Products

ARADUR® 2963-1 is a modified cycloaliphatic polyamine.

ARADUR® 2973, in combination with modified or unmodified bisphenol A and bisphenol F-based liquid epoxy resins such as ARALDITE® GY 6010, ARALDITE® GY 282, ARALDITE® PY 302-2, or ARALDITE® EPN 9850 resins, is suitable for the formulation of ambient cure, corrosion- and chemical-resistant coatings.

ARADUR® 3484 is a low-viscosity, modified polyamine adduct.

ARADUR® 350 is a polyamidoamine and polyamine-based chemical, compatible with metal, mineral substrates, steel, and wood. It is designed for use in various industrial applications requiring enhanced bonding and curing properties on these surfaces.

ARALDITE® EPN 1138 MBC is a resin technically identical to ARALDITE® EPN 1138, distinguished by its REDcert2 certification. This certification verifies that 100% of the fossil raw materials used in the production of this product have been replaced by sustainably certified biomass. In this document, the term ARALDITE® EPN 1138 refers interchangeably to both resins.

EPALLOY® 5000 resin is the diepoxide of the hydrogenated bisphenol A. Due to its saturated ring structure, this resin will find utility in applications requiring resistance to ultraviolet light exposure. Formulations based on standard DGEBA resins usually do not perform well in this environment. Curing agent selection should be done with great care to achieve optimum weathering resistance with EPALLOY® 5000 resin. Products with improved chalking resistance and gloss retention can be formulated. EPALLOY® 5000 resin exhibits a significantly lower viscosity than DGEBA. Higher filler loadings can, therefore, be achieved, resulting in cost reduction and reduced shrinkage. The adhesion and chemical resistance characteristics of EPALLOY® 5000 resin formulations are expected to be like those of standard DGEBA systems.

ERISYS® GE 10 EX is an epoxidized ortho cresol used as a reactive diluent for high-viscosity epoxy resins. It provides minimal change to the performance properties of diluted formulations, reduces crystallization, and is ideal for environmentally challenging applications like floor coatings and concrete repair.

ERISYS® GE 11, epoxidized para-tertiary butyl phenol, is an aromatic mono-epoxide. GE-11 is intended for use as a reactive diluent for high-viscosity epoxy resins and is compatible at all concentrations with those resins. Resin/diluent blends can be cured using any curing agent for epoxy resins.

ERISYS® GE 20 reactive diluent is an epoxidized neopentyl glycol, a low-viscosity, aliphatic diepoxide. It is designed as a reactive diluent for high-viscosity epoxy resins, compatible at all concentrations, and can be cured with any epoxy resin curing agent.

ERISYS® GE 21 epoxidized butanediol is a low-viscosity, aliphatic diepoxide used as a reactive diluent for high-viscosity epoxy resins. It is compatible at all concentrations and can be cured with any epoxy resin curing agent.

ERISYS® GE 22 CI, epoxidized cyclohexanedimethanol, is a low-viscosity, cycloaliphatic diepoxide. It is intended for use as a reactive diluent for high-viscosity epoxy resins. ERISYS® GE 22 CI is compatible at all concentrations with these resins, and resin/diluent blends can be cured using any epoxy resin curing agent.

ERISYS® GE 22 EX CI is a low-viscosity, cycloaliphatic diepoxide, epoxidized cyclohexanedimethanol. It is used as a reactive diluent for high-viscosity epoxy resins and is compatible at all concentrations. Resin/diluent blends can be cured with any epoxy resin curing agent.

ERISYS® GE 24 Polyglycol Diglycidyl Ether is the diepoxide of an aliphatic polyglycol. Its low viscosity, relatively high equivalent weight, and aliphatic structure suggest use as a diluent and/or flexibilizer in high-viscosity, brittle epoxy formulations. As a diluent, ERISYS® GE 24 Polyglycol Diglycidyl Ether lowers viscosity for improved substrate wetting and/or higher filler loading. As a flexibilizer, it improves elongation, peel strength, resistance to thermal cycling, and impact. Depending on the concentration, the final formulation may experience some decrease in chemical and/or heat resistance.

ERISYS® GE 25 Diluent, epoxidized 1,6-Hexanediol, is a low-viscosity, aliphatic diepoxide. It is intended for use as a reactive diluent for high-viscosity epoxy resins. ERISYS® GE 25 Diluent is compatible at all concentrations with the resins and resin/diluent blends, and can be cured using any epoxy resin curing agent.

I-BOND® MDF EM 4330 is a liquid resin used in building envelope and roofing, cold-chain and insulation, furniture, industrial, and wood applications. It serves as a binder and matrix material for composites, particularly in fiberboards, providing enhanced performance for various industrial uses.