures & Blends
  • Product End Uses:Chemical Mechanical Planarization (CMP), Etching, Photoresist Stripper, Photoresists, Printed Circuit Board (PCB), Semiconductor Etching, Semiconductors
  • Product Features:Ease of Processing, Good Solubility, High Purity, High pH, Low Corrosion, Low Trace Metals, Low Volatility, Reduces Processing Time

E-GRADE® THEMAH provides safer handling alternatives to tetramethylammonium hydroxide (TMAH). Both are strong, metal ion-free organic bases suited for etching silicon and for photoresist developing and stripping applications. In addition, Huntsman has developed a library of many new experimental quaternary ammonium compounds (quats), enabling a range of products for different applications. These are available in aqueous and solvent-based formulations. Huntsman’s platform of TMAH alternatives is being developed with the aspiration of providing less toxic alternatives to TMAH for the next generation of semiconductor cleans.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

EPALLOY® 5000 banner
Huntsman company logo
HuntsmanEPALLOY® 5000
  • Chemical Family:Epoxy & Epoxy Derivatives
  • Chemical Name:Hydrogenated bisphenol-A epoxy resin
  • Product Functions:Binder, Resin, Resins, Binders & Matrix Materials
  • Product End Uses:3D Printing Applications, Civil Engineering Applications, Concrete Coating, Rail Cars, Tanks, Top Coat, UV Coating
  • CAS Number:30583-72-3
  • Processing & Application Methods:3D Printing, Stereolithography
  • Labeling Claims:Isocyanates-free, Substances of Very High Concern (SVHC) Chemicals-free, Volatile Organic Compound (VOC)-free

EPALLOY® 5000 resin is the diepoxide of the hydrogenated bisphenol A. Due to its saturated ring structure, this resin will find utility in applications requiring resistance to ultraviolet light exposure. Formulations based on standard DGEBA resins usually do not perform well in this environment. Curing agent selection should be done with great care to achieve optimum weathering resistance with EPALLOY® 5000 resin. Products with improved chalking resistance and gloss retention can be formulated. EPALLOY® 5000 resin exhibits a significantly lower viscosity than DGEBA. Higher filler loadings can, therefore, be achieved, resulting in cost reduction and reduced shrinkage. The adhesion and chemical resistance characteristics of EPALLOY® 5000 resin formulations are expected to be like those of standard DGEBA systems.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

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